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1.发明授权Radiation-emitting component and method for producing radiation-emitting components 有权辐射发射部件和用于产生辐射发射部件的方法公开(公告)号：US09159889B2
公开(公告)日：2015-10-13
申请号：US13811846
申请日：2011-07-15
申请人： Karl Weidner , Johann Ramchen , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Stefan Gruber , Georg Bogner
发明人： Karl Weidner , Johann Ramchen , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Stefan Gruber , Georg Bogner
IPC分类号： H01L33/60 , H01L33/20 , H01L33/38 , H01L33/58 , G02F1/1335 , H01L25/075 , H01L33/40 , H01L33/46
CPC分类号： H01L33/60 , G02F1/133603 , H01L25/0753 , H01L25/0756 , H01L33/20 , H01L33/38 , H01L33/405 , H01L33/46 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A radiation-emitting component includes a semiconductor chip which has a first main surface, a second main surface on an opposite side from the first main surface and an active region that generates radiation; a carrier on which the semiconductor chip is fixed on the side of the second main surface; an output layer arranged on the first main surface of the semiconductor chip and forming a lateral output surface spaced apart from the semiconductor chip in a lateral direction, a recess tapering in a direction of the semiconductor chip being, formed in the output layer and deflecting radiation emerging from the first main surface during operation into the direction of the lateral output surface.
摘要翻译： 辐射发射部件包括半导体芯片，其具有第一主表面，与第一主表面相对的第二主表面和产生辐射的有源区域; 半导体芯片固定在第二主表面侧的载体; 输出层，布置在半导体芯片的第一主表面上，并在横向上形成与半导体芯片间隔开的横向输出表面，在输出层中形成在半导体芯片的方向上渐缩的凹部和偏转辐射 在运行过程中从第一主表面向侧向输出表面的方向出现。
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2.发明申请公开(公告)号：US20130207139A1
公开(公告)日：2013-08-15
申请号：US13811846
申请日：2011-07-15
申请人： Karl Weidner , Johann Ramchen , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Stefan Gruber , Georg Bogner
发明人： Karl Weidner , Johann Ramchen , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Stefan Gruber , Georg Bogner
IPC分类号： H01L33/60
CPC分类号： H01L33/60 , G02F1/133603 , H01L25/0753 , H01L25/0756 , H01L33/20 , H01L33/38 , H01L33/405 , H01L33/46 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A radiation-emitting component includes a semiconductor chip which has a first main surface, a second main surface on an opposite side from the first main surface and an active region that generates radiation; a carrier on which the semiconductor chip is fixed on the side of the second main surface; an output layer arranged on the first main surface of the semiconductor chip and forming a lateral output surface spaced apart from the semiconductor chip in a lateral direction, a recess tapering in a direction of the semiconductor chip being, formed in the output layer and deflecting radiation emerging from the first main surface during operation into the direction of the lateral output surface.
摘要翻译： 辐射发射部件包括半导体芯片，其具有第一主表面，与第一主表面相对的第二主表面和产生辐射的有源区域; 半导体芯片固定在第二主表面侧的载体; 输出层，布置在半导体芯片的第一主表面上，并在横向上形成与半导体芯片间隔开的横向输出表面，在输出层中形成在半导体芯片的方向上渐缩的凹部和偏转辐射 在运行过程中从第一主表面向侧向输出表面的方向出现。
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3.发明申请公开(公告)号：US20130193470A1
公开(公告)日：2013-08-01
申请号：US13816196
申请日：2011-08-10
申请人： Karl Weidner , Johann Ramchen , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Gertrud Kraeuter
发明人： Karl Weidner , Johann Ramchen , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Gertrud Kraeuter
CPC分类号： H01L33/44 , H01L23/29 , H01L24/24 , H01L33/0095 , H01L33/56 , H01L33/60 , H01L2924/12041 , H01L2933/005 , H01L2924/00
摘要： An optoelectronic component includes a protective layer including a material containing hydrophobic groups. Furthermore, a method is described, by means of which an optoelectronic component can be produced, and in which a protective layer including hydrophobic groups is applied.
