公开(公告)号：US20060158067A1

公开(公告)日：2006-07-20

申请号：US11326142

申请日：2006-01-05

Applicant: Kiyoshi Aratake ,  Keiji Sato

Inventor： Kiyoshi Aratake ,  Keiji Sato

IPC: H03H9/10

CPC classification number: H03H9/0542 ,  H03H3/02 ,  H03H9/0595 ,  H03H9/1035 ,  H03H9/215 ,  H05K3/3442 ,  H05K2201/10083 ,  H05K2201/10909 ,  Y02P70/613

Abstract: The present invention is enabling to easily solder again in soldering of a surface mount type piezoelectric vibrator. An external electrode is formed by an alloy metal of Cr and Ni, namely, NiCr. Further, on the surface of NiCr, an oxidation resistant film for oxidation resistance is formed by a film of Au. Therefore, in the structure of an external electrode, the layer of NiCr is formed on the surface of glass, and further, the layer of Au is formed thereon. In the meantime, NiCr and Au are deposited by spattering (a spatter method) as a film with a low stress. In the external electrode of such a structure, the layer of Au is dispersed in the solder by soldering, however, since Cr in NiCr reduces the diffusion speed of Ni into the solder, Ni is remained in the external terminal. Since Ni is a metal to make the alloy metal with the solder, it is possible to perform soldering again by removing this quartz crystal vibrator.

Abstract translation: 本发明能够在表面安装型压电振动器的焊接中再次容易地焊接。 外部电极由Cr和Ni的合金金属NiCr形成。 此外，在NiCr的表面，通过Au膜形成抗氧化性的抗氧化膜。 因此，在外部电极的结构中，在玻璃的表面上形成有NiCr层，并且在其上形成Au层。 同时，NiCr和Au通过溅射（飞溅法）沉积为低应力的膜。 在这种结构的外部电极中，通过焊接将Au层分散在焊料中，然而，由于NiCr中的Cr降低了Ni进入焊料的扩散速度，所以在外部端子中保留有Ni。 由于Ni是用焊料制造合金金属的金属，所以可以通过除去该石英晶体振子来再次进行焊接。

公开(公告)号：US06686219B2

公开(公告)日：2004-02-03

申请号：US10205914

申请日：2002-07-26

Applicant: Kiyoshi Aratake ,  Masayoshi Shiraishi

Inventor： Kiyoshi Aratake ,  Masayoshi Shiraishi

IPC: H01L2100

CPC classification number: H03H9/215 ,  H01L41/053 ,  H03H9/0595 ,  H03H9/1035 ,  Y10T29/42

Abstract: A method of fabricating a piezoelectric vibrator comprises providing a piezoelectric oscillating plate having a piezoelectric vibrator piece and frame integrally connected to a base end portion of the piezoelectric vibrator piece and surrounding the piezoelectric vibrator piece. A pair of excitation electrodes is disposed on surfaces of two sides of the piezoelectric vibrator piece for vibrating the piezoelectric vibrator piece. Bond films are formed on upper and lower surfaces of the frame and are connected to the excitation electrodes. Shortcircuiting electrodes are disposed on the piezoelectric oscillating plate for causing a shortcircuit to electrically connect the bond films to each other. The piezoelectric vibrator piece is covered to seal the piezoelectric vibrator piece in an airtight manner via the bond films without hampering vibration of the piezoelectric vibrator piece.

Abstract translation: 一种制造压电振动器的方法，包括提供一种压电振荡板，该压电振荡板具有与压电振动片的基端部整体连接并围绕压电振动片的压电振动片和框架。 一对激励电极设置在压电振动片的两侧的表面上，用于振动压电振动片。 结合膜形成在框架的上表面和下表面上并连接到激励电极。 短路电极设置在压电振荡板上，用于使短路将粘结膜彼此电连接。 压电振子片被覆盖以通过粘结膜以气密方式密封压电振动片，而不会妨碍压电振动片的振动。

