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公开(公告)号：US09750159B2
公开(公告)日：2017-08-29
申请号：US14826421
申请日：2015-08-14
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
CPC classification number: H05K7/20318 , B23P15/26 , B23P2700/10 , H05K7/203 , H05K7/20781 , H05K7/2079 , Y10T29/49361
Abstract: Cooling apparatuses and methods of fabricating thereof are provided which facilitate pumped immersion-cooling of an electronic component(s). The cooling apparatus includes an enclosure having a compartment accommodating the electronic component(s), and dielectric fluid within the compartment at least partially immersing the electronic component(s). A liquid-cooled heat sink is associated with the enclosure to cool at least one cooling surface associated with the compartment, and facilitate heat transfer to the heat sink from the electronic component(s) via the dielectric fluid. A pump is disposed external to the compartment and in fluid communication therewith to facilitate pumped dielectric fluid flow through the compartment. The pumped dielectric fluid flow through the compartment enhances heat transfer from the electronic component(s) to the liquid-cooled heat sink via the cooling surface(s). In one implementation, the pumped dielectric fluid flow provides two-phase cooling to the electronic component(s) via flow boiling.
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公开(公告)号：US09546576B2
公开(公告)日：2017-01-17
申请号：US14829869
申请日：2015-08-19
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Milnes P. David , Dustin W. Demetriou , Roger R. Schmidt , Robert E. Simons
CPC classification number: F01K25/08 , F01K5/00 , F25B15/00 , F25B19/00 , F25B27/02 , F25B49/00 , H02P9/04 , H05K7/20709 , H05K7/20818 , H05K7/20836
Abstract: Systems and methods are provided for data center cooling by vaporizing fuel using data center waste heat. The systems include, for instance, an electricity-generating assembly, a liquid fuel storage, and a heat transfer system. The electricity-generating assembly generates electricity from a fuel vapor for supply to the data center. The liquid fuel storage is coupled to supply the fuel vapor, and the heat transfer system is associated with the data center and the liquid fuel storage. In an operational mode, the heat transfer system transfers the data center waste heat to the liquid fuel storage to facilitate vaporization of liquid fuel to produce the fuel vapor for supply to the electricity-generating assembly. The system may be implemented with the liquid fuel storage and heat transfer system being the primary fuel vapor source, or a back-up fuel vapor source.
Abstract translation: 通过使用数据中心废热汽化燃料，为数据中心冷却提供了系统和方法。 该系统包括例如发电组件，液体燃料储存器和传热系统。 发电组件从燃料蒸汽发电，供给数据中心。 液体燃料储存器连接以供应燃料蒸汽，并且传热系统与数据中心和液体燃料储存器相关联。 在操作模式中，传热系统将数据中心废热转移到液体燃料储存器，以便于液化燃料的蒸发，以产生供给发电组件的燃料蒸气。 该系统可以以液体燃料储存和传热系统为主要燃料蒸气源或备用燃料蒸气源来实施。
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公开(公告)号：US09439325B2
公开(公告)日：2016-09-06
申请号：US14058562
申请日：2013-10-21
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC: H01L23/473 , H05K7/20
CPC classification number: H05K7/2039 , H05K7/20254 , H05K7/20772
Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a coolant. The cooling apparatus includes a coolant-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a varying cross-sectional coolant flow area through which coolant flows in a direction substantially parallel to a main heat transfer surface of the structure coupled to the electronic component(s). The coolant-cooled heat sink includes a coolant inlet and a coolant outlet in fluid communication with the coolant-carrying compartment, and the coolant flow area of the coolant-carrying compartment decreases, at least in part, in a direction of coolant flow through the coolant-carrying compartment. The decreasing coolant flow area facilitates an increasing effective heat transfer coefficient between the main heat transfer surface and the coolant by, at least in part, accelerating the coolant flow within the coolant-carrying compartment.
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公开(公告)号：US09414525B2
公开(公告)日：2016-08-09
申请号：US14827588
申请日：2015-08-17
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC: H01L23/473 , H05K7/20
CPC classification number: H05K7/2039 , H05K7/20254 , H05K7/20772
Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a coolant. The cooling apparatus includes a coolant-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a varying cross-sectional coolant flow area through which coolant flows in a direction substantially parallel to a main heat transfer surface of the structure coupled to the electronic component(s). The coolant-cooled heat sink includes a coolant inlet and a coolant outlet in fluid communication with the coolant-carrying compartment, and the coolant flow area of the coolant-carrying compartment decreases, at least in part, in a direction of coolant flow through the coolant-carrying compartment. The decreasing coolant flow area facilitates an increasing effective heat transfer coefficient between the main heat transfer surface and the coolant by, at least in part, accelerating the coolant flow within the coolant-carrying compartment.
