摘要:
A system for entering a temperature setting into a memory store and for displaying it, wherein the temperature setting includes a temperature level portion and a temperature scale portion. The temperature level portion corresponds to the temperature at which a microwave oven, for example, is to be set and the temperature scale portion indicates whether the temperature level portion is calibrated in degrees Fahrenheit or degrees Celsius. The temperature level is inputted through a decimal keyboard and a key signal encoder. Gating circuits transfer the temperature level from the key signal encoder and the temperature scale from a temperature unit code generator to a memory under control of a preprogrammed instruction data generator. A display circuit and display unit are coupled to the memory for displaying the temperature setting. A temperature level is supplied to a temperature setting register through another gating circuit to provide the temperature level to a temperature control circuit external to the temperature entering and displaying system.
摘要:
An electronic calculator having a printer detects the key entry by one of arithmetic keys following the numerical key entry and prints one of arithmetic symbols and entered number respectively at the left-hand side and right-hand side of the print sheet.
摘要:
Disclosed is a power level setting/display circuit for a microwave oven which comprises a logical gate circuit for feeding a maximum power level signal to a setting register by means of a function key for power level setting, a logical gate circuit for supplying the fed maximum power level signal to a display register, a logical gate circuit for storing a power level command signal in a temporary storage register, a logical gate circuit for clearing the contents of the display register simultaneously with such storage of the power level command signal, a logical gate circuit forming a series closed loop by means of the display register and temporary storage register, whereby the power level command signal stored in the temporary storage register will be shifted to the bottom digit of the display register, and a logical gate circuit for supplying the power level command signal stored in the display register to the setting register.
摘要:
When compression molding is performed continuously, lumps of molten synthetic resin (drops), which are supplied by extrusion, are continuously, accurately, and rapidly inserted into plurality of compression molding dies which are rotatingly movable. A method and device for continuously supplying drops into female moldings which are rotatingly movable for manufacturing moldings, wherein synthetic resin in molten condition extruded from an extrusion opening is cut by a cutter attached to a holding mechanism to form the molten resin into drops in a determined quantity, the drops are held and conveyed by the holding mechanism, and the drops are forcibly inserted and supplied into the concaves of the female moldings. At that time the holding mechanism on the rotary-and movable type drop supply is made to approach the rotating molding die and the rotation path of the holding mechanism is made to overlap with that of the molding die within a determined area to make the movement of the holding mechanisms follow that of the molding die.
摘要:
To provide a preform, a bottle and a preform molding apparatus capable of preventing lowering in the mechanical strength of a preform, reducing the amount of a resin material, as well as improving productivity.A preform mold 1e used in the preform molding apparatus has a mouth neck part mold 2, a body part mold 3e and a core mold 163, and the body part mold 3e has, on the outer edge of the upper surface of a cylindrical protrusion part 31e, an annular protrusion 33 which controls the moving direction of a solidified film 118 and a solidified film 117 which have been peeled.
摘要:
A substrate of multilayered structure having a plurality of sets of an insulation layer and a wiring line layer, and having one face for mounting a semiconductor element thereon and the other face on which external connection terminals are to be provided, the face for mounting a semiconductor element being provided with pads to be bonded to an electrode terminal of the semiconductor element, the other face being provided with pads to be bonded to an external connection terminal, such as a terminal formed of a solder ball, and the wiring line layers on both sides of an insulation layer being connected with each other by vias piercing the insulation layer, wherein the surfaces of the pads to be bonded to an electrode terminal of a semiconductor element are flat and are in the same plane. A method of manufacturing such a multilayered substrate is also disclosed.
摘要:
According to the present invention, there is provided a new GaN-based field effect transistor of a normally-off type, which has an extremely small ON resistance during operation and is capable of a large-current operation. The GaN-based field effect transistor according to the present invention comprises source and drain electrodes; a channel portion made of a first GaN-based semiconducting material that is an i-GaN-based semiconducting material or a p-GaN-based semiconducting material, the channel portion being so formed as to be electrically connected to the source and drain electrodes; first and second electron supply portions made of a second GaN-based semiconducting material having greater bandgap energy than the first GaN-based semiconducting material, the first and second electron supply portions being joined to the channel portion and located separately from each other; an insulating layer formed on the surface of the channel portion, which spreads between the first and second electron supply portions; and a gate electrode disposed on the insulating layer.
摘要:
An objective of this invention is to provide to provide a direct methanol type fuel cell power generator which can operate without destruction due to water freezing or reduction in an output even when the system is exposed to a low temperature, and an operating method thereof. This invention provides a method for operating a direct methanol type fuel cell power generator, comprising the steps of feeding an aqueous methanol solution into a fuel flow path in the direct methanol type fuel cell; replacing the aqueous methanol solution in the fuel flow path with a proton-acid antifreezing liquid; and replacing the proton-acid antifreezing liquid in the fuel flow path with the aqueous methanol solution. This invention further provides a direct methanol type fuel cell power generator, comprising at least a direct methanol type fuel cell; a fuel tank filled with an aqueous methanol solution; and an antifreezing liquid tank filled with a proton-acid antifreezing liquid.
摘要:
A wiring substrate; a wiring head which guides optical fibers to the lead end thereof and forms an optical fiber path; an optical fiber feed mechanism which feeds the optical fiber into the optical fiber path; an optical fiber contact mechanism which brings the optical fiber, which has been guided to the lead end of the wiring head, and the wiring substrate into contact; an XY movement mechanism, which moves the wiring substrate and the wiring head relative to one anther in the X and Y directions; and an optical fiber affixing mechanism which successively affixes, to the wiring substrate, the optical fiber which has been brought into contact with the wiring substrate during movement by the XY movement mechanism; are provided. A wiring method which conducts the wiring of an optical fiber onto a wiring substrate, wherein the feeding of this optical fiber is adjusted by an optical fiber feed mechanism so that the tension thereof is within a fixed range, this optical fiber is wired onto the wiring substrate by a wiring mechanism, and the optical fiber is cut to the length required for the wiring by the optical fiber cutting mechanism.
摘要:
To provide a semiconductor package on which a multilayer circuit is formed by a so-called build-up system, capable of assuredly mounting a semiconductor chip and improving the reliability of a semiconductor device yield, and durability. The semiconductor package includes an insulating core substrate 10 on one surface of which is defined a semiconductor chip mounting area 20 for mounting the semiconductor chip 14. A circuit pattern 12 made of a metallic foil is also formed on this surface so that one end thereof extends into the semiconductor chip mounting area 20. Film-like circuit patterns 22 connected to the circuit pattern are formed in a multi-layered manner via a film-like insulating layer 18 around the semiconductor chip mounting area on the core substrate. By these film-like circuit patterns and the film-like insulating layer, the semiconductor chip mounting area 20 is defined as a recess.