公开(公告)号：US20130098507A1

公开(公告)日：2013-04-25

申请号：US13805773

申请日：2011-06-28

申请人： Takeshi Omura ,  Hiroi Yamaguchi ,  Seiji Okabe

发明人： Takeshi Omura ,  Hiroi Yamaguchi ,  Seiji Okabe

IPC分类号： H01F1/01 ,  H01F41/06

CPC分类号： H01F1/01 ,  C21D3/04 ,  C21D8/1222 ,  C21D8/1233 ,  C21D8/1255 ,  C21D8/1283 ,  C21D8/1288 ,  C21D8/1294 ,  C21D9/46 ,  C21D10/005 ,  C21D2201/05 ,  C22C38/001 ,  C22C38/002 ,  C22C38/004 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/08 ,  C22C38/60 ,  H01F1/18 ,  H01F3/02 ,  H01F41/064

摘要： A grain oriented electrical steel sheet is subjected to magnetic domain refinement by laser irradiation or electron irradiation and exhibits excellent low noise properties and low iron-loss properties when assembled into a real transformer device, by setting: the total tension (A) in rolling direction imparted to the steel sheet by the forsterite coating and the tension coating to be equal to or higher than 10.0 MPa; setting the total tension (B) in a direction orthogonal to the rolling direction imparted to the steel sheet by the forsterite coating and the tension coating to be equal to or higher than 5.0 MPa; and setting the total tension (A) and the total tension (B) to satisfy a formula shown below. 1.0≦A/B≦5.0

摘要翻译： 晶粒取向电工钢板通过激光照射或电子照射进行磁畴细化，组装成实际变压器装置时，具有优异的低噪声特性和低的铁损性能，通过设定：轧制方向的总张力（A） 通过镁橄榄石涂层和张力涂层赋予钢板等于或高于10.0MPa; 在通过镁橄榄石涂层和张力涂层赋予钢板的轧制方向的正交方向上设定总张力（B）等于或高于5.0MPa; 并设定总张力（A）和总张力（B）以满足下面所示的公式。 1.0 @ A / B @ 5.0

公开(公告)号：US08334596B2

公开(公告)日：2012-12-18

申请号：US13064611

申请日：2011-04-04

申请人： Takekazu Tanaka ,  Kouhei Takahashi ,  Seiji Okabe

发明人： Takekazu Tanaka ,  Kouhei Takahashi ,  Seiji Okabe

IPC分类号： H01L23/48

CPC分类号： H01L24/05 ,  H01L23/4952 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05166 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01203 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/20755 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/013 ,  H01L2924/00012 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2924/01006

摘要： A semiconductor device includes an electrode pad provided on a semiconductor chip, in which the electrode pad includes aluminum (Al) as a major constituent and further including copper (Cu), a coupling ball primarily including Cu, the coupling ball is coupled to the electrode pad such that a plurality of layers of Cu and Al alloys are formed at a junction between the electrode pad and the coupling ball, and an encapsulating resin including a halogen of less than or equal to 1000 ppm, the encapsulating resin covering at least the electrode pad and the junction between the electrode pad and the coupling ball. A dimensional area of the plurality of layers of Cu and Al alloys is equal to or larger than 50% of a dimensional area of the junction between the electrode pad and the coupling ball. The plurality of layers of Cu and Al alloys includes a CuAl2 layer, a CuAl layer formed on the CuAl2 layer, and a layer including one of Cu9Al4 and Cu3Al2 formed on the CuAl layer.

摘要翻译： 半导体器件包括设置在半导体芯片上的电极焊盘，其中电极焊盘包括铝（Al）作为主要成分，并且还包括铜（Cu），主要包括Cu的耦合球，耦合球耦合到电极 衬垫，使得在电极焊盘和耦合球之间的接合处形成多个Cu和Al合金层，以及包含小于或等于1000ppm的卤素的封装树脂，该封装树脂至少覆盖电极 焊盘和电极焊盘与耦合球之间的连接处。 Cu和Al合金的多层的尺寸面积等于或大于电极焊盘和联接球之间的接合部的尺寸面积的50％。 多层Cu和Al合金包括CuAl2层，形成在CuAl2层上的CuAl层，以及包含在CuAl层上形成的Cu9Al4和Cu3Al2之一的层。

公开(公告)号：US20110241204A1

公开(公告)日：2011-10-06

申请号：US13064611

申请日：2011-04-04

申请人： Takekazu Tanaka ,  Kouhei Takahashi ,  Seiji Okabe

发明人： Takekazu Tanaka ,  Kouhei Takahashi ,  Seiji Okabe

IPC分类号： H01L23/498

CPC分类号： H01L24/05 ,  H01L23/4952 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05166 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01203 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/20755 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/013 ,  H01L2924/00012 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2924/01006