摘要翻译： 光电子部件包括包含含有疏水基团的材料的保护层。 此外，描述了可以产生光电子部件并且其中施加包括疏水基团的保护层的方法。
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公开(公告)号：US20130307004A1
公开(公告)日：2013-11-21
申请号：US13822367
申请日：2011-08-22
CPC分类号： H01L33/60 , H01L23/055 , H01L24/18 , H01L24/24 , H01L24/82 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2224/24 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244
摘要： An optoelectronic component includes a carrier having a first connection region and a second connection region, a radiation-emitting semiconductor chip having a base surface and a radiation exit surface opposite the base surface, wherein the semiconductor chip is arranged by the base surface on the carrier, a housing having a lower housing part arranged on the carrier and adjoining side flanks of the semiconductor chip, and an upper housing part arranged on the lower housing part and shaped as a reflector for radiation emitted by the semiconductor chip, and an electrical connection layer which leads from the radiation exit surface of the semiconductor chip via a part of the interface between the lower and the upper housing part and through the lower housing part to the first connection region on the carrier.
摘要翻译： 光电子部件包括具有第一连接区域和第二连接区域的载体，具有基底表面和与基底表面相对的辐射出射表面的辐射发射半导体芯片，其中半导体芯片由载体上的基底表面布置 ，具有布置在所述载体上的下壳体部分和所述半导体芯片的相邻侧面的壳体，以及布置在所述下壳体部分上并形成为由所述半导体芯片发射的辐射的反射器的上壳体部分，以及电连接层 其从半导体芯片的辐射出射表面经由下壳体部分和上壳体部分之间的界面的一部分穿过下壳体部分到达载体上的第一连接区域。
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公开(公告)号：US08901592B2
公开(公告)日：2014-12-02
申请号：US13822367
申请日：2011-08-22
CPC分类号： H01L33/60 , H01L23/055 , H01L24/18 , H01L24/24 , H01L24/82 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2224/24 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244
摘要： An optoelectronic component includes a carrier having a first connection region and a second connection region, a radiation-emitting semiconductor chip having a base surface and a radiation exit surface opposite the base surface, wherein the semiconductor chip is arranged by the base surface on the carrier, a housing having a lower housing part arranged on the carrier and adjoining side flanks of the semiconductor chip, and an upper housing part arranged on the lower housing part and shaped as a reflector for radiation emitted by the semiconductor chip, and an electrical connection layer which leads from the radiation exit surface of the semiconductor chip via a part of the interface between the lower and the upper housing part and through the lower housing part to the first connection region on the carrier.
摘要翻译： 光电子部件包括具有第一连接区域和第二连接区域的载体，具有基底表面和与基底表面相对的辐射出射表面的辐射发射半导体芯片，其中半导体芯片由载体上的基底表面布置 ，具有布置在所述载体上的下壳体部分和所述半导体芯片的相邻侧面的壳体，以及布置在所述下壳体部分上并形成为由所述半导体芯片发射的辐射的反射器的上壳体部分，以及电连接层 其从半导体芯片的辐射出射表面经由下壳体部分和上壳体部分之间的界面的一部分穿过下壳体部分到达载体上的第一连接区域。
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6.发明授权公开(公告)号：US09419193B2
公开(公告)日：2016-08-16
申请号：US13505283
申请日：2010-10-05
申请人： Bernd Barchmann , Axel Kaltenbacher , Norbert Stath , Walter Wegleiter , Karl Weidner , Ralph Wirth
发明人： Bernd Barchmann , Axel Kaltenbacher , Norbert Stath , Walter Wegleiter , Karl Weidner , Ralph Wirth
IPC分类号： H01L33/48 , H01L33/62 , H01L23/00 , H01L25/075
CPC分类号： H01L33/62 , H01L24/24 , H01L24/82 , H01L25/0753 , H01L2224/24998 , H01L2224/76155 , H01L2224/82102 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12036 , H01L2924/12042 , H01L2924/00
摘要： An opto-electronic component has a carrier element (3) with a connection region (5). Arranged on the carrier element (3) is a semiconductor chip (7). A contact region (10) is mounted on the surface (8) of the semiconductor chip (7) remote from the carrier element (3). The connection region (5) is electrically conductively connected to the contact region (10) by way of an unsupported conductive structure (13). A method for manufacturing an opto-electronic component is described.
