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公开(公告)号:US20230032500A1
公开(公告)日:2023-02-02
申请号:US17962302
申请日:2022-10-07
Applicant: KIOXIA CORPORATION
Inventor: Hiroshi MAEJIMA
Abstract: A semiconductor storage device includes memory cells, select transistors, memory strings, first and second blocks, word lines, and select gate lines. In the memory string, the current paths of plural memory cells are connected in series. When data are written in a first block, after a select gate line connected to the gate of a select transistor of one of the memory strings in the first block is selected, the data are sequentially written in the memory cells in the memory string connected to the selected select gate line. When data are written in the second block, after a word line connected to the control gates of memory cells of different memory strings in the second block is selected, the data are sequentially written in the memory cells of the different memory strings in the second block which have their control gates connected to the selected word line.
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公开(公告)号:US20220027094A1
公开(公告)日:2022-01-27
申请号:US17494015
申请日:2021-10-05
Applicant: Kioxia Corporation
Inventor: Hiroshi MAEJIMA
Abstract: According to one embodiment, a memory system includes a memory controller configured to send a first command set including arithmetic operation target data and an address that designates a memory cell to store weight data; and a nonvolatile semiconductor memory configured to receive the first command set from the memory controller, read the weight data from the memory cell designated by the address, perform an arithmetic operation based on the arithmetic operation target data and the weight data, and send arithmetic operation result data to the memory controller.
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公开(公告)号:US20250054524A1
公开(公告)日:2025-02-13
申请号:US18921736
申请日:2024-10-21
Applicant: Kioxia Corporation
Inventor: Hiroshi MAEJIMA , Toshifumi HASHIMOTO
Abstract: A first conductor extends along first and second axes. A first memory pillar is provided in the first conductor and includes a first semiconductor and a charge accumulation layer. A second conductor extends along the second axis and is in contact with the first memory pillar. A third conductor extends along the first and second axes and is arranged with a distance from the first conductor along the second axis. A second memory pillar is provided in the third conductor and includes a second semiconductor and a charge accumulation layer. The fourth conductor extends along the second axis and is in contact with the second memory pillar. The fifth conductor extends along the second axis and is coupled to the first and second memory pillars.
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公开(公告)号:US20240096417A1
公开(公告)日:2024-03-21
申请号:US18337605
申请日:2023-06-20
Applicant: Kioxia Corporation
Inventor: Hiroshi MAEJIMA , Katsuaki ISOBE , Keita KIMURA
CPC classification number: G11C16/0483 , G11C5/063 , G11C16/14 , G11C16/26
Abstract: In one embodiment, a semiconductor storage device includes a string that has one end electrically connected to a bit line, and another end electrically connected to a source line, and includes a plurality of memory cells. An operation of writing data to each of a plurality of adjacent first memory cells among the plurality of memory cells is sequentially performed in a direction from a first memory cell on a side of the source line to a first memory cell on a side of the bit line. An operation of reading data from each of the plurality of adjacent first memory cells is performed to allow a current to flow through the string in a first direction from the source line to the bit line.
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公开(公告)号:US20230298673A1
公开(公告)日:2023-09-21
申请号:US17901459
申请日:2022-09-01
Applicant: Kioxia Corporation
Inventor: Hiroshi MAEJIMA
IPC: G11C16/26 , H01L25/065 , H01L25/18 , H01L23/00
CPC classification number: G11C16/26 , H01L24/08 , H01L25/0657 , H01L25/18 , H01L2224/08145 , H01L2924/1431 , H01L2924/14511
Abstract: A memory device includes a first memory cell and a second memory cell each corresponding to a first column address, a first sense amplifier unit, a first bit line connected between the first memory cell and the first sense amplifier unit, and a second bit line connected between the second memory cell and the first sense amplifier unit.