公开(公告)号：US08638180B2

公开(公告)日：2014-01-28

申请号：US13112472

申请日：2011-05-20

Applicant: Kiyoshi Aratake

Inventor： Kiyoshi Aratake

IPC: H03B5/32

CPC classification number: H03H9/21 ,  H03H9/1021

Abstract: A method for manufacturing a piezoelectric vibrator is provided. The piezoelectric vibrator includes: a package in which a first substrate and a second substrate are superimposed so as to form a cavity therebetween; extraction electrodes which are formed on the first substrate so as to be extracted from the inner side of the cavity to an outer edge of the first substrate; a piezoelectric vibrating reed which is sealed in the cavity and electrically connected to the extraction electrodes at an inner side of the cavity; and outer electrodes which are formed on an outer surface of the package so as to be electrically connected to the extraction electrodes at the outer side of the cavity. The method includes: a bonding film forming step of forming a bonding film on at least one of the first substrate and the second substrate using a low-melting-point glass so as to bond the two substrates; a mounting step of electrically connecting the piezoelectric vibrating reed to the extraction electrodes formed on the first substrate; and a bonding step of superimposing the first substrate and the second substrate onto each other with the bonding film disposed therebetween while heating the bonding film to a predetermined bonding temperature to thereby bond the two substrates by the bonding film.

Abstract translation: 提供一种压电振动器的制造方法。 压电振子包括：第一基板和第二基板叠加在其中以在其间形成空腔的封装; 提取电极，其形成在所述第一基板上以便从所述空腔的内侧提取到所述第一基板的外边缘; 压电振动片，其密封在所述空腔中并且在所述空腔的内侧电连接到所述提取电极; 以及外部电极，其形成在所述封装的外表面上，以在所述空腔的外侧电连接到所述引出电极。 该方法包括：接合膜形成步骤，使用低熔点玻璃在至少一个第一基板和第二基板上形成接合膜，以便接合两个基板; 将压电振动片电连接到形成在第一基板上的引出电极的安装步骤; 以及将第一基板和第二基板叠置在一起，并将接合膜加热到预定的接合温度，由此通过接合膜将两个基板接合的结合工序。

公开(公告)号：US08441799B2

公开(公告)日：2013-05-14

申请号：US12759417

申请日：2010-04-13

Applicant: Hitoshi Takeuchi ,  Keiji Sato ,  Kiyoshi Aratake ,  Masashi Numata ,  Takahiko Nakamura ,  Daisuke Terada ,  Takeshi Sugiyama

Inventor： Hitoshi Takeuchi ,  Keiji Sato ,  Kiyoshi Aratake ,  Masashi Numata ,  Takahiko Nakamura ,  Daisuke Terada ,  Takeshi Sugiyama

IPC: H05K1/00 ,  H05K1/18 ,  H05K7/00

CPC classification number: H01L23/055 ,  H01L2924/0002 ,  H01L2924/19041 ,  Y10T29/49002 ,  Y10T29/49124 ,  H01L2924/00

Abstract: To provide an improved solderability for mounting an electronic component onto a circuit board, a package of an electronic component (1) is formed by bonding together a base (3) made of glass and a lid (2). Outer electrodes (8) and (18) are formed on a bottom surface of the base (3), and the outer electrodes (8) and (18) are respectively connected to through electrodes (7) and (17). The outer electrodes (8) and (18) each have a laminated structure of three CrAu layers, that is, from a Cr layer (first layer) to an Au layer (sixth layer). When the outer electrodes (8) and (18) are soldered onto a circuit board, the Au layers as the second, fourth, and sixth layers are dissolved into solder, whereas the Cr layers as the third and fifth layers, which hardly form an intermetallic compound with solder, are separated to remain in solder.

Abstract translation: 为了提供用于将电子部件安装到电路板上的改进的可焊性，通过将由玻璃制成的基部（3）和盖（2）接合在一起而形成电子部件（1）的封装。 外电极（8）和（18）形成在基座（3）的底表面上，外电极（8）和（18）分别连接到电极（7）和（17）。 外部电极（8）和（18）各自具有三个CrAu层的层压结构，即从Cr层（第一层）到Au层（第六层）。 当将外电极（8）和（18）焊接到电路板上时，作为第二层，第四层和第六层的Au层溶解在焊料中，而作为第三层和第五层的Cr层几乎不形成 金属间化合物与焊料分离，保留在焊料中。

公开(公告)号：US20120224460A1

公开(公告)日：2012-09-06

申请号：US13398350

申请日：2012-02-16

Applicant: Kiyoshi Aratake

Inventor： Kiyoshi Aratake

IPC: G04C11/02 ,  H03B5/36 ,  H01L41/047

CPC classification number: H03H9/1021 ,  G04C3/047 ,  G04R20/10 ,  H03H9/215

Abstract: A piezoelectric vibrator, an oscillator, an electronic device and a ratio timepiece are provided which are capable of increasing a capacitance C0 while achieving miniaturization and cost reduction. The piezoelectric vibrator includes a base substrate, a lid substrate, a piezoelectric vibrating reed on which an excitation electrode is formed, and external electrodes. An electrode pattern for capacitance adjustment, which extends along a routing electrode, is provided extending from a routing electrode.