摘要翻译： 光电子部件具有带有连接区域（5）的载体元件（3）。 在载体元件（3）上排列的是半导体芯片（7）。 接触区域（10）安装在远离载体元件（3）的半导体芯片（7）的表面（8）上。 连接区域（5）通过未支撑的导电结构（13）导电地连接到接触区域（10）。 描述了一种用于制造光电子部件的方法。
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7.发明授权公开(公告)号：US09105771B2
公开(公告)日：2015-08-11
申请号：US13816839
申请日：2011-08-12
IPC分类号： H01L31/0232 , H01L33/00 , H01L33/62 , H01L23/00 , H01L21/768 , H01L33/48
CPC分类号： H01L31/0232 , H01L21/76804 , H01L24/24 , H01L24/82 , H01L33/0095 , H01L33/48 , H01L33/486 , H01L33/62 , H01L2224/18 , H01L2224/24226 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/8203 , H01L2224/92244 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/12041 , H01L2924/12042 , H01L2933/0066 , H01L2224/82 , H01L2924/00
摘要： A method of producing an optoelectronic semiconductor component includes providing a carrier having a top side, an underside situated opposite the top side, and a plurality of connection areas arranged at the top side alongside one another in a lateral direction; applying a plurality of optoelectronic components arranged at a distance from one another in a lateral direction at the top side, the components having a contact area facing away from the carrier; applying protective elements to the contact and connection areas; applying an electrically insulating layer to exposed locations of the carrier, contact areas and protective elements; producing openings in the insulating layer by removing protective elements; and arranging an electrically conductive material on the insulating layer and in the openings, wherein the electrically conductive material connects a contact area to an assigned connection area.
摘要翻译： 制造光电子半导体部件的方法包括提供具有顶侧，与顶侧相对设置的下侧以及沿横向彼此并排布置的多个连接区域的载体; 施加在顶侧沿横向彼此一定距离地布置的多个光电子部件，所述部件具有背离载体的接触区域; 将保护元件施加到触点和连接区域; 将电绝缘层施加到载体，接触区域和保护元件的暴露位置; 通过去除保护元件在绝缘层中产生开口; 以及在所述绝缘层和所述开口中布置导电材料，其中所述导电材料将接触区域连接到所分配的连接区域。
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8.发明申请公开(公告)号：US20130214323A1
公开(公告)日：2013-08-22
申请号：US13816839
申请日：2011-08-12
IPC分类号： H01L31/0232 , H01L33/48
CPC分类号： H01L31/0232 , H01L21/76804 , H01L24/24 , H01L24/82 , H01L33/0095 , H01L33/48 , H01L33/486 , H01L33/62 , H01L2224/18 , H01L2224/24226 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/8203 , H01L2224/92244 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/12041 , H01L2924/12042 , H01L2933/0066 , H01L2224/82 , H01L2924/00
摘要： A method of producing an optoelectronic semiconductor component includes providing a carrier having a top side, an underside situated opposite the top side, and a plurality of connection areas arranged at the top side alongside one another in a lateral direction; applying a plurality of optoelectronic components arranged at a distance from one another in a lateral direction at the top side, the components having a contact area facing away from the carrier; applying protective elements to the contact and connection areas; applying an electrically insulating layer to exposed locations of the carrier, contact areas and protective elements; producing openings in the insulating layer by removing protective elements; and arranging an electrically conductive material on the insulating layer and in the openings, wherein the electrically conductive material connects a contact area to an assigned connection area.
