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公开(公告)号：US07838357B2
公开(公告)日：2010-11-23
申请号：US10494160
申请日：2002-10-28
申请人： Georg Bogner , Herbert Brunner , Gertrud Kräuter , Gunter Waitl
发明人： Georg Bogner , Herbert Brunner , Gertrud Kräuter , Gunter Waitl
IPC分类号： H01L218/8238
CPC分类号： H01L33/486 , H01L33/483 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： Optoelectronic component, having a housing body (2), an optoelectronic semiconductor chip (3) arranged in a recess (6) of the housing body, and having electrical terminals (1A, 1B), the semiconductor chip being electrically conductively connected to the electrical terminals of the leadframe. The housing body (2) is formed from an encapsulation material, with a filler which has a high degree of reflection in a wavelength range from the UV range.
摘要翻译： 具有壳体（2），布置在壳体主体的凹部（6）中的光电子半导体芯片（3），并具有电端子（1A，1B）的光电子部件，该半导体芯片导电地连接到电气 引线框的端子。 壳体（2）由封装材料形成，其具有在从UV范围的波长范围内具有高反射度的填料。
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公开(公告)号：US09029907B2
公开(公告)日：2015-05-12
申请号：US13515256
申请日：2010-11-17
IPC分类号： H01L33/60 , H01L33/56 , H01L31/0352 , H01L33/50
CPC分类号： H01L33/56 , H01L31/035281 , H01L33/505
摘要： An optoelectronic semiconductor component includes a radiation emitting semiconductor chip having a radiation coupling out area. Electromagnetic radiation generated in the semiconductor chip leaves the semiconductor chip via the radiation coupling out area. A converter element is disposed downstream of the semiconductor chip at its radiation coupling out area. The converter element is configured to convert electromagnetic radiation emitted by the semiconductor chip. The converter element has a first surface facing away from the radiation coupling out area. A reflective encapsulation encapsulates the semiconductor chip and portions of the converter element at side areas in a form-fitting manner. The first surface of the converter element is free of the reflective encapsulation.
摘要翻译： 光电子半导体元件包括具有辐射耦合输出区域的辐射发射半导体芯片。 在半导体芯片中产生的电磁辐射通过辐射耦合输出区离开半导体芯片。 转换器元件设置在半导体芯片的辐射耦合输出区域的下游。 转换器元件被配置为转换由半导体芯片发射的电磁辐射。 转换器元件具有背离辐射耦合输出区域的第一表面。 反射封装以形状配合的方式将半导体芯片和转换器元件的部分封装在侧面区域。 转换器元件的第一表面没有反射封装。
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3.发明申请RADIATION-EMITTING COMPONENT WITH A CONVERTER MATERIAL, WITH A THERMALLY CONDUCTIVE CONTACT AND METHOD FOR THE PRODUCTION THEREOF 审中-公开具有转换材料的辐射发射部件，具有导热触点及其生产方法公开(公告)号：US20130207148A1
公开(公告)日：2013-08-15
申请号：US13817860
申请日：2011-08-22
申请人： Gertrud Kräuter , Ralph Wirth , Stefan Lange , Frank Jermann
发明人： Gertrud Kräuter , Ralph Wirth , Stefan Lange , Frank Jermann
IPC分类号： H01L33/58
CPC分类号： H01L33/58 , H01L33/50 , H01L33/56 , H01L33/644 , H01L2224/48091 , H01L2224/48247 , H01L2933/0091 , H01S5/0092 , H01S5/02228 , H01S5/02288 , H01L2924/00014
摘要： A radiation-emitting component includes: a radiation source containing semiconductor materials which emits first radiation of a first wavelength when in operation; a transparent body including a matrix material and an inorganic filler and arranged at least in part in the beam path of the first radiation; and a converter material arranged at least in part in the beam path of the first radiation and which converts first radiation at least in part into second radiation of a second, longer wavelength.