Abstract translation: 提供一种能够在实现小型化和降低成本的同时增加电容C0的压电振动器，振荡器，电子装置和比率时计。 压电振动器包括基底基板，盖基板，形成有激励电极的压电振动片和外部电极。 设置从布线电极延伸的沿着布线电极延伸的用于电容调整的电极图案。

公开(公告)号：US08256107B2

公开(公告)日：2012-09-04

申请号：US12547917

申请日：2009-08-26

Applicant: Takahiko Nakamura ,  Keiji Sato ,  Hitoshi Takeuchi ,  Kiyoshi Aratake ,  Masashi Numata

Inventor： Takahiko Nakamura ,  Keiji Sato ,  Hitoshi Takeuchi ,  Kiyoshi Aratake ,  Masashi Numata

IPC: H05K3/30

CPC classification number: H03H9/1021 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49165

Abstract: An electronic-parts package includes a base member, a conductive member extending through the base member, the conductive member having the insulating substance on the surface removed by polishing, electronic parts disposed on one surface of the conductive member through a connection portion, an exterior electrode disposed through a metal film on the opposite surface of the surface of the base member on which the electronic parts is disposed, and a cap member that protects the electronic parts on the base member.

Abstract translation: 一种电子零件包装，包括：基底构件，延伸穿过基底构件的导电构件，通过抛光去除表面上的绝缘物质的导电构件;通过连接部分设置在导电构件的一个表面上的电子部件，外部 通过金属膜设置的电极，所述金属膜位于其上设置有电子部件的基底构件的表面的相对表面上，以及帽构件，其保护基底构件上的电子部件。

公开(公告)号：US20120206999A1

公开(公告)日：2012-08-16

申请号：US13369747

申请日：2012-02-09

Applicant: Kiyoshi Aratake

Inventor： Kiyoshi Aratake

IPC: H01L41/053 ,  G04C11/02 ,  H01L41/22 ,  H03B5/36

CPC classification number: G04R20/10 ,  H03H3/02 ,  H03H9/0519 ,  H03H9/1021 ,  H03H2003/0478 ,  H03H2003/0485

Abstract: A crystal device includes leading electrodes that are formed on a base substrate, and a bump for mounting a piezoelectric vibrating reed on the leading electrodes, and alignment marks for performing the positioning of the bump are formed on the base substrate separately from the leading electrodes.

Abstract translation: 晶体装置包括形成在基底基板上的引线电极和用于在前导电极上安装压电振动片的凸起，以及用于执行凸块定位的对准标记与引导电极分开地形成在基底基板上。

公开(公告)号：US08148875B2

公开(公告)日：2012-04-03

申请号：US12845142

申请日：2010-07-28

Applicant: Kiyoshi Aratake

Inventor： Kiyoshi Aratake

IPC: H01L41/053 ,  H03H9/17

CPC classification number: H03H9/21 ,  H03H3/04 ,  H03H9/02149 ,  H03H9/1021 ,  H03H2003/026 ,  H03H2003/0478 ,  H03H2003/0492 ,  H03H2009/02165 ,  Y10T29/42

Abstract: A piezoelectric vibrator which can be manufactured efficiently and a manufacturing method thereof are provided. The piezoelectric vibrator includes: a tuning-fork-type piezoelectric vibrating piece which has a pair of vibration arm portions, excitation electrodes formed on base end portions of the vibration arm portions, and weight metal films formed on distal end portions of the vibration arm portions; and a package which houses the piezoelectric vibrating piece therein. A gettering film on which a laser radiation flaw is formed is formed on intermediate portions between the base end portions and the distal end portions of the vibration arm portions. A first metal film included in the excitation electrode, a second metal film included in the weight metal film and the gettering film are formed using the same material.

