公开(公告)号：US20180240647A1

公开(公告)日：2018-08-23

申请号：US15878222

申请日：2018-01-23

Applicant: Lam Research Corporation

Inventor： Jon McChesney ,  Alexander Paterson

IPC: H01J37/32 ,  H03H7/38

CPC classification number: H01J37/32183 ,  H01J37/244 ,  H01J37/3244 ,  H01J37/3255 ,  H03H7/38 ,  H03H7/40

Abstract: Systems and methods for tuning to reduce reflected power in multiple states are described. The methods include determining values of one or more parameters of an impedance matching circuit so that reflected power is reduced for multiple states. Such a reduction in the reflected power increases a life of a radio frequency generator coupled to the impedance matching circuit while simultaneously processing a substrate using the multiple states.

公开(公告)号：US20180138069A1

公开(公告)日：2018-05-17

申请号：US15799011

申请日：2017-10-31

Applicant: Lam Research Corporation

Inventor： Ali Sucipto Tan ,  Haoquan Yan ,  Marc Estoque ,  Damon Tyrone Genetti ,  Jon McChesney ,  Alexander Miller Paterson

IPC: H01L21/68 ,  H01L21/687

Abstract: A system for determining an alignment of an edge ring on a substrate support includes a robot control module configured to control a robot to place the edge ring onto the substrate support and retrieve the edge ring from the substrate support. An alignment module is configured to determine a plurality of first positions of the edge ring on the robot prior to being placed onto the substrate support and determine a plurality of second positions of the edge ring on the robot subsequent to being retrieved from the substrate support. An edge ring position module configured to determine a centered position of the edge ring relative to the substrate support based on offsets between the plurality of first positions and the plurality of second positions.

公开(公告)号：US20170334074A1

公开(公告)日：2017-11-23

申请号：US15667577

申请日：2017-08-02

Applicant: Lam Research Corporation

Inventor： Damon Tyrone Genetti ,  Jon McChesney ,  Alex Paterson ,  Derek John Witkowicki ,  Austin Ngo

IPC: B25J15/00 ,  H01L21/67 ,  H01L21/673 ,  B25J11/00 ,  H01L21/687 ,  H01L21/677

CPC classification number: B25J15/0014 ,  B25J11/0095 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67383 ,  H01L21/67742 ,  H01L21/68707

Abstract: A cluster tool assembly includes a vacuum transfer module, a process module having a first side connected to the vacuum transfer module. An isolation valve having a first side and a second side, the first side of the isolation valve coupled to a second side of the process module. A replacement station is coupled to the second side of the isolation valve. The replacement station includes an exchange handler and a part buffer. The part buffer includes a plurality of compartments to hold new or used consumable parts. The process module includes a lift mechanism to enable placement of a consumable part installed in the process module to a raised position. The raised position provides access to the exchange handler to enable removal of the consumable part from the process module and store in a compartment of the part buffer. The exchange handler of the replacement station is configured to provide a replacement for the consumable part from the part buffer back to the process module. The lift mechanism is configured to receive the consumable part provided for replacement by the exchange handler and lower the consumable part to an installed position. The replacement by the exchange handler and the process module is conducted while the process module and the replacement station are maintained in a vacuum state.

公开(公告)号：US20160093471A1

公开(公告)日：2016-03-31

申请号：US14553870

申请日：2014-11-25

Applicant: Lam Research Corporation

Inventor： Jon McChesney ,  Alex Paterson

IPC: H01J37/32 ,  H01L21/67

CPC classification number: H01J37/3211 ,  H01J37/321 ,  H01J37/32155 ,  H01J37/32183

Abstract: A plasma processing chamber includes a substrate support for receiving and holding a substrate. A window in the plasma processing chamber is oriented over the substrate support. A plurality of transformer coupled plasma coils is disposed over the window. The TCP coils are disposed radially equidistant from one another. Each TCP coil is connected to a power circuitry at one end and the opposite end is electrically grounded. The power circuitry includes an RF source and a phase-shift modulator. The RF source is used to apply RF power to the TCP coils at a generator frequency to generate RF electric field. The phase-shift modulator coupled to the RF source is configured to apply a modulation frequency that is phase-shifted to allow the RF electric field applied to each of the TCP coils to transition in a rotating pattern.

Abstract translation: 等离子体处理室包括用于接收和保持基板的基板支撑件。 等离子体处理室中的窗口定向在衬底支撑件上方。 多个变压器耦合等离子体线圈设置在窗口上方。 TCP线圈彼此径向等距设置。 每个TCP线圈在一端连接到电源电路，另一端电接地。 电源电路包括RF源和相移调制器。 RF源用于以发生器频率向TCP线圈施加RF功率以产生RF电场。 耦合到RF源的相移调制器被配置为施加相移的调制频率，以允许施加到每个TCP线圈的RF电场以旋转模式转变。

公开(公告)号：US20140065835A1

公开(公告)日：2014-03-06

申请号：US13954416

申请日：2013-07-30

Applicant: Lam Research Corporation

Inventor： Bobby Kadkhodayan ,  Jon McChesney ,  Eric Pape ,  Rajinder Dhindsa

IPC: H01L21/3065 ,  H01L21/02 ,  H01L21/67

CPC classification number: H01L21/3065 ,  C23C14/564 ,  C23C16/4401 ,  C23C16/505 ,  H01J37/16 ,  H01J37/32091 ,  H01J37/32495 ,  H01J37/32568 ,  H01J2237/0213 ,  H01L21/02104 ,  H01L21/67017 ,  H01L21/67069

Abstract: A flexible polymer or elastomer coated RF return strap to be used in a plasma chamber to protect the RF strap from plasma generated radicals such as fluorine and oxygen radicals, and a method of processing a semiconductor substrate with reduced particle contamination in a plasma processing apparatus. The coated RF strap minimizes particle generation and exhibits lower erosion rates than an uncoated base component. Such a coated member having a flexible coating on a conductive flexible base component provides an RF ground return configured to allow movement of one or more electrodes in an adjustable gap capacitively coupled plasma reactor chamber.

