公开(公告)号：US20100277083A1

公开(公告)日：2010-11-04

申请号：US12835149

申请日：2010-07-13

申请人： Kiyoshi Nishimura ,  Hirokazu Otake ,  Tomohiro Sanpei ,  Shuhei Matsuda

发明人： Kiyoshi Nishimura ,  Hirokazu Otake ,  Tomohiro Sanpei ,  Shuhei Matsuda

IPC分类号： H05B37/02

CPC分类号： H05B33/089 ,  F21K9/232 ,  F21V3/00 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/19107 ,  H05B33/0812 ,  H05B33/0827 ,  H05K1/0262 ,  H05K2201/10106 ,  Y02B20/343 ,  Y10T156/1961 ,  H01L2924/00012 ,  H01L2924/00014

摘要： According to one embodiment, a lighting device includes a device board, a rectification device connected to a commercial power supply, a series LED circuit, and a transistor (current limiter) which limits a maximum current flowing through the series LED circuit. The series circuit mounted on the device board is configured by connecting in series a plurality of LED elements. Each of the LED elements lights when an output voltage of the rectification device is applied to the series circuit. A number of LED elements included in the series circuit is set in a manner that a voltage applied to the series LED circuit is 70 to 90% of the output voltage of the rectification device.

摘要翻译： 根据一个实施例，照明装置包括装置板，连接到商用电源的整流装置，串联LED电路和限制流过串联LED电路的最大电流的晶体管（限流器）。 安装在设备板上的串联电路通过串联连接多个LED元件而构成。 当整流装置的输出电压施加到串联电路时，每个LED元件点亮。 包括在串联电路中的多个LED元件被设置为施加到串联LED电路的电压是整流装置的输出电压的70至90％的方式。

公开(公告)号：US20100301731A1

公开(公告)日：2010-12-02

申请号：US12790395

申请日：2010-05-28

申请人： KAZUTO MORIKAWA ,  Masahiro Izumi ,  Kiyoshi Nishimura ,  Tomohiro Sanpei ,  Erika Takenaka ,  Shuhei Matsuda

发明人： KAZUTO MORIKAWA ,  Masahiro Izumi ,  Kiyoshi Nishimura ,  Tomohiro Sanpei ,  Erika Takenaka ,  Shuhei Matsuda

IPC分类号： H01K1/28

CPC分类号： H05K1/0274 ,  F21K9/23 ,  F21K9/232 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H05K3/284 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014

摘要： According to one embodiment, a light-emitting module includes a module substrate, a reflective layer, conductive layers, a light-emitting element, and a sealing member. A reflective layer is provided on a surface of an insulating layer of the module substrate, and the conductive layers are provided in the vicinity of the reflective layer. Further, the light-emitting element is provided on the reflective layer. Moreover, the translucent sealing member has translucency and bury the reflective layer, the conductive layers, and the light-emitting element. The ratio of the area occupied by the reflective layer and the conductive layers to the sealed region sealed by the sealing member is equal to or greater than 80%.

摘要翻译： 根据一个实施例，发光模块包括模块衬底，反射层，导电层，发光元件和密封构件。 在模块基板的绝缘层的表面上设置反射层，并且在反射层附近设置导电层。 此外，发光元件设置在反射层上。 此外，半透明密封构件具有半透明性并且掩埋反射层，导电层和发光元件。 反射层和导电层占据密封部件密封的密封区域的面积的比例等于或大于80％。

公开(公告)号：US08678618B2

公开(公告)日：2014-03-25

申请号：US12885849

申请日：2010-09-20

申请人： Makoto Sakai ,  Masao Segawa ,  Nobuo Shibano ,  Kiyoshi Nishimura ,  Kozo Ogawa ,  Masahiko Kamata ,  Toshiya Tanaka ,  Miho Watanabe ,  Shuhei Matsuda

发明人： Makoto Sakai ,  Masao Segawa ,  Nobuo Shibano ,  Kiyoshi Nishimura ,  Kozo Ogawa ,  Masahiko Kamata ,  Toshiya Tanaka ,  Miho Watanabe ,  Shuhei Matsuda

IPC分类号： F21V29/00

CPC分类号： F21V29/507 ,  F21K9/232 ,  F21V3/04 ,  F21V29/506 ,  F21V29/89 ,  F21Y2107/00 ,  F21Y2107/40 ,  F21Y2115/10

摘要： A self-ballasted lamp includes: a base body; a light-emitting module and a globe which are provided at one end side of the base body; a cap provided at the other end side of the base body; and a lighting circuit housed between the base body and the cap. The light-emitting module has light-emitting portions each using a semiconductor light-emitting element, and a support portion projected at one end side of the base body, and the light-emitting portions are disposed at least on a circumferential surface of the support portion. A light-transmissive member is interposed between the light-emitting module and an inner face of the globe.