Abstract translation: 提供一种能够有效制造的压电振动器及其制造方法。 压电振子包括：音叉型压电振动片，其具有一对振动臂部，形成在振动臂部的基端部的激励电极，以及形成在振动臂部的前端部的重量金属膜 ; 以及其中容纳压电振动片的封装。 在基端部和振动臂部的前端部之间的中间部分形成有形成有激光辐射缺陷的吸气膜。 包含在激发电极中的第一金属膜，使用相同的材​​料形成包含在重量金属膜中的第二金属膜和吸气膜。

公开(公告)号：US20120044025A1

公开(公告)日：2012-02-23

申请号：US13115698

申请日：2011-05-25

Applicant: Takahiko Nakamura ,  Keiji Sato ,  Hitoshi Takeuchi ,  Kiyoshi Aratake ,  Masashi Numata

Inventor： Takahiko Nakamura ,  Keiji Sato ,  Hitoshi Takeuchi ,  Kiyoshi Aratake ,  Masashi Numata

IPC: H03B5/30 ,  H05K3/00

CPC classification number: H03H9/1021 ,  B81B7/007 ,  B81B2207/096 ,  H01L21/486 ,  H01L21/50 ,  H01L23/10 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32227 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81444 ,  H01L2224/81895 ,  H01L2224/832 ,  H01L2224/83801 ,  H01L2924/1461 ,  H01L2924/161 ,  H05K1/114 ,  H05K3/4046 ,  H05K2201/10075 ,  H05K2201/10371 ,  Y10T29/49124 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic device is provided which includes a base, a through-electrode that passes through the base and from which an insulating material on an end face thereof is removed by polishing, a circuit pattern that is formed on an end face of the through-electrode, an electronic component that is disposed via an internal wiring formed on the circuit pattern, an electrode pattern that is formed on the surface of the base opposite to the surface on which the electronic component is disposed and that is connected to the other end face of the through-electrode, an external electrode that is formed on the electrode pattern, and a cap that is bonded to the base so as to protect the electronic component on the base.

Abstract translation: 提供了一种电子器件，其包括基底，穿过基底的通孔，通过抛光除去其端面上的绝缘材料，形成在通孔的端面上的电路图案 ，电子部件，其经由形成在所述电路图案上的内部配线设置，电极图案，形成在所述基板的与所述电子部件配置的表面相反的表面上，并且连接到所述电子部件的另一端面 所述贯通电极，形成在所述电极图案上的外部电极和与所述基底接合以保护所述电子部件在所述基部上的盖。

公开(公告)号：US08069543B2

公开(公告)日：2011-12-06

申请号：US12858171

申请日：2010-08-17

Applicant: Masashi Numata ,  Kiyoshi Aratake

Inventor： Masashi Numata ,  Kiyoshi Aratake

IPC: H04R17/10

CPC classification number: H03H9/21 ,  H01L23/055 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/3011 ,  H03H9/0519 ,  H03H9/0542 ,  H03H9/1021 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49165 ,  Y10T428/2982 ,  H01L2924/00

Abstract: There is provided a piezoelectric vibrator 1 that includes a base substrate 2, a lid substrate 3, a piezoelectric vibrating reed 4, a pair of external electrodes 38 and 39, a pair of through electrodes 32 and 33, and routing electrodes 36 and 37. The lid substrate 3 includes a recess 3a for a cavity and is bonded to the base substrate so that the recess faces the base substrate. The piezoelectric vibrating reed 4 is bonded to the upper surface of the base substrate so as to be received in a cavity that is formed between both the substrates. The pair of external electrodes 38 and 39 is formed on the lower surface of the base substrate. The pair of through electrodes 32 and 33 is formed by hardening paste P, which contains a plurality of metal fine particles and a plurality of metal beads P1, so as to pass through the base substrate, maintains airtightness in the cavity, and is electrically connected to the pair of external electrodes, respectively. The routing electrodes 36 and 37 are formed on the upper surface of the base substrate and electrically connect the pair of through electrodes to the piezoelectric vibrating reed. The melting point of the metal bead is higher than the firing temperature of the paste.

Abstract translation: 提供了一种压电振动器1，其包括基底基板2，盖基板3，压电振动片4，一对外部电极38和39，一对贯通电极32和33以及布线电极36和37。 盖基板3包括用于空腔的凹部3a，并且与基底基板接合，使得凹部面向基底。 压电振动片4结合到基底基板的上表面，以便被容纳在形成在两个基片之间的空腔中。 一对外部电极38和39形成在基底基板的下表面上。 一对贯通电极32,33由含有多个金属微粒和多个金属珠P1的硬化浆料P形成，以便通过基底基板，保持空腔中的气密性，并且电连接 分别连接到一对外部电极。 布线电极36和37形成在基底基板的上表面上，并将一对通孔电连接到压电振动片。 金属珠的熔点高于糊料的烧成温度。