Abstract translation: 用于等离子体室中的柔性聚合物或弹性体涂覆的RF返回带，以保护RF带免受等离子体产生的自由基，例如氟和氧自由基，以及在等离子体处理装置中处理具有减少的颗粒污染的半导体衬底的方法。 涂覆的RF带最小化颗粒产生并且比未涂覆的基底部件具有更低的侵蚀速率。 这种在导电柔性基座部件上具有柔性涂层的涂覆部件提供了RF接地回路，其被配置为允许一个或多个电极在可调节间隙电容耦合等离子体反应器室中移动。

公开(公告)号：US11605546B2

公开(公告)日：2023-03-14

申请号：US14598943

申请日：2015-01-16

Applicant: Lam Research Corporation

Inventor： Jon McChesney ,  Alex Paterson

IPC: H01L21/67 ,  H01L21/687 ,  H01J37/32

Abstract: A substrate processing system includes a processing chamber. A pedestal is arranged in the processing chamber. An edge coupling ring is arranged adjacent to the pedestal and around a radially outer edge of the substrate. An actuator is configured to selectively move a first portion of the edge coupling ring relative to the substrate to alter an edge coupling profile of the edge coupling ring.

公开(公告)号：US11495441B2

公开(公告)日：2022-11-08

申请号：US17084103

申请日：2020-10-29

Applicant: Lam Research Corporation

Inventor： Jon McChesney ,  Saravanapriyan Sriraman ,  Richard A. Marsh ,  Alexander Miller Paterson ,  John Holland

IPC: H01J37/32

Abstract: In one embodiment, a plasma processing device may include a dielectric window, a vacuum chamber, an energy source, and at least one air amplifier. The dielectric window may include a plasma exposed surface and an air exposed surface. The vacuum chamber and the plasma exposed surface of the dielectric window can cooperate to enclose a plasma processing gas. The energy source can transmit electromagnetic energy through the dielectric window and form an elevated temperature region in the dielectric window. The at least one air amplifier can be in fluid communication with the dielectric window. The at least one air amplifier can operate at a back pressure of at least about 1 in-H2O and can provide at least about 30 cfm of air.

公开(公告)号：US10658222B2

公开(公告)日：2020-05-19

申请号：US14705430

申请日：2015-05-06

Applicant: Lam Research Corporation

Inventor： Haoquan Yan ,  Robert Griffith O'Neill ,  Raphael Casaes ,  Jon McChesney ,  Alex Paterson

IPC: H01L21/687 ,  H01L21/67 ,  H01J37/32 ,  H01J37/02 ,  H01J37/20

Abstract: A substrate processing system includes a processing chamber and a pedestal arranged in the processing chamber. An edge coupling ring is arranged adjacent to a radially outer edge of the pedestal. A first actuator is configured to selectively move the edge coupling ring to a raised position, relative to the pedestal to provide clearance between the edge coupling ring and the pedestal to allow a robot arm to remove the edge coupling ring from the processing chamber.

公开(公告)号：US10600620B2

公开(公告)日：2020-03-24

申请号：US15384209

申请日：2016-12-19

Applicant: Lam Research Corporation

Inventor： Jon McChesney ,  Alex Paterson

IPC: C23C16/00 ,  H01L21/326 ,  H01J37/32 ,  H01L21/3065

Abstract: Systems, methods, and computer programs are presented for controlling the temperature of a window in a semiconductor manufacturing chamber. One apparatus includes a heater for receiving and heating a flow of air and an air amplifier coupled to pressurized gas. The air amplifier has an input that receives the flow of air from the heater, and the air amplifier having an output. A duct is coupled to the output of the air amplifier and a plenum is coupled to the duct. The plenum receives the flow of air and distributes the flow of air over a window of a plasma chamber. A temperature sensor is situated about the window of the plasma chamber and a controller is provided to control the air amplifier and the heater based on a temperature measured by the temperature sensor.

公开(公告)号：US10427307B2

公开(公告)日：2019-10-01

申请号：US15667577

申请日：2017-08-02

Applicant: Lam Research Corporation

Inventor： Damon Tyrone Genetti ,  Jon McChesney ,  Alex Paterson ,  Derek John Witkowicki ,  Austin Ngo

IPC: B25J15/00 ,  H01L21/67 ,  B25J11/00 ,  H01L21/673 ,  H01L21/677 ,  H01L21/687

Abstract: A cluster tool assembly includes a vacuum transfer module, a process module having a first side connected to the vacuum transfer module. An isolation valve having a first side and a second side, the first side of the isolation valve coupled to a second side of the process module. A replacement station is coupled to the second side of the isolation valve. The replacement station includes an exchange handler and a part buffer. The part buffer includes a plurality of compartments to hold new or used consumable parts. The process module includes a lift mechanism to enable placement of a consumable part installed in the process module to a raised position. The raised position provides access to the exchange handler to enable removal of the consumable part from the process module and store in a compartment of the part buffer. The exchange handler of the replacement station is configured to provide a replacement for the consumable part from the part buffer back to the process module. The lift mechanism is configured to receive the consumable part provided for replacement by the exchange handler and lower the consumable part to an installed position. The replacement by the exchange handler and the process module is conducted while the process module and the replacement station are maintained in a vacuum state.