摘要翻译： 自镇流灯包括：基体; 发光模块和球体，其设置在所述基体的一端侧; 设置在所述基体的另一端侧的盖; 以及容纳在基体和盖之间的照明电路。 发光模块具有各自使用半导体发光元件的发光部和在基体的一端侧突出的支撑部，发光部至少设置在支撑体的周面上 一部分。 在发光模块和球体的内表面之间插入透光构件。

公开(公告)号：US08368113B2

公开(公告)日：2013-02-05

申请号：US13114609

申请日：2011-05-24

申请人： Shuhei Matsuda ,  Erika Takenaka ,  Tomohiro Sanpei ,  Kazuto Morikawa ,  Masahiro Izumi ,  Kiyoshi Nishimura

发明人： Shuhei Matsuda ,  Erika Takenaka ,  Tomohiro Sanpei ,  Kazuto Morikawa ,  Masahiro Izumi ,  Kiyoshi Nishimura

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  F21V7/06 ,  F21V29/76 ,  F21Y2115/10 ,  H01L24/45 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to one embodiment, a light emitting device includes a ceramics substrate, a metallic thermally-conductive layer formed on the substrate in which the substrate involves no electric connection, a light emitting element mounted on the metallic thermally-conductive layer, and a metallic bonding layer interposed between the metallic thermally-conductive layer and the light emitting element to bond the light emitting element to the metallic thermally-conductive layer.

摘要翻译： 根据一个实施例，发光器件包括陶瓷衬底，形成在衬底上的金属导热层，其中衬底不涉及电连接，安装在金属导热层上的发光元件和金属接合 介于金属导热层和发光元件之间的层，以将发光元件结合到金属导热层。

公开(公告)号：US08232709B2

公开(公告)日：2012-07-31

申请号：US12909535

申请日：2010-10-21

申请人： Nobuhiko Betsuda ,  Kozo Ogawa ,  Shuhei Matsuda ,  Kiyoshi Nishimura ,  Nobuo Shibano

发明人： Nobuhiko Betsuda ,  Kozo Ogawa ,  Shuhei Matsuda ,  Kiyoshi Nishimura ,  Nobuo Shibano

IPC分类号： H01J1/02 ,  H01J1/62 ,  H01J63/04

CPC分类号： H01L33/641 ,  F21K9/00 ,  F21S8/02 ,  F21V17/12 ,  F21V23/00 ,  F21V29/75 ,  F21V29/76 ,  F21Y2107/90 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01322 ,  H05K1/0209 ,  H05K1/0306 ,  H05K2201/09136 ,  H05K2201/09781 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to one embodiment, a light-emitting apparatus includes an insulating base made of ceramics, an obverse metallic component dividedly arranged on the front surface of the insulating base, semiconductor light-emitting elements mounted on the obverse metallic component, and a reverse metallic component arranged on a back surface of the insulating base and having a thickness same as or smaller than a thickness of the obverse metallic component and a volume equal to 50% or larger of a volume of the obverse metallic component.

摘要翻译： 根据一个实施例，一种发光装置包括由陶瓷制成的绝缘基底，分隔地布置在绝缘基底的前表面上的正面金属部件，安装在正面金属部件上的半导体发光元件和反向金属部件 布置在绝缘基底的背面上，其厚度等于或小于正金属成分的厚度，并且体积等于正面金属成分的体积的50％以上。

公开(公告)号：US08098003B2

公开(公告)日：2012-01-17

申请号：US12790395

申请日：2010-05-28

申请人： Kazuto Morikawa ,  Masahiro Izumi ,  Kiyoshi Nishimura ,  Tomohiro Sanpei ,  Erika Takenaka ,  Shuhei Matsuda

发明人： Kazuto Morikawa ,  Masahiro Izumi ,  Kiyoshi Nishimura ,  Tomohiro Sanpei ,  Erika Takenaka ,  Shuhei Matsuda

IPC分类号： H01J5/16

CPC分类号： H05K1/0274 ,  F21K9/23 ,  F21K9/232 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H05K3/284 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014

摘要： According to one embodiment, a light-emitting module includes a module substrate, a reflective layer, conductive layers, a light-emitting element, and a sealing member. A reflective layer is provided on a surface of an insulating layer of the module substrate, and the conductive layers are provided in the vicinity of the reflective layer. Further, the light-emitting element is provided on the reflective layer. Moreover, the translucent sealing member has translucency and bury the reflective layer, the conductive layers, and the light-emitting element. The ratio of the area occupied by the reflective layer and the conductive layers to the sealed region sealed by the sealing member is equal to or greater than 80%.