摘要翻译： 制造光电子半导体部件的方法包括提供具有顶侧，与顶侧相对设置的下侧以及沿横向彼此并排布置的多个连接区域的载体; 施加在顶侧沿横向彼此一定距离地布置的多个光电子部件，所述部件具有背离载体的接触区域; 将保护元件施加到触点和连接区域; 将电绝缘层施加到载体，接触区域和保护元件的暴露位置; 通过去除保护元件在绝缘层中产生开口; 以及在所述绝缘层和所述开口中布置导电材料，其中所述导电材料将接触区域连接到所分配的连接区域。
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9.发明申请公开(公告)号：US20120235176A1
公开(公告)日：2012-09-20
申请号：US13394097
申请日：2010-08-06
申请人： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
发明人： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
CPC分类号： H01L33/44 , H01L24/24 , H01L25/0753 , H01L33/50 , H01L33/62 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/00
摘要： An optoelectronic module is provided which comprises a first semiconductor body (2) with a radiation exit side (2a) on which an electrical connection region (21, 22) is arranged. The first semiconductor body (2) is arranged with its side opposite the radiation exit side (2a) on a carrier (1). An insulation material (3) is arranged on the carrier (1) laterally next to the first semiconductor body (2), which material forms a fillet and adjoins the semiconductor body (2) form-fittingly. An insulation layer (4) is arranged at least in places on the first semiconductor body (2) and the insulation material (3), on which layer a planar conductive structure is arranged for planar contacting of the first semiconductor body (2), which conductive structure is electrically conductively connected with the electrical connection region (21, 22). A method of producing such an optoelectronic module is furthermore provided.
摘要翻译： 提供了一种光电模块，其包括具有辐射出射侧（2a）的第一半导体本体（2），电连接区域（21,22）布置在其上。 第一半导体本体（2）的一侧与辐射出口侧（2a）相对设置在载体（1）上。 绝缘材料（3）在第一半导体本体（2）的横向方向上布置在载体（1）上，该材料形成一个圆角并且与半导体本体（2）形成适当的连接。 绝缘层（4）至少布置在第一半导体本体（2）和绝缘材料（3）上的位置上，其上布置有用于第一半导体主体（2）的平面接触的平面导电结构的层， 导电结构与电连接区域（21,22）导电连接。 此外还提供了制造这种光电子模块的方法。
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10.发明申请公开(公告)号：US20120119233A1
公开(公告)日：2012-05-17
申请号：US13320304
申请日：2010-07-19
申请人： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
发明人： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
CPC分类号： H01L33/0079 , H01L23/3107 , H01L23/3185 , H01L25/042 , H01L25/0753 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/02322 , H01L31/02327 , H01L31/1892 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
摘要： A method for producing an optoelectronic semiconductor component includes providing a carrier; arranging at least one optoelectronic semiconductor chip at a top side of the carrier; shaping a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body covers all side areas of the at least one optoelectronic semiconductor chip, and wherein a surface facing away from the carrier at the top side and/or a surface facing the carrier at the underside of the at least one semiconductor chip remains substantially free of the shaped body or is exposed, and removing the carrier.
摘要翻译： 一种光电子半导体部件的制造方法，包括提供载体; 在载体的顶侧布置至少一个光电子半导体芯片; 在所述至少一个光电半导体芯片周围成形成形体，其中所述成形体覆盖所述至少一个光电半导体芯片的所有侧面区域，并且其中，在顶侧处背离所述载体的表面和/或面向所述至少一个光电半导体芯片的表面 在至少一个半导体芯片的下侧的载体保持基本上没有成形体或暴露，并且移除载体。
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