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108 条记录 (耗时 0.026 秒)

    Optoelectronic component
    21.
    发明授权
    Optoelectronic component 有权
    光电元件

    公开(公告)号：US07838357B2

    公开(公告)日：2010-11-23

    申请号：US10494160

    申请日：2002-10-28

    申请人： Georg Bogner ,  Herbert Brunner ,  Gertrud Kräuter ,  Gunter Waitl

    发明人： Georg Bogner ,  Herbert Brunner ,  Gertrud Kräuter ,  Gunter Waitl

    IPC分类号： H01L218/8238

    CPC分类号： H01L33/486 ,  H01L33/483 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： Optoelectronic component, having a housing body (2), an optoelectronic semiconductor chip (3) arranged in a recess (6) of the housing body, and having electrical terminals (1A, 1B), the semiconductor chip being electrically conductively connected to the electrical terminals of the leadframe. The housing body (2) is formed from an encapsulation material, with a filler which has a high degree of reflection in a wavelength range from the UV range.

    摘要翻译： 具有壳体（2），布置在壳体主体的凹部（6）中的光电子半导体芯片（3），并具有电端子（1A，1B）的光电子部件，该半导体芯片导电地连接到电气 引线框的端子。 壳体（2）由封装材料形成，其具有在从UV范围的波长范围内具有高反射度的填料。

    Light Emitting Diode Chip with Overvoltage Protection
    22.
    发明申请
    Light Emitting Diode Chip with Overvoltage Protection 有权
    具有过压保护功能的发光二极管芯片

    公开(公告)号：US20100270578A1

    公开(公告)日：2010-10-28

    申请号：US12742064

    申请日：2008-12-09

    申请人： Joerg Erich Sorg ,  Stefan Gruber ,  Georg Bogner

    发明人： Joerg Erich Sorg ,  Stefan Gruber ,  Georg Bogner

    IPC分类号： H01L33/62 ,  H01L33/00

    CPC分类号： H01L25/167 ,  H01L23/60 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

    摘要： A light emitting diode chip includes a device for protection against overvoltages, e.g., an ESD protection device. The ESD protection device is integrated into a carrier, on which the semiconductor layer sequence of the light emitting diode chip is situated, and is based on a specific doping of specific regions of said carrier. By way of example, the ESD protection device is embodied as a Zener diode that is connected to the semiconductor layer sequence by means of an electrical conductor structure.

    摘要翻译： 发光二极管芯片包括用于防止过电压的装置，例如ESD保护装置。 ESD保护器件集成在发光二极管芯片的半导体层序列所在的载体上，并且基于对所述载体的特定区域的特定掺杂。 作为示例，ESD保护装置被实施为通过电导体结构连接到半导体层序列的齐纳二极管。

    Optoelectronic component and method for producing it
    24.
    发明授权
    Optoelectronic component and method for producing it 有权
    光电元件及其制造方法

    公开(公告)号：US07429758B2

    公开(公告)日：2008-09-30

    申请号：US11141721

    申请日：2005-05-31

    申请人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

    发明人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound (28) filled at least partly into the cavity (18) is provided, the material and the quantity of the filling compound (28) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas (30) of the filling compound serve as reflector.

    摘要翻译： 一种光电元件，其具有基本壳体或框架（12）和至少一个半导体芯片（20），特别是辐射发射或接收半导体芯片，位于基本壳体的空腔（18）中。 为了提高光电子部件（10）的效率，在半导体芯片周围的区域的空腔内设置反射器。 这些反射器是由以下事实构成的：提供了至少部分地填充到空腔（18）中的填充化合物（28），填充化合物（28）的材料和数量被选择为使填充物 由于填充化合物和基本壳体之间的粘合力，复合物呈现在腔体中从底部到顶部基本上锥形化的形式，并且填充化合物的锥形内部区域（30）用作反射器。

    Optoelectronic Component with Multi-Part Housing Body
    26.
    发明申请
    Optoelectronic Component with Multi-Part Housing Body 有权
    多部件壳体的光电元件

    公开(公告)号：US20070253667A1

    公开(公告)日：2007-11-01

    申请号：US10593794

    申请日：2005-03-09

    申请人： Herbert Brunner ,  Matthias Winter ,  Markus Zeiler ,  Georg Bogner ,  Thomas Hofer

    发明人： Herbert Brunner ,  Matthias Winter ,  Markus Zeiler ,  Georg Bogner ,  Thomas Hofer

    IPC分类号： H01L31/0203

    CPC分类号： H01L33/60 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/486 ,  H01L33/54 ,  H01L2924/0002 ,  H01S5/02228 ,  H01S5/02244 ,  H01S5/02292 ,  H01L2924/00

    摘要： An optoelectronic component (1) is proposed that comprises a housing body (2) and at least one semiconductor chip (8) disposed thereon, said housing body having a base part (13) comprising a connector body (16), on which a connecting conductor material (6, 7) is disposed, and said housing body having a reflector part (14) comprising a reflector body (23), on which a reflector material (9) is disposed, wherein said connector body and said reflector body are preformed separately from each other and said reflector body is disposed on said connector body in the form of a reflector top.