摘要： A semiconductor device includes an electrode pad provided on a semiconductor chip, in which the electrode pad includes aluminum (Al) as a major constituent and further including copper (Cu), a coupling ball primarily including Cu, the coupling ball is coupled to the electrode pad such that a plurality of layers of Cu and Al alloys are formed at a junction between the electrode pad and the coupling ball, and an encapsulating resin including a halogen of less than or equal to 1000 ppm, the encapsulating resin covering at least the electrode pad and the junction between the electrode pad and the coupling ball. A dimensional area of the plurality of layers of Cu and Al alloys is equal to or larger than 50% of a dimensional area of the junction between the electrode pad and the coupling ball. The plurality of layers of Cu and Al alloys includes a CuAl2 layer, a CuAl layer formed on the CuAl2 layer, and a layer including one of Cu9Al4 and Cu3Al2 formed on the CuAl layer.

摘要翻译： 半导体器件包括设置在半导体芯片上的电极焊盘，其中电极焊盘包括铝（Al）作为主要成分，并且还包括铜（Cu），主要包括Cu的耦合球，耦合球耦合到电极 衬垫，使得在电极焊盘和耦合球之间的接合处形成多个Cu和Al合金层，以及包含小于或等于1000ppm的卤素的封装树脂，该封装树脂至少覆盖电极 焊盘和电极焊盘与耦合球之间的连接处。 Cu和Al合金的多层的尺寸面积等于或大于电极焊盘和联接球之间的接合部的尺寸面积的50％。 多层Cu和Al合金包括CuAl2层，形成在CuAl2层上的CuAl层，以及包含在CuAl层上形成的Cu9Al4和Cu3Al2之一的层。

公开(公告)号：US07371291B2

公开(公告)日：2008-05-13

申请号：US11145705

申请日：2005-06-06

申请人： Yasuyuki Hayakawa ,  Mitsumasa Kurosawa ,  Seiji Okabe ,  Takeshi Imamura

发明人： Yasuyuki Hayakawa ,  Mitsumasa Kurosawa ,  Seiji Okabe ,  Takeshi Imamura

IPC分类号： H01F1/16 ,  H01F1/147

CPC分类号： C21D8/1272 ,  C21D8/1222 ,  C21D8/1233 ,  C21D8/1283 ,  C22C38/004 ,  C22C38/06 ,  H01F1/14783

摘要： A grain oriented electromagnetic steel sheet is free from an undercoating mainly composed of forsterite (Mg2SiO4), excellent in processability and magnetic properties and useful to production cost, and has a composition containing, by % by mass, 2.0 to 8.0% of Si, wherein secondary recrystallized grains contains fine crystal grains having a grain diameter of 0.15 mm to 0.50 mm at a rate of 2 grains/cm2 or more. In the process of producing the steel sheet, inhibitors are not utilized, and the fine crystal grains are achieved by high purification and low temperature final annealing.

摘要翻译： 晶粒取向电磁钢板不含主要由镁橄榄石（Mg 2 SiO 4）组成的底涂层，其加工性能和磁性能优异并且对生产成本有用，并且具有 以质量％计含有2.0〜8.0％的Si的组合物，其中二次再结晶晶粒以2晶粒/ cm 2的速度包含粒径为0.15mm至0.50mm的细晶粒， 或者更多。 在制造钢板的过程中，不利用抑制剂，通过高纯化和低温最终退火实现细晶粒。

公开(公告)号：US06562473B1

公开(公告)日：2003-05-13

申请号：US09722017

申请日：2000-11-27

申请人： Seiji Okabe ,  Yasuyuki Hayakawa ,  Takeshi Imamura ,  Mitsumasa Kurosawa

发明人： Seiji Okabe ,  Yasuyuki Hayakawa ,  Takeshi Imamura ,  Mitsumasa Kurosawa

IPC分类号： B32B1504

CPC分类号： C21D8/12 ,  C21D8/1227 ,  C21D8/1233 ,  C21D8/1261 ,  C21D8/1272 ,  H01F1/14775 ,  Y10S428/90 ,  Y10S428/928

摘要： Electrical steel sheets having superior magnetic properties, anti-noise properties, and workability, are ideal for use a compact iron core material in electric apparatuses, such as compact transformers, motors, and electric generators. A totally new electrical steel sheet and a manufacturing method therefor are proposed, in which the electrical steel sheet is not only most advantageous in magnetic properties but also advantageous from economic point of view. That is, the electrical steel sheet of the present invention is composed of from about 2.0 to 8.0 wt % Si, from about 0.005 to 3.0 wt % Mn, from about 0.0010 to 0.020 wt % Al, balance essentially iron. The magnetic flux density B50(L) in a rolling direction and the magnetic flux density B50(C) in the direction perpendicular thereto are 1.70 T or more, and the B50(L)/B50(C) is 1.005 to 1.100. In addition, the secondary recrystallized grains inclined by 20′ or less with respect to the {100} orientation are present in the steel sheet at an areal ratio of 50 to 80%, and secondary recrystallized grains inclined by 20° or less with respect to the {110} orientation are present in the steel sheet at an areal ratio of 6 to 20%.

