公开(公告)号：US20090060011A1

公开(公告)日：2009-03-05

申请号：US11845449

申请日：2007-08-27

申请人： Andre Hanke ,  Bernd Adler

发明人： Andre Hanke ,  Bernd Adler

IPC分类号： H04B1/40 ,  H04L27/00

CPC分类号： H04B7/0822 ,  H04L25/0264 ,  H04L25/0292 ,  H04L67/12

摘要： In one embodiment, a circuit can selectively adjust a current for driving a load. The circuit includes a sensor configured to measure a magnetic field associated with the current and provide a sensor voltage representative thereof. A control circuit is configured to selectively adjust the current as a function of the sensor voltage and a time-varying voltage threshold. Other methods and systems are also disclosed.

摘要翻译： 在一个实施例中，电路可以选择性地调节用于驱动负载的电流。 电路包括被配置为测量与电流相关联的磁场并提供代表其的传感器电压的传感器。 控制电路被配置为根据传感器电压和时变电压阈值来选择性地调节电流。 还公开了其它方法和系统。

公开(公告)号：US20070206702A1

公开(公告)日：2007-09-06

申请号：US11709004

申请日：2007-02-21

申请人： Bernd Adler ,  Andre Hanke

发明人： Bernd Adler ,  Andre Hanke

IPC分类号： H04L27/00

CPC分类号： H03C5/00 ,  H03C3/40

摘要： A modulation device includes a signal input for receiving a data stream to be modulated and a first and a second signal output. At least one first complex component is derived from the data stream in a coding device. A first and a second high-frequency signal are output via the signal outputs. The first and second high-frequency signals are derived from the at least one first complex component and are distinguished by the fact that the second high-frequency signal has a phase shift of substantially 90° with respect to the first high-frequency signal.

摘要翻译： 调制装置包括用于接收要调制的数据流的信号输入和第一和第二信号输出。 至少一个第一复合分量是从编码设备中的数据流导出的。 通过信号输出输出第一和第二高频信号。 第一和第二高频信号从至少一个第一复合分量导出，并且通过第二高频信号相对于第一高频信号具有大致90°的相移的事实来区分。

公开(公告)号：US20050113056A1

公开(公告)日：2005-05-26

申请号：US10947963

申请日：2004-09-23

申请人： Dietolf Seippel ,  Andre Hanke ,  Duyen Pham-Stabner

发明人： Dietolf Seippel ,  Andre Hanke ,  Duyen Pham-Stabner

IPC分类号： H03B27/00 ,  H03K21/00 ,  H04N9/77 ,  H04N9/79 ,  H04N17/00

CPC分类号： H03B27/00

摘要： A signal conditioning circuit contains an oscillator which is connected to the inputs of two mixers. The output of one mixer is coupled, so as to form a feedback path, to a frequency divider circuit whose first output is coupled to the second input of the first mixer. A second signal output of the frequency divider circuit carries a signal with a phase shift of 90 degrees with respect to the signal at the first signal output of the frequency divider circuit. The second signal is supplied to a second input of the second mixer. Feedback results in undesirable signal components in the in-phase and quadrature components being suppressed. At the same time, the in-phase and quadrature components have a fixed phase relationship with respect to one another. The signal conditioning circuit allows desired non-integer division ratios to be achieved.

摘要翻译： 信号调理电路包含连接到两个混频器输入端的振荡器。 将一个混频器的输出端耦合到一个分频器电路，以形成一个反馈路径，该分频器电路的第一个输出耦合到第一个混频器的第二个输入端。 分频器电路的第二信号输出相对于分频器电路的第一信号输出处的信号携带相对于90度的相移的信号。 第二信号被提供给第二混频器的第二输入端。 反馈导致同相和正交分量中不期望的信号分量被抑制。 同时，同相和正交分量相对于彼此具有固定的相位关系。 信号调理电路允许实现期望的非整数分频比。

公开(公告)号：US20050085105A1

公开(公告)日：2005-04-21

申请号：US10944537

申请日：2004-09-17

申请人： Andre Hanke ,  Stephan Dobritz

发明人： Andre Hanke ,  Stephan Dobritz

IPC分类号： G01R31/26 ,  G01R1/04 ,  G01R31/28 ,  H01R13/22 ,  H01R33/76 ,  H05K1/11 ,  H05K3/28 ,  H05K3/32 ,  H05K3/40 ,  H01R12/00

CPC分类号： H01R13/22 ,  G01R1/0483 ,  H01L2924/0002 ,  H05K1/118 ,  H05K3/28 ,  H05K3/325 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/10734 ,  H05K2201/2009 ,  H05K2203/167 ,  H01L2924/00

摘要： An arrangement for producing an electrical connection between a ball grid array (BGA) package and a signal source is disclosed. A flexible printed circuit board (PCB) has conductor (e.g., copper) tracks arranged between flexible plastic layers. A contact receptacle with guide elements for the BGA package is located over a portion of the flexible PCB. Contact structures are electrically coupled to the conductor tracks of the flexible PCB and accessible via the contact receptacle. The contact structures serve for providing an electrical contact-connection of terminals of a BGA package placed in the receptacle. The contact structures comprise column- or sleeve-shaped contact elements that extend through the flexible PCB and project upwards on one side from one of the flexible plastic layers.

