公开(公告)号：US07108589B2

公开(公告)日：2006-09-19

申请号：US11187944

申请日：2005-07-25

申请人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuya Okumura ,  You Ishii ,  Junji Kunisawa ,  Hiroyuki Yano

发明人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuya Okumura ,  You Ishii ,  Junji Kunisawa ,  Hiroyuki Yano

IPC分类号： B24B7/00

CPC分类号： B24B37/345 ,  B24B9/065 ,  B24B37/12 ,  H01L21/67046

摘要： A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.

摘要翻译： 抛光装置和方法具有将形成在基板上的膜的表面抛光至平面镜面的功能，以及抛光沉积在基板的外周部分上的不需要的金属膜如铜膜的功能，以去除这种不必要的金属 电影。 抛光装置包括表面抛光机构，其包括具有抛光表面的抛光台和用于保持基板的顶环，并将基板压靠在抛光台的抛光表面上，从而抛光基板的表面，以及外周抛光 用于抛光衬底的外周部分的机构。

公开(公告)号：US06935932B2

公开(公告)日：2005-08-30

申请号：US10784945

申请日：2004-02-25

申请人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuya Okumura ,  You Ishii ,  Junji Kunisawa ,  Hiroyuki Yano

发明人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuya Okumura ,  You Ishii ,  Junji Kunisawa ,  Hiroyuki Yano

IPC分类号： B24B9/06 ,  B24B37/12 ,  B24B37/34 ,  H01L21/00 ,  B24B1/00

CPC分类号： B24B37/345 ,  B24B9/065 ,  B24B37/12 ,  H01L21/67046

摘要： A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.

公开(公告)号：US06913513B2

公开(公告)日：2005-07-05

申请号：US09784171

申请日：2001-02-16

申请人： Norio Kimura ,  Katsuya Okumura ,  Hiroyuki Yano

发明人： Norio Kimura ,  Katsuya Okumura ,  Hiroyuki Yano

IPC分类号： B24B37/013 ,  B24B37/10 ,  B24B49/04 ,  B24B49/12 ,  H01L21/304

CPC分类号： B24B37/26 ,  B24B37/013 ,  B24B37/205 ,  B24B49/04 ,  B24B49/12

摘要： A polishing apparatus comprises a polishing table having a polishing surface, a top ring for holding a substrate and pressing a surface of the substrate against the polishing surface to polish the surface of the substrate, and at least one optical measuring device disposed adjacent to the outer peripheral portion of the polishing table and below the polishing surface of the polishing table for measuring the thickness of a layer formed on the surface of the substrate. The polishing apparatus further comprises at least one notch formed in the peripheral portion of the polishing table. The notch allows light emitted from the optical measuring device to pass therethrough and be incident on the surface of the substrate and allows light reflected from the surface of the substrate to pass therethrough and be incident on the optical measuring device.

摘要翻译： 抛光装置包括具有抛光表面的抛光台，用于保持基板的顶环，并将基板的表面压靠在抛光表面上以抛光基板的表面;以及至少一个光学测量装置，其邻近外部设置 抛光台的周边部分和抛光台的抛光表面下方，用于测量在基板表面上形成的层的厚度。 抛光装置还包括形成在抛光台的周边部分中的至少一个凹口。 该凹口允许从光学测量装置发射的光通过，并且入射到基板的表面上，并允许从基板的表面反射的光通过，并入射到光学测量装置上。

公开(公告)号：US06609950B2

公开(公告)日：2003-08-26

申请号：US09897918

申请日：2001-07-05

申请人： Norio Kimura ,  Yu Ishii ,  Hirokuni Hiyama ,  Katsuya Okumura ,  Hiroyuki Yano

发明人： Norio Kimura ,  Yu Ishii ,  Hirokuni Hiyama ,  Katsuya Okumura ,  Hiroyuki Yano

IPC分类号： B24B4900

CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B49/04 ,  H01L21/02074 ,  H01L21/3212 ,  H01L21/76807

摘要： A method of polishing substrates enables the size of a polishing table to be reduced. A surface of a substrate to be polished is brought into contact with a polishing surface of a polishing table in such a manner that a portion of the surface of the substrate extends outwardly from an outer periphery of the polishing surface. The substrate is rotated about its center axis while keeping its surface in contact with the polishing surface of the polishing table. The attitude of the substrate carrier is controlled so that the surface of the substrate is kept parallel with the polishing surface of the polishing table during a polishing operation.