摘要翻译： 辐射发射部件包括：辐射源，其包含在操作时发射第一波长的第一辐射的半导体材料; 透明体，其包括基体材料和无机填料，并且至少部分地布置在第一辐射的光束路径中; 以及至少部分地布置在第一辐射的光束路径中并且将第一辐射至少部分地转换成第二较长波长的第二辐射的转换器材料。
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4.发明申请Method for Producing a Housing for an Optoelectronic Semiconductor Device, Housing, and Optoelectronic Semiconductor Device 有权用于生产光电半导体器件，外壳和光电半导体器件的壳体的方法公开(公告)号：US20120280116A1
公开(公告)日：2012-11-08
申请号：US13513784
申请日：2010-11-17
申请人： Gertrud Kräuter , Bernd Barchmann
发明人： Gertrud Kräuter , Bernd Barchmann
IPC分类号： H01L23/02 , B29C45/14 , H01L23/552 , F21V15/01 , F21V7/00
CPC分类号： H01L33/60 , H01L24/73 , H01L33/486 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/00012
摘要： A method can be used to produce a housing for an optoelectronic semiconductor device. A reflector part, which has an inner area configured to reflect electromagnetic radiation, is encased in places with a housing material using an injection molding method. The inner area of the reflector part remains free of the housing material at least in places. The reflector part is formed with a first plastic material and the housing material is formed with a second plastic material that is different than the first plastic material. The first plastic material and the second plastic material differ from one another with regard to at least thermal stability or resistance to electromagnetic radiation.
摘要翻译： 可以使用一种方法来生产用于光电半导体器件的外壳。 具有构造成反射电磁辐射的内部区域的反射器部件使用注射成型方法被封装在具有外壳材料的位置。 至少在地方，反射器部分的内部区域保持没有外壳材料。 反射器部分形成有第一塑料材料，壳体材料形成有与第一塑料材料不同的第二塑料材料。 关于至少热稳定性或耐电磁辐射，第一塑料材料和第二塑料材料彼此不同。
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5.发明授权Optical element and optoelectronic component comprising such an optical element 有权包括这种光学元件的光学元件和光电子部件公开(公告)号：US08168991B2
公开(公告)日：2012-05-01
申请号：US11904173
申请日：2007-09-26
申请人： Gertrud Kräuter
发明人： Gertrud Kräuter
IPC分类号： H01L33/00
摘要： An optical element (1) is specified comprising an optical body (2) containing a plastic material. The optical body (2) is completely encapsulated by a protective layer (3) containing a silicon oxide. An optoelectronic component comprising such an optical element is furthermore described.
摘要翻译： 光学元件（1）被规定为包括含有塑料材料的光学体（2）。 光学体（2）被含有氧化硅的保护层（3）完全封装。 进一步描述包括这种光学元件的光电子部件。
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公开(公告)号：US20120070926A1
公开(公告)日：2012-03-22
申请号：US13265407
申请日：2010-04-08
申请人： Gertrud Kräuter
发明人： Gertrud Kräuter
IPC分类号： H01L33/50
CPC分类号： H01L33/50 , C23C4/134 , C23C24/04 , H01L33/22 , H01L2933/0041
摘要： A method for producing a light-emitting diode includes providing a light-emitting diode chip including a semiconductor body, and applying a luminescence conversion material to an outer area of the semiconductor body by thermal spraying such that at least part of electromagnetic radiation generated during operation of the light-emitting diode impinges on the luminescence conversion material, or providing a radiation-transmissive carrier, applying a luminescence conversion material to an outer area of the carrier by thermal spraying, and arranging the carrier at a radiation exit area of the light-emitting diode chip such that at least part of electromagnetic radiation generated during operation of the light-emitting diode impinges on the luminescence conversion material.
摘要翻译： 一种制造发光二极管的方法包括提供包括半导体本体的发光二极管芯片，并通过热喷涂将发光转换材料施加到半导体主体的外部区域，使得在操作期间产生的电磁辐射的至少一部分 所述发光二极管照射在所述发光转换材料上，或者提供辐射透射载体，通过热喷涂将发光转换材料施加到所述载体的外部区域，以及将所述载体布置在所述发光二极管的辐射出射区域处， 使得在发光二极管的操作期间产生的电磁辐射的至少一部分撞击发光转换材料。
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7.发明申请公开(公告)号：US20140145228A1
公开(公告)日：2014-05-29
申请号：US13825156
申请日：2011-09-15
申请人： Bernd Böhm , Gertrud Kräuter , Andreas Plössl
发明人： Bernd Böhm , Gertrud Kräuter , Andreas Plössl
IPC分类号： H01L33/22 , H01L31/0236
CPC分类号： H01L33/22 , H01L31/0236 , H01L31/02366 , H01L31/054 , H01L33/44 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2933/0091 , Y02E10/52 , H01L2924/00014 , H01L2924/00
摘要： An optoelectronic semiconductor chip includes an active layer with a first and a second major face, including a semiconductor material which emits or receives radiation when the semiconductor chip is in operation; a patterned layer including three-dimensional patterns for outcoupling or incoupling radiation and arranged on the first major face in a beam path of the radiation, wherein the patterned layer includes an inorganic-organic hybrid material.