摘要翻译： 具有优异的磁特性，抗噪声性能和可加工性的电工钢板，在紧凑型变压器，电动机和发电机等电气设备中使用紧凑的铁芯材料是理想的。 提出了一种全新的电工钢板及其制造方法，其中电磁钢板不仅在磁性方面最有利，而且从经济的观点出发也是有利的。 也就是说，本发明的电工钢板由约2.0〜8.0重量％的Si，约0.005〜3.0重量％的Mn，约0.0010〜0.020重量％的Al，余量基本上由铁构成。 轧制方向的磁通密度B50（L）和与其垂直的方向的磁通密度B50（C）为1.70T以上，B50（L）/ B50（℃）为1.005〜1.100。 此外，相对于{100} <001>取向倾斜20°以下的二次再结晶晶粒以50〜80％的面积比存在，并且二次再结晶晶粒倾斜20°以下 相对于{110} <001>取向，以6〜20％的面积比存在于钢板中。

公开(公告)号：US09536657B2

公开(公告)日：2017-01-03

申请号：US13805109

申请日：2011-06-28

申请人： Takeshi Omura ,  Hiroaki Toda ,  Hiroi Yamaguchi ,  Seiji Okabe

发明人： Takeshi Omura ,  Hiroaki Toda ,  Hiroi Yamaguchi ,  Seiji Okabe

IPC分类号： H01F41/00 ,  C21D8/12 ,  H01F1/16 ,  C22C38/02

CPC分类号： H01F41/00 ,  C21D8/1222 ,  C21D8/1233 ,  C21D8/1272 ,  C21D8/1288 ,  C22C38/001 ,  C22C38/002 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/08 ,  H01F1/16

摘要： A grain oriented electrical steel sheet is subjected to magnetic domain refinement by laser irradiation and has magnetic flux density B8 of at least 1.91T, wherein the nitrogen content in the forsterite coating is 3.0 mass % or less. The grain oriented electrical steel sheet satisfies recent demand for iron loss reduction.

摘要翻译： 晶粒取向电工钢板通过激光照射进行磁畴精制，磁通密度B8为1.91T以上，镁橄榄石涂层中的氮含量为3.0质量％以下。 晶粒取向电工钢板满足了铁损减少的最新需求。

公开(公告)号：US09396850B2

公开(公告)日：2016-07-19

申请号：US13806901

申请日：2011-06-28

申请人： Hiroi Yamaguchi ,  Hiroaki Toda ,  Takeshi Omura ,  Seiji Okabe

发明人： Hiroi Yamaguchi ,  Hiroaki Toda ,  Takeshi Omura ,  Seiji Okabe

IPC分类号： H01F1/01 ,  C21D10/00 ,  C22C38/18 ,  H01F41/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/20 ,  C22C38/60 ,  H01F1/18 ,  C21D8/12

CPC分类号： H01F1/01 ,  C21D8/1222 ,  C21D8/1233 ,  C21D8/1255 ,  C21D8/1261 ,  C21D8/1266 ,  C21D8/1272 ,  C21D8/1283 ,  C21D8/1288 ,  C21D8/1294 ,  C21D10/005 ,  C21D2201/05 ,  C22C38/04 ,  C22C38/06 ,  C22C38/18 ,  C22C38/20 ,  C22C38/60 ,  H01F1/18 ,  H01F41/02

摘要： A grain oriented electrical steel sheet (1) suppresses the content of Cr in the grain oriented electrical steel sheet to 0.1 mass % or less; (2) sets the coating weight of a forsterite coating, in terms of basis weight of oxygen therein, to at least 3.0 g/m2 and thickness of an anchor portion as a lower portion of forsterite coating to 1.5 μm or less; and (3) controls setting the magnitude of deflection of a test specimen having length: 280 mm to at least 10mm when the forsterite coating is provided on only one surface thereof and at least 20 mm when forsterite coating and the tension coating are provided on the surface.

摘要翻译： 晶粒取向电工钢板（1）将晶粒取向电工钢板的Cr含量抑制在0.1质量％以下。 （2）将镁橄榄石涂层的涂布重量设定为至少3.0g / m 2，作为镁橄榄石涂层的下部的锚定部的厚度为1.5μm以下; 并且（3）控制当将镁橄榄石涂层仅在其一个表面上设置时，将长度为：280mm的试样的挠曲幅度设定为至少10mm，当镁橄榄石涂层和张力涂层 表面。