Abstract translation: 提供冷却装置，冷却的电子模块和制造方法，其有助于从一个或多个电子部件到冷却剂的热传递。 该冷却装置包括具有导热结构的冷却剂冷却的散热器，该导热结构具有一个带有冷却剂输送隔室，该冷却剂输送室包括变化的横截面冷却剂流动区域，冷却剂流动区域通过冷却剂流动区域大致平行于结构的主传热表面 电子组件。 冷却剂冷却的散热器包括冷却剂入口和与冷却剂携带室流体连通的冷却剂出口，并且冷却剂承载室的冷却剂流动区域至少部分地沿冷却剂流过 冷气携带舱。 减少的冷却剂流动面积有助于通过至少部分地加速冷却剂供给室内的冷却剂流而增加主传热表面和冷却剂之间的有效传热系数。
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公开(公告)号：US09414519B2
公开(公告)日：2016-08-09
申请号：US14063141
申请日：2013-10-25
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
CPC classification number: H05K7/202 , F28D1/0471 , F28D1/0475 , F28D1/05366 , F28D2021/0038 , F28F1/126 , F28F1/32 , F28F17/005 , H05K7/20218 , H05K7/20318 , H05K7/20572 , H05K7/20609 , H05K7/20627 , H05K7/20645 , H05K7/20736 , H05K7/20754 , H05K7/20763 , H05K7/20781 , H05K7/20836
Abstract: Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack, wherein air flows through the rack from the air inlet to the air outlet side. The heat exchanger is positioned for air passing through the electronics rack to pass across the heat exchanger, and is in fluid communication with a coolant loop for passing coolant therethrough at a temperature below a dew point temperature of the air passing across the heat exchanger so that air passing across the heat exchanger is dehumidified and cooled. A condensate collector, disposed below the heat exchanger, collects liquid condensate from the dehumidifying of air passing through the electronics rack, wherein the heat exchanger includes a plurality of sloped surfaces configured to facilitate drainage of liquid condensate from the heat exchanger to the condensate collector.
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Patent Agency Ranking
公开(公告)号：US09363924B2
公开(公告)日：2016-06-07
申请号：US13780538
申请日：2013-02-28
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
CPC classification number: H05K7/2039 , F24T10/30 , F28D15/0266 , F28D15/0275 , H05K7/20827 , Y02E10/10 , Y02E10/16
Abstract: Cooling methods are provided which include providing a heat sink having a housing with a compartment, a coolant inlet, and a coolant outlet. The housing is configured for a coolant to flow from the coolant inlet through the compartment to the coolant outlet, wherein the coolant is transferring heat extracted from one or more electronic components. The heat sink further includes one or more heat pipes having a first portion disposed within the compartment of the housing and a second portion disposed outside the housing. The heat pipe(s) is configured to extract heat from the coolant flowing through the compartment, and to transfer the extracted heat to the second portion disposed outside the housing. The second portion outside the housing is disposed to facilitate conducting the extracted heat into the ground.
Abstract translation: 提供了冷却方法，其包括提供散热器，该散热器具有带有隔室的壳体，冷却剂入口和冷却剂出口。 壳体构造成用于使冷却剂从冷却剂入口通过隔室流到冷却剂出口，其中冷却剂传送从一个或多个电子部件提取的热量。 散热器还包括一个或多个热管，其具有设置在壳体的隔室内的第一部分和设置在壳体外部的第二部分。 热管被配置为从流过隔室的冷却剂中提取热量，并且将提取的热量传送到设置在壳体外部的第二部分。 壳体外部的第二部分设置成便于将提取的热量导入地面。
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公开(公告)号：US09351431B2
公开(公告)日：2016-05-24
申请号：US13649334
申请日：2012-10-11
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons , Prabjit Singh , Jing Zhang
CPC classification number: H05K7/20836 , F28F2265/14
Abstract: An automated multi-fluid cooling system and method are provided for cooling an electronic component(s). The cooling system includes a coolant loop, a coolant tank, multiple valves, and a controller. The coolant loop is at least partially exposed to outdoor ambient air temperature(s) during normal operation, and the coolant tank includes first and second reservoirs containing first and second fluids, respectively. The first fluid freezes at a lower temperature than the second, the second fluid has superior cooling properties compared with the first, and the two fluids are soluble. The multiple valves are controllable to selectively couple the first or second fluid into the coolant in the coolant loop, wherein the coolant includes at least the second fluid. The controller automatically controls the valves to vary first fluid concentration level in the coolant loop based on historical, current, or anticipated outdoor air ambient temperature(s) for a time of year.
