公开(公告)号：US20230111709A1

公开(公告)日：2023-04-13

申请号：US17822140

申请日：2022-08-25

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Wei-Yuan MA ,  Jo-Hsiang CHEN

IPC: H01L25/13

Abstract: A display device includes a plurality of first packages and a plurality of second packages. The first packages are arranged on the substrate and each of the first packages includes a plurality of first light-emitting chips. The second packages are arranged on the substrate and each of the second packages includes a plurality of second light-emitting chips. The first packages and the second packages are alternately arranged in a first direction, and an arrangement of the first light-emitting chips of the first packages is different from an arrangement of the second light-emitting chips of the second packages.

公开(公告)号：US20220093577A1

公开(公告)日：2022-03-24

申请号：US17100933

申请日：2020-11-22

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Jian-Chin LIANG ,  Chien-Nan YEH ,  Shih-Lun LAI ,  Jo-Hsiang CHEN

IPC: H01L25/16

Abstract: Disclosed is a light-emitting array structure having a substrate, a plurality of light-emitting pixel units, a plurality of first signal wires, a plurality of second signal wires, and an encapsulating layer. The light-emitting pixel units are arranged in array on the substrate. Each light-emitting pixel unit includes a driving chip, a first flat layer, a first redistribution layer, a second flat layer, a second redistribution layer, and a light-emitting diode. Each first signal wire is electrically connected to a corresponding one of the first redistribution layers and extends in a first direction. The second signal wires extend in a level different from the first signal wires. Each second signal wire is electrically connected to a corresponding one of the second redistribution layers and extends in a second direction different from the first direction. The encapsulating layer covers the light-emitting pixel units, the first and second signal wires, and the substrate.

公开(公告)号：US20220029063A1

公开(公告)日：2022-01-27

申请号：US16940340

申请日：2020-07-27

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Kang-Hung LIU

IPC: H01L33/46 ,  H01L27/15 ,  H01L33/60

Abstract: An optical film includes a first transparent layer and a reflective coating. The first transparent layer has a light input surface and a light output surface. A plurality of cavities are formed on the light input surface, wherein each cavity has a first linear sidewall and a second linear sidewall, the second linear sidewall is inclined to the first linear sidewall. The reflective coating is formed on the second linear sidewall of each cavity.

公开(公告)号：US20220020900A1

公开(公告)日：2022-01-20

申请号：US16931463

申请日：2020-07-17

Applicant: Lextar Electronics Corporation

Inventor： Shiou-Yi KUO ,  Jian-Chin LIANG ,  Yu-Chun LEE ,  Fu-Hsin CHEN ,  Chih-Hao LIN

IPC: H01L33/50 ,  H01L33/22 ,  H01L33/48 ,  H01L33/62 ,  H01L27/15

Abstract: A light emitting device includes an LED die and a wavelength conversion layer. The LED die has a light emitting top surface and light emitting side surfaces. The wavelength conversion layer contains quantum dots and a photosensitive material, and is located on the light emitting top surface. A light emitting module including multiple light emitting devices is also disclosed.

公开(公告)号：US20200243734A1

公开(公告)日：2020-07-30

申请号：US16736830

申请日：2020-01-08

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Chang-Han CHEN ,  Chun-Peng LIN

IPC: H01L33/58 ,  H01L33/54 ,  H01L33/56

Abstract: A light-emitting device includes a panel substrate, a light-emitting chip, and a light extracting layer. The light-emitting chip is disposed on the panel substrate. The light extracting layer covers the light-emitting chip and the panel substrate, and the light extracting layer has a side portion. Taking the position where the edge of the light-emitting chip is in contact with the panel substrate as the origin, the side portion and the origin define a circle tangential to the surface of the side portion. The circle has a radius c which satisfies the following formula (1): 1/40H≤c≤H  (1) where H is a height of the light-emitting chip. The light-emitting device disclosed herein has a light extracting layer having a very small thickness, and provides excellent light-emitting efficiency and lifetime of the light-emitting device.

公开(公告)号：US20190131342A1

公开(公告)日：2019-05-02

申请号：US16171334

申请日：2018-10-25

Applicant: Lextar Electronics Corporation

Inventor： Yi-Jyun CHEN ,  Li-Cheng YANG ,  Yu-Chun LEE ,  Shiou-Yi KUO ,  Chih-Hao LIN

IPC: H01L27/15 ,  H01L33/50 ,  H01L33/38 ,  H01L33/08 ,  H01L33/52 ,  H01L25/075

Abstract: A pixel structure includes a light emitting diode chip and a light blocking structure. The light emitting diode chip includes a P-type semiconductor layer, an active layer, an N-type semiconductor layer, a first electrode, and K second electrodes. The active layer is located on the P-type semiconductor layer. The N-type semiconductor layer is located on the active layer. The N-type semiconductor layer has a first top surface that is distant from the active layer. The first electrode is electrically connected to the P-type semiconductor layer. The light blocking structure is located in the light emitting diode chip and defines K sub-pixel regions. The active layer and the N-type semiconductor layer are divided into K sub-portions respectively corresponding to the K sub-pixel regions by the light blocking structure. The K sub-pixel regions share the P-type semiconductor layer.