摘要翻译： 公开了一种用于在球栅阵列（BGA）封装和信号源之间产生电连接的装置。 柔性印刷电路板（PCB）具有布置在柔性塑料层之间的导体（例如，铜）轨道。 具有用于BGA封装的引导元件的接触插座位于柔性PCB的一部分上方。 接触结构电耦合到柔性PCB的导体轨道并且经由接触插座可接近。 接触结构用于提供放置在容器中的BGA封装的端子的电接触连接。 接触结构包括延伸穿过柔性PCB并从一个柔性塑料层的一侧向上突出的柱形或套筒状接触元件。

公开(公告)号：US08891680B2

公开(公告)日：2014-11-18

申请号：US12830551

申请日：2010-07-06

申请人： Bernd Adler ,  Andre Hanke

发明人： Bernd Adler ,  Andre Hanke

IPC分类号： H03C3/00 ,  H04L27/28 ,  H04L27/36

CPC分类号： H04L27/362 ,  H04L27/28

摘要： A transmission arrangement for modulating useful signals onto a carrier frequency signal has a frequency generator for generating the carrier frequency signal, a first modulation path for modulating a first useful signal onto the carrier frequency signal, and a second modulation path for modulating a second useful signal onto the carrier frequency signal. The first modulation path has a digital modulator for providing an amplitude signal and a Cartesian signal pair from the first useful signal and a Cartesian modulator for modulating the Cartesian signal pair onto the carrier frequency signal in order to provide an intermediate signal. The first modulation path is configured in such a manner that the amplitude signal is modulated onto the intermediate signal in order to provide an output signal.

摘要翻译： 用于将有用信号调制到载波频率信号上的传输装置具有用于产生载波频率信号的频率发生器，用于将第一有用信号调制到载波频率信号上的第一调制路径和用于调制第二有用信号的第二调制路径 载波频率信号。 第一调制路径具有用于从第一有用信号提供振幅信号和笛卡尔信号对的数字调制器，以及用于将笛卡尔信号对调制到载波频率信号上的笛卡尔调制器，以便提供中间信号。 第一调制路径被配置成使得振幅信号被调制到中间信号上以提供输出信号。

公开(公告)号：US20110201175A1

公开(公告)日：2011-08-18

申请号：US13037446

申请日：2011-03-01

申请人： Hans-Joachim Barth ,  Andre Hanke ,  Snezana Jenei ,  Oliver Nagy ,  Jiro Morinaga ,  Bernd Adler ,  Heinrich Koerner

发明人： Hans-Joachim Barth ,  Andre Hanke ,  Snezana Jenei ,  Oliver Nagy ,  Jiro Morinaga ,  Bernd Adler ,  Heinrich Koerner

IPC分类号： H01L21/71

CPC分类号： H01L21/71 ,  H01L23/49822 ,  H01L23/552 ,  H01L23/585 ,  H01L23/66 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Structures of a system on a chip are disclosed. In one embodiment, the system on a chip (SoC) includes an RF component disposed on a first part of a substrate, a semiconductor component disposed on a second part of the substrate, the semiconductor component and the RF component sharing a common boundary, and a conductive cage disposed enclosing the RF component. The conductive cage shields the semiconductor component from electromagnetic radiation originating from the RF circuit.

摘要翻译： 公开了一种芯片上的系统的结构。 在一个实施例中，芯片上的系统（SoC）包括设置在基板的第一部分上的RF部件，设置在基板的第二部分上的半导体部件，共享公共边界的半导体部件和RF部件，以及 布置成围绕RF部件的导电笼。 导电笼将半导体元件遮挡起源于RF电路的电磁辐射。

公开(公告)号：US07973358B2

公开(公告)日：2011-07-05

申请号：US12187406

申请日：2008-08-07

申请人： Andre Hanke ,  Oliver Nagy

发明人： Andre Hanke ,  Oliver Nagy

IPC分类号： H01L21/00

CPC分类号： H01P5/18

摘要： One or more embodiments relate to a semiconductor device, comprising: a substrate; and a radio frequency coupler including a first coupling element and a second coupling element spacedly disposed from the first coupling element, the first coupling element including at least one through-substrate via disposed in the substrate, the second coupling element including at least one through-substrate via disposed in the substrate.

