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公开(公告)号：US09617144B2
公开(公告)日：2017-04-11
申请号：US14273845
申请日：2014-05-09
Applicant: INVENSENSE, Inc.
Inventor： Julius Ming-Lin Tsai , Baris Cagdaser , Martin Lim , Aleksey S. Khenkin
CPC classification number: B81B7/02 , B81B2201/0214 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2201/0292 , B81B2207/012 , B81B2207/07 , B81C1/0023 , B81C2203/0792 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/16152 , H04R1/04 , H04R19/04 , H04R29/004 , H04R2201/003 , H01L2924/00014 , H01L2924/00
Abstract: An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.
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22.发明申请公开(公告)号：US20170022054A1
公开(公告)日：2017-01-26
申请号：US15291599
申请日：2016-10-12
Applicant: INVENSENSE, INC.
Inventor： Julius Ming-Lin Tsai , Michael J. Daneman
CPC classification number: B81B7/007 , B81B3/0029 , B81B2201/032 , B81B2207/012 , B81B2207/07 , B81C1/00182 , B81C1/00269 , B81C1/00301 , B81C2201/013 , B81C2201/019 , B81C2203/0109 , B81C2203/0792
Abstract: A micro-electro-mechanical system device is disclosed. The micro-mechanical system device comprises a first silicon substrate comprising: a handle layer comprising a first surface and a second surface, the second surface comprises a cavity; an insulating layer deposited over the second surface of the handle layer; a device layer having a third surface bonded to the insulating layer and a fourth surface; a piezoelectric layer deposited over the fourth surface of the device layer; a metal conductivity layer disposed over the piezoelectric layer; a bond layer disposed over a portion of the metal conductivity layer; and a stand-off formed on the first silicon substrate; wherein the first silicon substrate is bonded to a second silicon substrate, comprising: a metal electrode configured to form an electrical connection between the metal conductivity layer formed on the first silicon substrate and the second silicon substrate.
Abstract translation: 公开了一种微机电系统装置。 微机械系统装置包括第一硅衬底，其包括：手柄层，包括第一表面和第二表面，所述第二表面包括空腔; 沉积在手柄层的第二表面上的绝缘层; 具有结合到绝缘层的第三表面和第四表面的器件层; 沉积在器件层的第四表面上的压电层; 设置在所述压电层上的金属导电层; 设置在所述金属导电层的一部分上的接合层; 以及在所述第一硅衬底上形成的间隔件; 其中所述第一硅衬底接合到第二硅衬底，包括：金属电极，被配置为在所述第一硅衬底上形成的所述金属传导层与所述第二硅衬底之间形成电连接。
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公开(公告)号：US20160090300A1
公开(公告)日：2016-03-31
申请号：US14860139
申请日：2015-09-21
Applicant: INVENSENSE, INC.
Inventor： Julius Ming-Lin Tsai , Michael Daneman
Abstract: A piezoelectric microphone and/or a piezoelectric microphone system is presented herein. In an implementation, a piezoelectric microphone includes a microelectromechanical systems (MEMS) layer and a complementary metal-oxide-semiconductor (CMOS) layer. The MEMS layer includes at least one piezoelectric layer and a conductive layer. The conductive layer is deposited on the at least one piezoelectric layer and is associated with at least one sensing electrode. The CMOS layer is deposited on the MEMS layer. Furthermore, a cavity formed in the CMOS layer includes the at least one sensing electrode
Abstract translation: 此处呈现压电麦克风和/或压电麦克风系统。 在一个实现中，压电麦克风包括微机电系统（MEMS）层和互补金属氧化物半导体（CMOS）层。 MEMS层包括至少一个压电层和导电层。 导电层沉积在至少一个压电层上并且与至少一个感测电极相关联。 CMOS层沉积在MEMS层上。 此外，形成在CMOS层中的空腔包括至少一个感测电极
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24.发明申请INTEGRATED PACKAGE CONTAINING MEMS ACOUSTIC SENSOR AND ENVIRONMENTAL SENSOR AND METHODOLOGY FOR FABRICATING SAME 有权包含MEMS声学传感器和环境传感器的集成包装及其制造方法公开(公告)号：US20150321906A1
公开(公告)日：2015-11-12
申请号：US14273845
申请日：2014-05-09
Applicant: INVENSENSE, Inc.