Abstract translation: 提供了一种用于冷却电子部件的自动多流体冷却系统和方法。 冷却系统包括冷却剂回路，冷却剂箱，多个阀和控制器。 在正常操作期间，冷却剂回路至少部分地暴露于室外环境空气温度，并且冷却剂箱分别包括容纳第一和第二流体的第一和第二储存器。 第一流体在比第二流体低的温度下冻结，第二流体与第一流体相比具有优异的冷却性能，并且两种流体是可溶的。 多个阀是可控制的，以选择性地将第一或第二流体耦合到冷却剂回路中的冷却剂中，其中冷却剂至少包括第二流体。 控制器根据一年中的历史，当前或预期的室外空气环境温度，自动控制阀门改变冷却剂回路中的第一个液体浓度水平。
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28.发明授权公开(公告)号：US09253921B2
公开(公告)日：2016-02-02
申请号：US13782003
申请日：2013-03-01
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
CPC classification number: H05K7/20281 , F28F27/02 , H05K7/20781 , H05K7/20836
Abstract: A method is provided which includes providing a coolant-conditioning unit which includes a facility coolant path, having a facility coolant flow control valve, and a system coolant path accommodating a system coolant, and having a bypass line with a system coolant bypass valve. A heat exchanger is coupled to the facility and system coolant paths to facilitate transfer of heat from the system coolant to facility coolant in the facility coolant path, and the bypass line is disposed in the system coolant path in parallel with the heat exchanger. A controller automatically controls a regulation position of the coolant bypass valve and a regulation position of the facility coolant flow control valve based on a temperature of the system coolant, and automatically adjusts the regulation position of the system coolant bypass valve to facilitate maintaining the facility coolant flow control valve at or above a specified, partially open, minimum regulation position.
Abstract translation: 提供一种方法，其包括提供冷却剂调节单元，该冷却剂调节单元包括具有设备冷却剂流量控制阀的设备冷却剂通道和容纳系统冷却剂的系统冷却剂通道，并且具有与系统冷却剂旁通阀的旁路管路。 热交换器被耦合到设备和系统冷却剂路径，以便于将热量从系统冷却剂传送到设备冷却剂路径中的设备冷却剂，并且旁路管线与热交换器平行地设置在系统冷却剂路径中。 控制器基于系统冷却液的温度自动控制冷却剂旁通阀的调节位置和设备冷却剂流量控制阀的调节位置，并且自动调节系统冷却剂旁通阀的调节位置以便于维持设备冷却剂 流量控制阀处于或高于指定的，部分打开的最小调节位置。
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公开(公告)号：US09173324B2
公开(公告)日：2015-10-27
申请号：US14063154
申请日：2013-10-25
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
CPC classification number: H05K7/202 , F28D1/0471 , F28D1/0475 , F28D1/05366 , F28D2021/0038 , F28F1/126 , F28F1/32 , F28F17/005 , H05K7/20218 , H05K7/20318 , H05K7/20572 , H05K7/20609 , H05K7/20627 , H05K7/20645 , H05K7/20736 , H05K7/20754 , H05K7/20763 , H05K7/20781 , H05K7/20836
Abstract: Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack, wherein air flows through the rack from the air inlet to the air outlet side. The heat exchanger is positioned for air passing through the electronics rack to pass across the heat exchanger, and is in fluid communication with a coolant loop for passing coolant therethrough at a temperature below a dew point temperature of the air passing across the heat exchanger so that air passing across the heat exchanger is dehumidified and cooled. A condensate collector, disposed below the heat exchanger, collects liquid condensate from the dehumidifying of air passing through the electronics rack, wherein the heat exchanger includes a plurality of sloped surfaces configured to facilitate drainage of liquid condensate from the heat exchanger to the condensate collector.
Abstract translation: 为电子机架提供除湿冷却装置和方法。 该装置包括设置在机架的空气入口侧或出口侧的空气 - 液体热交换器，其中空气从进气口流过空气出口侧。 热交换器被定位成用于空气通过电子机架以通过热交换器，并且与冷却剂回路流体连通，以在低于通过热交换器的空气的露点温度的温度下使冷却剂通过其中，使得 通过热交换器的空气被除湿并冷却。 设置在热交换器下方的冷凝水收集器从通过电子机架的空气的除湿收集液体冷凝物，其中热交换器包括多个倾斜表面，其被构造成便于将液体冷凝物从热交换器排出到冷凝水收集器。
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公开(公告)号：US09148982B2
公开(公告)日：2015-09-29
申请号：US13671887
申请日：2012-11-08
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
CPC classification number: H05K7/2079 , G05D23/1934 , G06F1/206 , H05K7/20836
Abstract: Methods and coolant distribution systems are provided for automated coolant flow control for, for instance, facilitating cooling of multiple different electronic systems. The methods include, for instance, automatically controlling coolant flow to a plurality of coolant circuits, and for a coolant circuit i of the coolant circuits: automatically determining the heat load transferred to coolant flowing through coolant circuit i, and automatically controlling coolant flow through coolant circuit i based on the determined heat load transferred to the coolant. The different coolant circuits may have the same or different coolant flow impedances, and flow through the different coolant circuits may be controlled using different heat load-to-coolant ranges for the different circuits.
Abstract translation: 方法和冷却剂分配系统被提供用于自动冷却剂流控制，例如，促进多个不同电子系统的冷却。 这些方法包括例如自动控制冷却剂流到多个冷却剂回路，以及冷却剂回路的冷却剂回路i：自动确定传递到冷却剂回路i中的冷却剂的热负荷，并自动控制冷却剂流过冷却剂 电路i基于传输到冷却剂的确定的热负荷。 不同的冷却剂回路可以具有相同或不同的冷却剂流动阻抗，并且可以使用用于不同回路的不同热负荷 - 冷却剂范围来控制通过不同冷却剂回路的流量。
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