    摘要翻译： 提出了一种光电子部件（1），其包括壳体（2）和设置在其上的至少一个半导体芯片（8），所述壳体具有包括连接器主体（16）的基部（13） 导体材料（6,7）设置，并且所述壳体具有包括反射体（23）的反射器部分（14），反射器材料（9）设置在所述反射器部分上，其中所述连接器主体和所述反射器主体被预成型 彼此分开，并且所述反射器主体以反射器顶部的形式设置在所述连接器主体上。

    Radiation emitter component
    28.
    发明授权
    Radiation emitter component 失效
    辐射发射器组件

    公开(公告)号：US5999552A

    公开(公告)日：1999-12-07

    申请号：US9606

    申请日：1998-01-20

    申请人： Georg Bogner ,  Herbert Brunner ,  Heinz Haas ,  Johann Luft ,  Ernst Nirschl ,  Werner Spaeth ,  Norbert Stath ,  Wolfgang Teich

    发明人： Georg Bogner ,  Herbert Brunner ,  Heinz Haas ,  Johann Luft ,  Ernst Nirschl ,  Werner Spaeth ,  Norbert Stath ,  Wolfgang Teich

    IPC分类号： H01L33/56 ,  H01S3/00 ,  H01S5/00 ,  H01S5/022 ,  H01S3/18 ,  H01L33/00

    CPC分类号： H01S5/02244 ,  H01S5/02228 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L33/56

    摘要： A radiation emitter component, in particular an infrared emitter component with a conventional light-emitting diode housing, includes two electrode connections, one of which has a well-shaped reflector. The housing has an optically transparent, electrically non-conducting encapsulation material. A semiconductor laser chip is fastened in a well-shaped reflector of the light-emitting diode housing. The semiconductor laser chip has a quantum well structure, in particular with a strained layer structure, for example MOVPE epitaxial layers with a layer sequence GaAlAs-InGaAs-GaAlAs. A diffusor material can be inserted into the optically transparent, electrically non-conducting material of the light-emitting diode housing. The diffusor material is constructed or inserted with regard to type and concentration in such a way that in connection with the semiconductor laser chip encapsulated in the light-emitting diode housing, a radiation characteristic curve or an increase of an effective emission surface is produced that is comparable to that of a conventional infrared light-emitting diode.

    摘要翻译： 辐射发射器部件，特别是具有传统发光二极管外壳的红外发射器部件包括两个电极连接件，其中之一具有良好形状的反射器。 壳体具有光学透明的非导电封装材料。 将半导体激光芯片紧固在发光二极管壳体的形状好的反射器中。 半导体激光芯片具有量子阱结构，特别是具有应变层结构，例如具有层序列GaAlAs-InGaAs-GaAlAs的MOVPE外延层。 漫射材料可以插入到发光二极管外壳的光学透明的非导电材料中。 关于类型和浓度来构造或插入扩散材料，使得与封装在发光二极管外壳中的半导体激光器芯片有关，产生辐射特性曲线或有效发射表面的增加，即， 与传统的红外发光二极管相当。

    Optoelectronic component
    30.
    发明授权
    Optoelectronic component 有权
    光电元件

    公开(公告)号：US08314441B2

    公开(公告)日：2012-11-20

    申请号：US13084149

    申请日：2011-04-11

    申请人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

    发明人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or -receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector.

    摘要翻译： 具有基本壳体或框架的光电子部件和在基本壳体的空腔中的至少一个半导体芯片，特别是辐射发射或接收半导体芯片。 为了提高光电子部件的效率，在半导体芯片周围的区域的空腔内设置反射体。 这些反射体是由于填充化合物至少部分地填充到空腔中而形成的，填充化合物的材料和数量被选择为使得填充化合物由于 填充化合物和基本壳体呈现在腔中从底部到顶部基本上锥形变宽的形式，并且填充化合物的锥形内部区域用作反射器。