摘要翻译： 一个或多个实施例涉及半导体器件，包括：衬底; 以及包括第一耦合元件和与所述第一耦合元件间隔设置的第二耦合元件的射频耦合器，所述第一耦合元件包括设置在所述衬底中的至少一个贯通衬底通孔，所述第二耦合元件包括至少一个通孔， 衬底通孔设置在衬底中。

公开(公告)号：US20110007842A1

公开(公告)日：2011-01-13

申请号：US12830551

申请日：2010-07-06

申请人： Bernd ADLER ,  Andre Hanke

发明人： Bernd ADLER ,  Andre Hanke

IPC分类号： H04L27/04

CPC分类号： H04L27/362 ,  H04L27/28

摘要： A transmission arrangement for modulating useful signals onto a carrier frequency signal has a frequency generator for generating the carrier frequency signal, a first modulation path for modulating a first useful signal onto the carrier frequency signal, and a second modulation path for modulating a second useful signal onto the carrier frequency signal. The first modulation path has a digital modulator for providing an amplitude signal and a Cartesian signal pair from the first useful signal and a Cartesian modulator for modulating the Cartesian signal pair onto the carrier frequency signal in order to provide an intermediate signal. The first modulation path is configured in such a manner that the amplitude signal is modulated onto the intermediate signal in order to provide an output signal.

摘要翻译： 用于将有用信号调制到载波频率信号上的传输装置具有用于产生载波频率信号的频率发生器，用于将第一有用信号调制到载波频率信号上的第一调制路径和用于调制第二有用信号的第二调制路径 载波频率信号。 第一调制路径具有用于从第一有用信号提供振幅信号和笛卡尔信号对的数字调制器，以及用于将笛卡尔信号对调制到载波频率信号上的笛卡尔调制器，以便提供中间信号。 第一调制路径被配置成使得振幅信号被调制到中间信号上以提供输出信号。

公开(公告)号：US20050098883A1

公开(公告)日：2005-05-12

申请号：US10944678

申请日：2004-09-17

申请人： Andre Hanke

发明人： Andre Hanke

IPC分类号： H01L23/498 ,  H01L25/065 ,  H01L23/48

CPC分类号： H01L23/49827 ,  H01L25/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/0102 ,  Y10T29/49204 ,  H01L2224/05599

摘要： The invention relates to an interconnection for chip sandwich structures by means of which chips can be electrically and mechanically connected to one another face-to-face, and to a method for the production thereof. The invention is intended to create interconnections that can be produced more cost-effectively and more effectively. This is achieved by virtue of the fact that pin- or sleeve-shaped contact elements (3) are arranged between the chips (1, 2), which contact elements create an electrical and mechanical interconnection between the contact pads (4, 5) of the semiconductor chips (1, 2) and are soldered to the latter.

摘要翻译： 本发明涉及一种用于芯片夹层结构的互连件，通过该互连芯片可以彼此面对面地彼此电连接和机械连接，以及用于生产它们的方法。 本发明旨在创建可以更经济有效和更有效地产生的互连。 这是由于销或套筒状的接触元件（3）布置在芯片（1,2）之间的事实而实现的，该接触元件在接触垫（4,5）之间产生电和机械互连 半导体芯片（1,2）并且被焊接到后者。

公开(公告)号：US20050093148A1

公开(公告)日：2005-05-05

申请号：US10944684

申请日：2004-09-17

申请人： Andre Hanke ,  Stephan Dobritz

发明人： Andre Hanke ,  Stephan Dobritz

IPC分类号： H01L23/31 ,  H01L23/498 ,  H05K3/00 ,  H05K3/22 ,  H05K3/34 ,  H05K3/40 ,  H01L21/44 ,  H01L23/52

CPC分类号： H05K3/4007 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/48 ,  H01L2224/4824 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01079 ,  H05K3/0041 ,  H05K3/22 ,  H05K3/3436 ,  H05K2201/0367 ,  Y02P70/613 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic component includes an interposer substrate and at least one semiconductor chip mounted on the interposer substrate. A plurality of electrical connections electrically couple a rewiring of the interposer substrate to contact regions of the at least one semiconductor chip. A plurality of connection elements are positioned for electrical contact-connection with a printed circuit board. The interconnection elements comprise hollow-cylindrical or rod-shaped elements that penetrate through and are fixedly connected to the interposer substrate.

摘要翻译： 电子部件包括插入器基板和安装在插入器基板上的至少一个半导体芯片。 多个电连接将所述插入器基板的再布线电耦合到所述至少一个半导体芯片的接触区域。 定位多个连接元件用于与印刷电路板的电接触连接。 互连元件包括中空圆柱形或棒形元件，其穿透并固定地连接到插入器基板。