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公开(公告)号:US20230154547A1
公开(公告)日:2023-05-18
申请号:US18156654
申请日:2023-01-19
Applicant: KIOXIA CORPORATION
Inventor: Takeshi HIOKA , Tsukasa KOBAYASHI , Koji KATO , Yuki SHIMIZU , Hiroshi MAEJIMA
CPC classification number: G11C16/26 , G11C16/24 , G11C16/08 , G11C16/10 , G11C16/30 , H10B43/27 , H10B43/30
Abstract: According to one embodiment, a semiconductor memory device includes first and second memory cells; a first word line connected to the first and second memory cells; a first bit line connected to the first memory cell; a second bit line connected to the second memory cell; a first sense amplifier connected to the first bit line; a second sense amplifier connected to the second bit line; a voltage generation circuit; and a first row decoder which supplies a voltage to the first word line.
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公开(公告)号:US20220320065A1
公开(公告)日:2022-10-06
申请号:US17847528
申请日:2022-06-23
Applicant: KIOXIA CORPORATION
Inventor: Tomoya SANUKI , Toshio FUJISAWA , Hiroshi MAEJIMA , Takashi MAEDA
Abstract: A semiconductor storage device includes a plurality of memory chips and a circuit chip. The plurality of memory chips and the circuit chip are stacked on each other. Each of the plurality of memory chips has a memory cell array that includes a plurality of memory cells. The circuit chip includes a data latch configured to store page data for writing or reading data into or from the memory cell array of each of the memory chips.
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公开(公告)号:US20220122666A1
公开(公告)日:2022-04-21
申请号:US17565241
申请日:2021-12-29
Applicant: KIOXIA CORPORATION
Inventor: Hiroshi MAEJIMA
IPC: G11C16/04 , G11C5/06 , G11C7/06 , H01L27/11565 , H01L27/11573 , H01L27/11582 , G11C16/26 , G11C16/08 , H01L23/522 , H01L23/528 , H01L27/1157
Abstract: A semiconductor storage device includes word lines extending in first and second directions, and separated from each other in a third direction, sense amplifier circuits that partially overlap the word lines in the third direction, memory strings intersecting the word lines and extending in the third direction, memory-side bit lines extending in the first direction, separated from each other in the second direction, and including first and second adjacent memory-side bit lines, circuit-side bit lines between the word lines and the sense amplifier circuits and partially overlapping the respective memory-side bit lines in the third direction, and contact plugs extending in the third direction and respectively connecting the memory-side bit lines and the circuit-side bit lines. The contact plugs include first and second contract plugs that are electrically connected to the first and second memory-side bit lines, respectively, and are not aligned along the first or second direction.
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公开(公告)号:US20210343350A1
公开(公告)日:2021-11-04
申请号:US17377857
申请日:2021-07-16
Applicant: KIOXIA CORPORATION
Inventor: Hiroshi MAEJIMA
Abstract: A memory device includes first and second memory strings, first and second word lines and a controller. The first memory string includes first and second memory cells, a first select transistor, a second select transistor, and a third select transistor between the first and second memory cells. The second memory string includes third and fourth memory cells, a fourth select transistor above the third memory cell, a fifth select transistor below the fourth memory cell, and a sixth select transistor between the third and fourth memory cells. The first word line is electrically connected to gates of the first and third memory cells. The second word line is electrically connected to gates of the second and fourth memory cells. The controller is configured to execute a read operation on one of the memory cells, the read operation including a first phase and a second phase after the first phase.
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公开(公告)号:US20210272946A1
公开(公告)日:2021-09-02
申请号:US17006378
申请日:2020-08-28
Applicant: KIOXIA CORPORATION
Inventor: Tomoya SANUKI , Toshio FUJISAWA , Hiroshi MAEJIMA , Takashi MAEDA
Abstract: A semiconductor storage device includes a plurality of memory chips and a circuit chip. The plurality of memory chips and the circuit chip are stacked on each other. Each of the plurality of memory chips has a memory cell array that includes a plurality of memory cells. The circuit chip includes a data latch configured to store page data for writing or reading data into or from the memory cell array of each of the memory chips.
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