摘要:
A position detecting method includes illuminating a grating mark of an object with monochromatic light; forming an interference image on an image pickup device by using .+-. n-th order light (n=1, 2, 3 . . . ) among reflective diffraction light from the grating mark; integrating an image signal produced by the image pickup device within a two-dimensional window of a predetermined size set with respect to the image signal and along one direction in two-dimensional coordinates, whereby a one-dimensional projection integration signal is produced; transforming, through rectangular transformation, the one-dimensional projection integration signal into a spatial frequency region; selecting, on the spatial frequency region and from the one-dimensional projection integration signal, a spatial frequency component which appears in the interference image due to the periodicity of the grating mark; and detecting the position of the grating mark on the basis of the selection.
摘要:
A wafer prober for contacting probe needles of a probe card to bonding pads of a chip formed on a wafer, for allowing examination of characteristics of the chip, is disclosed. The wafer prober includes a wafer holder for holding a wafer and moving the same in X and Y directions. By the wafer holder, the wafer can be moved from an alignment information detecting station whereat alignment information can be detected by use of a TV camera, to an examining station whereat the probe needles of the probe card are used for the examination. The position of the wafer in a Z direction at the time when the alignment information is detected by the TV camera, can be made substantially coincident with the position of the wafer in the Z direction at the time when the probe needles contact the bonding pads. By this, an error caused by the movement of the wafer holder in the Z direction does not affect against the alignment accuracy of the wafer in the X and Y directions, such that the probe needles can correctly contact the bonding pads.
摘要:
A wafer prober usable with a probe card for examination of chips formed on a wafer is disclosed. The wafer prober has a function for automatically aligning bonding pads of each chip with probe needles of the probe card. The prober includes a contact plate movable in X and Y directions with a wafer chuck. The contact blade is pressed against at least one of the tips of the probe needles, and the thus contacted needle tip is observed by a TV camera from the underneath of the contact plate. The video signal obtained thereby is used for the alignment between the bonding pads and the probe needles. Also, the TV camera is moved in the X and Y directions with the wafer chuck to allow that one and the same reference mark is observed by this TV camera and by another TV camera provided for image-taking the bonding pads. With the proposed structure, the bonding pads and the probe needles can be aligned automatically and accurately.
摘要:
An ultrasonic flowmeter apparatus, which can be mounted on a conduit flowing a fluid whose flow rate is to be measured, has two housing halves coupled swingably about an axis. Free ends of the housing halves include a clamp mechanism for closing and locking the halves in position. The halves have formed therein grooves 1a and 2a, respectively, and a pair of ultrasonic wave transmission and reception elements are provided on an inner wall of the groove 1a. When the conduit is clamped between the grooves, the conduit is urged against the inner walls and deformed into a substantially square cross sectional configuration. An ultrasonic wave beam B is projected from one of the elements into a fluid passing through the conduit, the beam is reflected by an opposite surface of the conduit urged against the groove 2a, and the reflected beam is received by the other element.
摘要:
A manufacturing technique is disclosed for producing a semiconductor integrated circuit device having plural layers of buried wirings, and such that there is prevented the occurrence of a discontinuity caused by stress migration at an interface between a plug connected at a bottom thereof to a buried wiring and the buried wiring. For example, in the case where the width of a first Cu wiring is not smaller than about 0.9 μm and is smaller than about 1.44 μm, and the width of a second Cu wiring and the diameter of a plug are about 0.18 μm, there are arranged two or more plugs which connect the first wirings and the second Cu wirings electrically with each other.
摘要:
In a semiconductor integrated circuit device having plural layers of buried wirings, it is intended to prevent the occurrence of a discontinuity caused by stress migration at an interface between a plug connected at a bottom thereof to a buried wiring and the buried wiring. For example, in the case where the width of a first Cu wiring is not smaller than about 0.9 μm and is smaller than about 1.44 μm, and the width of a second Cu wiring and the diameter of a plug are about 0.18 μm, there are arranged two or more plugs which connect the first wirings and the second Cu wirings electrically with each other.
摘要:
A projection exposure apparatus includes an exposure light source, an illumination system for illuminating a pattern, formed on a first object, with light from the exposure light source and passing through the illumination system, a projection optical system for projecting a pattern, as illuminated with the light, onto a second object for exposure of the same with the pattern, and an interferometer for use in measurement of an optical characteristic of the projection optical system, wherein the interferometer is operable to perform the measurement by use of light from the exposure light source.
摘要:
Disclosed is a fabricating system including a plurality of processing apparatuses connected to each other by means of an inter-apparatus transporter, wherein one group of semiconductor wafers are processed in processing apparatuses and other group of wafers are transported to specified processing apparatuses for a time interval from (To+T) to a time To; and another group of wafers are processed and the remaining group of wafers are transported for a time interval from (To+T) to (To+2T). Since processing apparatuses can receive at least one of works from the inter-apparatus transporter for a time interval T min, the distribution of works from the transporter to processing apparatuses is completed for the time interval T min. The transporter is emptied for each time interval T min, and works are unloaded to the emptied transporter, which makes easy the scheduling, control and management of the transporting of a plurality of works in the fabricating system. Moreover, since the fabricating system including processing apparatuses is periodically controlled at a cycle time T min, the scheduling of a plurality of works can be made easy, to enhance the level of optimization, thus improving the productivity.
摘要:
An exposure apparatus for printing, by exposure, a pattern of an original onto a substrate includes a housing tightly filled with a predetermined ambience and for accommodating therein at least a portion of an exposure light optical axis, and a detection system having an optical system, wherein a portion of a light path of the detection system is disposed in a first space enclosed by the housing, and wherein at least another portion of the detection system including an electrical element thereof is disposed in a second space outside the housing.
摘要:
A projection exposure apparatus includes an exposure light source, an illumination system for illuminating a pattern, formed on a first object, with light from the exposure light source, a projection optical system for projecting a pattern, as illuminated with the light, onto a second object and an interferometer for use in measurement of an optical characteristic of the projection optical system, wherein the interferometer is operable to perform the measurement by use of light from the exposure light source.