公开(公告)号：US20250131872A1

公开(公告)日：2025-04-24

申请号：US18919728

申请日：2024-10-18

Applicant: Lextar Electronics Corporation

Inventor： Jui-Yi WU ,  Cheng-Yen TSAI ,  Kai-Hsiang SHIH ,  Chih-Hao LIN ,  Chien-Nan YEH

IPC: G09G3/32

Abstract: In order to maintain the white balance ratio of the mixed white light, a pixel unit is provided, which is composed of four sub-pixels of red, green, blue, and another green colors, and these sub-pixels are composed of a red LED element, a first green LED element, a blue LED element and a second green LED element. A control element is used to control the four sub-pixels of red, first green, blue and second green correspondingly by outputting control signals through the control channels. Base on the adjustment of the current, the brightness ratio of the above three colors is still maintained at the ratio of 3:6:1 of the white balance, and the ratio of the white balance of the white light after being mixed is also maintained.

公开(公告)号：US20240355986A1

公开(公告)日：2024-10-24

申请号：US18633418

申请日：2024-04-11

Applicant: Lextar Electronics Corporation

Inventor： Shiou-Yi KUO ,  Guo-Yi SHIU ,  Chin-Hung LO ,  Chih-Hao LIN ,  Cheng-Hsien LI ,  Wei-Yuan MA

IPC: H01L33/62 ,  H01L23/00 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L24/19 ,  H01L24/20 ,  H01L25/0753 ,  H01L2224/19 ,  H01L2224/211 ,  H01L2933/0066

Abstract: A micro light-emitting diode package structure and a forming method thereof are provided. The micro light-emitting diode package structure includes micro light-emitting diode dies, a light-transmitting layer, a first insulating layer, redistribution layers, and conductive elements. The micro light-emitting diode dies are disposed side by side and each includes an electrode surface, a light-emitting surface, and side surfaces. The electrode surface and the light-emitting surface are opposite to each other, and the side surfaces are between them. The light-transmitting layer covers the light-emitting surface and the side surfaces. The first insulating layer is under the micro light-emitting diode dies and in direct contact with the electrode surface. The redistribution layers are disposed under the first insulating layer and pass through the first insulating layer to electrically connect the electrode surface. The conductive elements are disposed under the redistribution layers and electrically connected to the redistribution layers.

公开(公告)号：US20240194848A1

公开(公告)日：2024-06-13

申请号：US18587974

申请日：2024-02-27

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Jo-Hsiang CHEN ,  Shih-Lun LAI ,  Min-Che TSAI ,  Jian-Chin LIANG

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/58

CPC classification number: H01L33/62 ,  H01L33/0095 ,  H01L33/58 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: The light emitting diode packaging structure includes a flexible substrate, micro light emitting elements disposed on the flexible substrate, a conductive pad, a redistribution layer, and an electrode pad. The micro light emitting elements have a first surface facing to the flexible substrate and a second surface opposite to the first surface. The micro light emitting elements include a red micro light emitting element, a blue micro light emitting element, and a green micro light emitting element. The conductive pad is disposed on the second surface of the micro light emitting elements. The redistribution layer covers the micro light emitting elements and the conductive pad. The redistribution layer includes an insulating layer and a circuit layer embedded in the insulating layer. The circuit layer is electrically connected to the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer.

公开(公告)号：US20230155062A1

公开(公告)日：2023-05-18

申请号：US17931583

申请日：2022-09-13

Applicant: Lextar Electronics Corporation

Inventor： Kang-Hung LIU ,  Chih-Hao LIN ,  Shiou-Yi KUO

IPC: H01L33/38 ,  H01L33/44 ,  H01L33/00 ,  H01L23/00 ,  H01L25/16 ,  H01L25/13 ,  H01L33/54

CPC classification number: H01L33/38 ,  H01L33/44 ,  H01L33/0093 ,  H01L24/29 ,  H01L24/32 ,  H01L25/167 ,  H01L25/13 ,  H01L33/54 ,  H01L2933/0025 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2933/005 ,  H01L2933/0016

Abstract: A package structure is provided. The package structure has a light-emitting region and a non-light-emitting region that is adjacent to the light-emitting region, and includes a substrate, a first light-emitting layer, a second light-emitting layer and a third light-emitting layer. The first light-emitting layer, the second light-emitting layer and the third light-emitting layer are sequentially stacked on the substrate. Each of the first light-emitting layer, the second light-emitting layer and the third light-emitting layer includes a transparent adhesive layer disposed in the light-emitting region, a light-emitting diode (LED) chip disposed on the transparent adhesive layer, a redistribution layer formed on the LED chip and extending from the light-emitting region to the non-light-emitting region, and a planarization layer disposed on the LED chip and the redistribution layer.