摘要翻译： 研磨基板的方法能够减小抛光台的尺寸。 将要抛光的基底的表面以与研磨台的抛光表面接触的方式使得基底表面的一部分从抛光表面的外周向外延伸。 衬底围绕其中心轴线旋转，同时保持其表面与抛光台的抛光表面接触。 控制基板载体的姿态，使得在抛光操作期间基板的表面与抛光台的抛光表面保持平行。

公开(公告)号：US06354907B1

公开(公告)日：2002-03-12

申请号：US09522705

申请日：2000-03-10

申请人： Ichiju Satoh ,  Norio Kimura ,  Katsuya Okumura

发明人： Ichiju Satoh ,  Norio Kimura ,  Katsuya Okumura

IPC分类号： B24B4900

CPC分类号： B24B37/11 ,  B24B37/005 ,  B24B37/30 ,  B24B41/061 ,  B24B49/10

摘要： There is provided a polishing apparatus comprising an attitude controller for controlling an attitude or orientation of a turntable having a polishing surface and/or a carrier for holding an article to be polished in a sliding contact relation with the polishing surface. The turntable and carrier are connected to their drive shafts through universal joints. The attitude controllers control angles of tilting of the turntable and the carrier relative to their drive shafts.

摘要翻译： 提供了一种抛光装置，其包括姿态控制器，用于控制具有抛光表面和/或载体的转台的姿态或取向，用于保持与抛光表面滑动接触的待抛光制品。 转盘和托架通过万向节连接到驱动轴上。 姿态控制器控制转盘和托架相对于其驱动轴的倾斜角度。

公开(公告)号：US5716264A

公开(公告)日：1998-02-10

申请号：US683424

申请日：1996-07-18

申请人： Norio Kimura ,  Ritsuo Kikuta ,  You Ishii ,  Masayoshi Hirose

发明人： Norio Kimura ,  Ritsuo Kikuta ,  You Ishii ,  Masayoshi Hirose

IPC分类号： B24B37/00 ,  B24B53/007 ,  B24B21/18

CPC分类号： B24B53/017

摘要： A polishing apparatus is employed to polish an object to be polished by urging the surface of the object to be polished against the surface of a polishing cloth and causing a relative movement therebetween, while supplying a polishing liquid into an area between the object to be polished and the polishing cloth. A plurality of nozzles spray respective fluid jets to strike against the surface of the cloth. The plurality of nozzles include more than one type of nozzle which vary flow velocity, flow rate, angle of spray, and cross-sectional configuration of a jet. The plurality of nozzles have axes positioned at a location at different distances from the rotation axis of the polishing cloth.

摘要翻译： 抛光装置用于通过将待抛光物体的表面推压在抛光布的表面上并在其之间相对移动，同时将抛光液体提供到待抛光对象之间的区域中来抛光待抛光物体 和抛光布。 多个喷嘴喷射相应的流体射流以抵靠布的表面。 多个喷嘴包括不止一种类型的喷嘴，其改变流速，流速，喷射角度和射流的横截面构造。 多个喷嘴具有位于与抛光布的旋转轴线不同的距离处的轴线。

公开(公告)号：US5641054A

公开(公告)日：1997-06-24

申请号：US362451

申请日：1995-03-07

申请人： Satoshi Mori ,  Masao Matsumura ,  Yoichi Kanemitsu ,  Takeshi Yoshioka ,  Masaaki Kajiyama ,  Fumio Kondo ,  Yuji Shirao ,  Masato Eguchi ,  Hiroyuki Shinozaki ,  Yukio Ikeda ,  Masayoshi Hirose ,  Masaru Nakaniwa ,  Norio Kimura ,  Katsuaki Usui ,  Katsuyuki Aoki