摘要翻译： 根据一个实施例，发光模块包括模块衬底，反射层，导电层，发光元件和密封构件。 在模块基板的绝缘层的表面上设置反射层，并且在反射层附近设置导电层。 此外，发光元件设置在反射层上。 此外，半透明密封构件具有半透明性并且掩埋反射层，导电层和发光元件。 反射层和导电层占据密封部件密封的密封区域的面积的比例等于或大于80％。

公开(公告)号：US20110089805A1

公开(公告)日：2011-04-21

申请号：US12909535

申请日：2010-10-21

申请人： Nobuhiko Betsuda ,  Kozo Ogawa ,  Shuhei Matsuda ,  Kiyoshi Nishimura ,  Nobuo Shibano

发明人： Nobuhiko Betsuda ,  Kozo Ogawa ,  Shuhei Matsuda ,  Kiyoshi Nishimura ,  Nobuo Shibano

IPC分类号： F21V29/00

CPC分类号： H01L33/641 ,  F21K9/00 ,  F21S8/02 ,  F21V17/12 ,  F21V23/00 ,  F21V29/75 ,  F21V29/76 ,  F21Y2107/90 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01322 ,  H05K1/0209 ,  H05K1/0306 ,  H05K2201/09136 ,  H05K2201/09781 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to one embodiment, a light-emitting apparatus includes an insulating base made of ceramics, an obverse metallic component dividedly arranged on the front surface of the insulating base, semiconductor light-emitting elements mounted on the obverse metallic component, and a reverse metallic component arranged on a back surface of the insulating base and having a thickness same as or smaller than a thickness of the obverse metallic component and a volume equal to 50% or larger of a volume of the obverse metallic component.

摘要翻译： 根据一个实施例，一种发光装置包括由陶瓷制成的绝缘基底，分隔地布置在绝缘基底的前表面上的正面金属部件，安装在正面金属部件上的半导体发光元件和反向金属部件 布置在绝缘基底的背面上，其厚度等于或小于正金属成分的厚度，并且体积等于正面金属成分的体积的50％以上。

公开(公告)号：US08877643B2

公开(公告)日：2014-11-04

申请号：US13376259

申请日：2010-05-28

申请人： Shuhei Matsuda ,  Tetsuro Iwashita ,  Ryuichi Tanimoto ,  Takeru Takushima ,  Takeo Katoh

发明人： Shuhei Matsuda ,  Tetsuro Iwashita ,  Ryuichi Tanimoto ,  Takeru Takushima ,  Takeo Katoh

IPC分类号： H01L21/461 ,  H01L21/02 ,  B24B37/04 ,  C09G1/02

CPC分类号： H01L21/02024 ,  B24B37/044 ,  C09G1/02 ,  Y10S438/959

摘要： This invention is to provide a method of polishing a silicon wafer wherein a high flatness can be attained likewise the conventional polishing method and further the occurrence of defects due to the remaining of substances included in the polishing solution on the surface of the wafer can be suppressed as well as a polished silicon wafer. The method of polishing a silicon wafer by supplying a polishing solution containing abrasive grains onto a surface of a polishing pad and then relatively sliding the polishing pad to a silicon wafer to polish the surface of the silicon wafer, is characterized in that the number of abrasive grains included in the polishing solution is controlled to not more than 5×1013 grains/cm3.

摘要翻译： 本发明提供一种抛光硅晶片的方法，其中可以获得与常规抛光方法相同的高平整度，并且还可以抑制由于在晶片表面上包含在抛光溶液中的物质残留而导致的缺陷的发生 以及抛光的硅晶片。 通过将含有磨粒的抛光溶液供给到抛光垫的表面上，然后将抛光垫相对滑动到硅晶片以抛光硅晶片的表面来研磨硅晶片的方法，其特征在于，研磨剂的数量 包含在抛光溶液中的晶粒被控制为不超过5×1013个颗粒/ cm3。

公开(公告)号：US20120080775A1

公开(公告)日：2012-04-05

申请号：US13376259

申请日：2010-05-28

申请人： Shuhei Matsuda ,  Tetsuro Iwashita ,  Ryuichi Tanimoto ,  Takeru Takushima ,  Takeo Katoh

发明人： Shuhei Matsuda ,  Tetsuro Iwashita ,  Ryuichi Tanimoto ,  Takeru Takushima ,  Takeo Katoh

IPC分类号： H01L21/306 ,  H01L29/34

CPC分类号： H01L21/02024 ,  B24B37/044 ,  C09G1/02 ,  Y10S438/959

摘要： This invention is to provide a method of polishing a silicon wafer wherein a high flatness can be attained likewise the conventional polishing method and further the occurrence of defects due to the remaining of substances included in the polishing solution on the surface of the wafer can be suppressed as well as a polished silicon wafer.The method of polishing a silicon wafer by supplying a polishing solution containing abrasive grains onto a surface of a polishing pad and then relatively sliding the polishing pad to a silicon wafer to polish the surface of the silicon wafer, is characterized in that the number of abrasive grains included in the polishing solution is controlled to not more than 5×1013 grains/cm3.

摘要翻译： 本发明提供一种抛光硅晶片的方法，其中可以获得与常规抛光方法相同的高平整度，并且还可以抑制由于在晶片表面上包含在抛光溶液中的物质残留而导致的缺陷的发生 以及抛光的硅晶片。 通过将含有磨粒的抛光溶液供给到抛光垫的表面上，然后将抛光垫相对滑动到硅晶片以抛光硅晶片的表面来研磨硅晶片的方法，其特征在于，研磨剂的数量 包含在抛光溶液中的晶粒被控制为不超过5×1013个颗粒/ cm3。