摘要翻译： 光电子半导体芯片包括具有第一和第二主面的有源层，包括当半导体芯片工作时发射或接收辐射的半导体材料; 包括用于输出耦合或去耦辐射的三维图案并且布置在辐射的光束路径中的第一主面上的图案层，其中所述图案化层包括无机 - 有机杂化材料。
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公开(公告)号：US08723207B2
公开(公告)日：2014-05-13
申请号：US13276024
申请日：2011-10-18
申请人： Ulrich Jacob , Gertrud Kräuter , Andreas Plössl
发明人： Ulrich Jacob , Gertrud Kräuter , Andreas Plössl
CPC分类号： H01L33/46 , H01L33/32 , H01L33/42 , H01L33/54 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/00014 , H01L2924/00
摘要： A radiation-emitting semiconductor component, having a layer structure which includes an active layer which, in operation, emits radiation with a spectral distribution, and electrical contacts for applying a current to the layer structure, includes a coating layer which at least partially surrounds the active layer and holds back a short-wave component of the emitted radiation.
摘要翻译： 具有层结构的辐射发射半导体部件包括在工作中发射具有光谱分布的辐射的有源层和用于向层结构施加电流的电触点的层结构，其包括至少部分地围绕 有源层并且阻止所发射的辐射的短波分量。
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公开(公告)号：US20130155696A1
公开(公告)日：2013-06-20
申请号：US13634692
申请日：2011-03-07
申请人： Gertrud Kräuter
发明人： Gertrud Kräuter
IPC分类号： F21V15/06
CPC分类号： F21V29/15 , H01L23/06 , H01L33/486 , H01L33/56 , H01L2224/48091 , H01L2933/0033 , Y10T29/49002 , H01L2924/00014
摘要： An optoelectronic component includes a housing which includes a first partial region having a first thermoplastic material crosslinked by irradiation and a second partial region having a second thermoplastic material, a recess in the housing, and a radiation-emitting device disposed in the recess.
摘要翻译： 光电子部件包括壳体，其包括具有通过照射交联的第一热塑性材料的第一部分区域和具有第二热塑性材料的第二部分区域，壳体中的凹部以及设置在凹部中的辐射发射器件。
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公开(公告)号：US20120299041A1
公开(公告)日：2012-11-29
申请号：US13515256
申请日：2010-11-17
IPC分类号： H01L33/60
CPC分类号： H01L33/56 , H01L31/035281 , H01L33/505
摘要： An optoelectronic semiconductor component includes a radiation emitting semiconductor chip having a radiation coupling out area. Electromagnetic radiation generated in the semiconductor chip leaves the semiconductor chip via the radiation coupling out area. A converter element is disposed downstream of the semiconductor chip at its radiation coupling out area. The converter element is configured to convert electromagnetic radiation emitted by the semiconductor chip. The converter element has a first surface facing away from the radiation coupling out area. A reflective encapsulation encapsulates the semiconductor chip and portions of the converter element at side areas in a form-fitting manner. The first surface of the converter element is free of the reflective encapsulation.
摘要翻译： 光电子半导体元件包括具有辐射耦合输出区域的辐射发射半导体芯片。 在半导体芯片中产生的电磁辐射通过辐射耦合输出区离开半导体芯片。 转换器元件设置在半导体芯片的辐射耦合输出区域的下游。 转换器元件被配置为转换由半导体芯片发射的电磁辐射。 转换器元件具有背离辐射耦合输出区域的第一表面。 反射封装以形状配合的方式将半导体芯片和转换器元件的部分封装在侧面区域。 转换器元件的第一表面没有反射封装。
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