发明人： Satoshi Mori ,  Masao Matsumura ,  Yoichi Kanemitsu ,  Takeshi Yoshioka ,  Masaaki Kajiyama ,  Fumio Kondo ,  Yuji Shirao ,  Masato Eguchi ,  Hiroyuki Shinozaki ,  Yukio Ikeda ,  Masayoshi Hirose ,  Masaru Nakaniwa ,  Norio Kimura ,  Katsuaki Usui ,  Katsuyuki Aoki

IPC分类号： H01L21/00 ,  H01L21/677 ,  B65G35/00

CPC分类号： H01L21/67167 ,  H01L21/67184 ,  H01L21/67709 ,  H01L21/67736

摘要： A magnetic levitation conveyor apparatus has levitation electromagnets, linear motors, and displacement sensors which are disposed outside of a tunnel, and a carriage of simple structure which is movable in the tunnel. The carriage is of canned structure for preventing gases from being generated. The carriage of canned structure allows the tunnel to have a reduced cross-sectional area and to be filled with a highly purified atmosphere such as of a high vacuum. The tunnel has substantially orthogonal branches at a branched point. In the branched point, the carriage can move, while being lifted out of contact with the tunnel partition, with a directional change from a main conveyor passage into a branched conveyor passage. The magnetic levitation conveyor apparatus is highly practical as it can control the carriage to be lifted and moved as described above.

摘要翻译： PCT No.PCT / JP93 / 00930 Sec。 371日期：1995年3月7日 102（e）1995年3月7日PCT PCT 1993年7月6日PCT公布。 第WO94 / 01354号公报 日期1994年1月20日磁悬浮输送装置具有设置在隧道外部的悬浮电磁体，线性电动机和位移传感器，以及可在隧道中移动的简单结构的滑架。 滑架是用于防止产生气体的罐头结构。 罐头结构的支架允许隧道具有减小的横截面积，并且填充有高度净化的气氛，例如高真空。 隧道在分支点处具有大致正交的分支。 在分支点，托架可以在与主输送机通道分支输送通道的方向改变的同时被提升而不与隧道隔板接触。 磁悬浮输送装置是高度实用的，因为它可以如上所述地控制滑架被提升和移动。

公开(公告)号：US5653624A

公开(公告)日：1997-08-05

申请号：US527422

申请日：1995-09-13

申请人： Seiji Ishikawa ,  Norio Kimura ,  Katsuyuki Aoki

发明人： Seiji Ishikawa ,  Norio Kimura ,  Katsuyuki Aoki

IPC分类号： B24B37/10 ,  B24B5/00 ,  B24B29/00

CPC分类号： B24B37/105

摘要： A compact polishing apparatus requires less operating space than a conventional polishing apparatus generally used for polishing semiconductor wafers. The present apparatus has a swing shaft to provide a swing motion to a pressing device including a top ring member. There are three ranges of swing motion, i.e. a polishing range which is a small motion range used for polishing a wafer within the confined area of a turntable, a receiving range which is a medium motion range used for loading/unloading of a wafer in an area beyond the turntable, and a standby range which is a large motion range used for moving the top ring member to a standby or rinsing position in an area beyond the turntable. Because of the swing-based arrangement of the components in the present apparatus, isolation of critical components is easily achieved, thus resulting in low maintenance costs and long service life of the present apparatus. These advantages offer significant cost savings in the management of polishing operations.