Inventor： Julius Ming-Lin Tsai , Baris Cagdaser , Martin Lim , Aleksey S. Khenkin
CPC classification number: B81B7/02 , B81B2201/0214 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2201/0292 , B81B2207/012 , B81B2207/07 , B81C1/0023 , B81C2203/0792 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/16152 , H04R1/04 , H04R19/04 , H04R29/004 , H04R2201/003 , H01L2924/00014 , H01L2924/00
Abstract: An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.
Abstract translation: 公开了至少一个环境传感器和至少一个MEMS声学传感器的集成封装。 该包装包含共享端口，将两个传感器公开到环境中，其中环境传感器测量环境的特性并且声学传感器测量声波。 该端口将环境传感器暴露于气流，声传感器暴露于声波。 声学传感器的示例是麦克风，并且环境传感器的示例是湿度传感器。
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公开(公告)号：US11651611B2
公开(公告)日：2023-05-16
申请号：US16591166
申请日：2019-10-02
Applicant: InvenSense, Inc.
Inventor： Julius Ming-Lin Tsai
CPC classification number: G06V40/1306 , B06B1/0292 , B06B1/06 , B06B1/0622 , G10K11/30 , G06V40/1359
Abstract: A mobile device including a processor, a memory unit, a display device disposed on a first surface of the mobile device, and a fingerprint sensor disposed on a second surface of the mobile device, wherein the second surface is a curved surface having a curvature such that the fingerprint sensor is curved to match the curvature of the curved surface.
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Patent Agency Ranking
公开(公告)号：US11107858B2
公开(公告)日：2021-08-31
申请号：US16666024
申请日：2019-10-28
Applicant: InvenSense, Inc.
Inventor： Renata Melamud Berger , Julius Ming-Lin Tsai , Stephen Lloyd
Abstract: An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.
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27.发明申请公开(公告)号：US20200250393A1
公开(公告)日：2020-08-06
申请号：US16805555
申请日：2020-02-28
Applicant: INVENSENSE, INC.
Inventor： Julius Ming-Lin Tsai , Mike Daneman , Sanjiv Kapoor
Abstract: Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
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公开(公告)号：US10656255B2
公开(公告)日：2020-05-19
申请号：US15205743
申请日：2016-07-08
Applicant: InvenSense, Inc.
Inventor： Eldwin Ng , Julius Ming-Lin Tsai , Nikhil Apte
IPC: H01L41/047 , G01S7/521 , B06B1/06 , H01L41/09 , A61B5/1172 , A61B8/00 , G01S15/89
Abstract: A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane is configured to allow movement at ultrasonic frequencies. The membrane includes a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. An interior support structure is disposed within the cavity and connected to the substrate and the membrane.
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公开(公告)号：US10445547B2
公开(公告)日：2019-10-15
申请号：US15415716
申请日：2017-01-25
Applicant: InvenSense, Inc.
Inventor： Julius Ming-Lin Tsai
Abstract: An electronic device including an array of ultrasonic transducers for generating and receiving ultrasonic signals, and an acoustic coupling layer overlying the array of ultrasonic transducers, where the ultrasonic signals are propagated through the acoustic coupling layer.
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公开(公告)号：US10325915B2
公开(公告)日：2019-06-18
申请号：US15294186
申请日：2016-10-14
Applicant: InvenSense, Inc.
Inventor： James Christian Salvia , Michael H. Perrott , Marian Voros , Eldwin Ng , Julius Ming-Lin Tsai , Nikhil Apte
IPC: H01L27/00 , H01L27/092 , G06K9/00 , G06F3/0354 , B06B1/06 , B81C1/00 , H01L21/8238
Abstract: An electronic device includes a plurality of CMOS control elements arranged in a two-dimensional array, where each CMOS control element of the plurality of CMOS control elements includes semiconductor devices. The plurality of CMOS control elements each including a PMOS semiconductor device portion comprising a high voltage PMOS device and a low voltage PMOS device and an NMOS semiconductor device portion comprising a high voltage NMOS device and a low voltage NMOS device. The plurality of CMOS control elements are arranged in the two-dimensional array such that the PMOS semiconductor device portion of a CMOS control element of the plurality of CMOS control elements is only adjacent to other PMOS semiconductor device portions of adjacent CMOS control elements of the plurality of CMOS control elements, and such that the NMOS semiconductor device portion of a CMOS control element of the plurality of CMOS control elements is only adjacent to other NMOS semiconductor device portions of adjacent CMOS control elements of the plurality of CMOS control elements.
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