摘要翻译： 紧凑的抛光装置比通常用于抛光半导体晶片的常规抛光装置需要较少的操作空间。 本装置具有摆动轴，以向包括顶环构件的按压装置提供摆动运动。 有三个摆动运动范围，即抛光范围，该抛光范围是用于在转台的受限区域内抛光晶片的小运动范围，作为用于将晶片加载/卸载的介质运动范围的接收范围 以及用于将顶环构件移动到转台之外的区域中的待机或冲洗位置的大的运动范围的待机范围。 由于本装置中的部件的基于摆动的布置，容易实现关键部件的隔离，因此导致本装置的维护成本低和使用寿命长。 这些优点为抛光操作的管理提供了显着的成本节约。

公开(公告)号：US5584959A

公开(公告)日：1996-12-17

申请号：US291530

申请日：1994-08-16

申请人： Norio Kimura ,  Katsuyuki Aoki ,  Kiyotaka Kawashima ,  Seiji Ishikawa

发明人： Norio Kimura ,  Katsuyuki Aoki ,  Kiyotaka Kawashima ,  Seiji Ishikawa

IPC分类号： B01D53/14 ,  B01D53/50 ,  B01D53/58 ,  B24B55/03 ,  C02F1/52 ,  H01L21/00

CPC分类号： C02F1/5236 ,  B01D53/14 ,  B01D53/1456 ,  B01D53/50 ,  B01D53/58 ,  B24B55/03 ,  C02F1/52 ,  C02F2103/18 ,  Y10S438/909

摘要： A waste treatment system in a polishing apparatus treats waste gas and waste liquid discharged from the polishing apparatus. The waste treatment system comprises an exhaust duct provided in a partition wall enclosing the polishing apparatus, a scrubber connected to the exhaust duct through an exhauster for scrubbing waste gas discharged from the polishing apparatus, a waste liquid receiver provided below an abrasive cloth of the polishing apparatus for receiving waste liquid generated by a polishing operation and a waste liquid treatment apparatus connected to the waste liquid receiver for treating the waste liquid discharged from the polishing apparatus.

摘要翻译： 抛光装置中的废物处理系统处理从抛光装置排出的废气和废液。 废物处理系统包括设置在包围抛光装置的分隔壁中的排气管道，通过用于洗涤从抛光装置排出的废气的排气器连接到排气管道的洗涤器，设置在抛光装置的研磨布下方的废液接收器 用于接收由抛光操作产生的废液的设备和连接到废液接收器的废液处理设备，用于处理从抛光设备排出的废液。

公开(公告)号：US5653623A

公开(公告)日：1997-08-05

申请号：US357176

申请日：1994-12-13

申请人： Norio Kimura ,  Seiji Ishikawa ,  Masako Kodera ,  Atsushi Shigeta ,  Riichirou Aoki

发明人： Norio Kimura ,  Seiji Ishikawa ,  Masako Kodera ,  Atsushi Shigeta ,  Riichirou Aoki

IPC分类号： B24B53/007 ,  B24B53/017 ,  B24B7/04 ,  B24B29/02

CPC分类号： B24B53/017

摘要： A polishing apparatus for polishing a surface of a workpiece such as a semiconductor wafer is installed in a clean room. The polishing apparatus includes a polishing section having a turntable with an abrasive cloth mounted on an upper surface thereof, a top ring for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, a loading section for loading the workpiece to be polished onto the top ring, and an unloading section for unloading the workpiece which has been polished from the top ring. A cover covers an entire area of movement of the top ring including the polishing section, the loading section and the unloading section. An exhaust duct discharges air of an interior space of the cover to an outside of an installation space of the polishing apparatus.

摘要翻译： 用于抛光诸如半导体晶片的工件的表面的抛光装置安装在洁净室中。 抛光装置包括具有安装在其上表面上的研磨布的转台的抛光部分，用于支撑待抛光工件的顶环，并将工件压靠在研磨布上，用于将待抛光工件加载的装载部分 以及用于卸载已经从顶环抛光的工件的卸载部分。 盖子覆盖包括抛光部分，装载部分和卸载部分在内的顶环的整个运动区域。 排气管将盖的内部空间的空气排出到抛光装置的安装空间的外部。