公开(公告)号：US20220029066A1

公开(公告)日：2022-01-27

申请号：US17450621

申请日：2021-10-12

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI

IPC: H01L33/48 ,  H01L33/60 ,  H01L25/075 ,  H01L33/50 ,  H01L33/62 ,  H01L33/00

Abstract: A method of producing a light source device includes providing a light emitting device having a substrate including a base member that includes a bottom surface and a recess. The substrate further including a wiring portion in the recess. The method further including providing a support substrate having a support base member, a first wiring pattern on a top surface of the support base member and including a joining region, and an insulating region, and applying a solder member such that the solder member on the insulating region has a volume larger than that of the solder member on the joining region. The light emitting device is placed on the support substrate while the solder member is separate from a portion of the wiring portion positioned in the vicinity of the bottom surface and the wiring portion is joined to the joining region.

公开(公告)号：US20210247053A1

公开(公告)日：2021-08-12

申请号：US17169094

申请日：2021-02-05

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Toru HASHIMOTO ,  Keiji EMURA

IPC: F21V14/06 ,  F21V5/04

Abstract: A light emitting module includes: a light guide member including: an emission region defined by a sectioning groove, a light source placement part located in the emission region, and a light adjusting hole that, in a schematic top view, is located between the sectioning groove and the light source placement part; and a light source located in the light source placement part. A refractive index of an inside of the light adjusting hole is lower than a refractive index of the light guide member. In the schematic top view, the light adjusting hole is not positioned on a first straight line connecting a center of the light source and a farthest point in the sectioning groove, the farthest point being farthest from the center of the light source.

公开(公告)号：US20210247051A1

公开(公告)日：2021-08-12

申请号：US17167511

申请日：2021-02-04

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Toru HASHIMOTO ,  Keiji EMURA

IPC: F21V14/06 ,  F21V5/04

Abstract: A light emitting module including: a light guide member including: an emission region defined by a sectioning groove, a light source placement part located in the emission region, and a light adjusting hole; and a light source disposed in the light source placement part. In the schematic top view: the light adjusting hole is not positioned on a first straight line connecting (i) a center of the light source and (ii) a point in the sectioning groove that is farthest from the center of the light source, and a first lateral face of the light adjusting hole has a first region, and a line normal to the first region is oblique to a second straight line connecting (i) the center of the light source and (ii) a point in the sectioning groove that is closest to the center of the light source.

公开(公告)号：US20210175393A1

公开(公告)日：2021-06-10

申请号：US17179881

申请日：2021-02-19

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Tomokazu MARUYAMA ,  Tetsuya ISHIKAWA

IPC: H01L33/50 ,  H01L33/36 ,  H01L33/48 ,  H01L33/62 ,  H01L33/34 ,  H01L33/56 ,  H01L33/60

Abstract: A light-emitting device includes a substrate comprising a base member, a first wiring, a second wiring, and a via hole; at least one light-emitting element electrically connected to and disposed on the first wiring; and a covering member having light reflectivity and covering a lateral surface of the light-emitting element and a front surface of the substrate. The base member defines a plurality of depressed portions separated from the via hole in a front view and opening on a back surface and a bottom surface of the base member. The substrate includes a third wiring covering at least one of inner walls of the plurality of depressed portions and electrically connected to the second wiring. A depth of each of the plurality of depressed portions defined from the back surface toward the front surface is larger on a bottom surface side than on an upper surface side of the base member.

公开(公告)号：US20200176652A1

公开(公告)日：2020-06-04

申请号：US16784387

申请日：2020-02-07

Applicant: NICHIA CORPORATION

Inventor： Suguru BEPPU ,  Yoichi BANDO ,  Hiroto TAMAKI ,  Takuya NAKABAYASHI

IPC: H01L33/60 ,  H01L33/50 ,  H01L21/3213

Abstract: A light emitting device includes: a light emitting element; a wavelength conversion member disposed on or above an upper surface of the light emitting element; a light-transmissive member disposed on an upper surface of the wavelength conversion member; and a light reflective member disposed on each side surface of the light emitting element, the wavelength conversion member, and the light-transmissive member, wherein an upper surface of the light reflective member is coplanar with an upper surface of the light-transmissive member, and wherein each of the upper surface of the light reflective member and the upper surface of the light-transmissive member is a cut surface.

公开(公告)号：US20200083421A1

公开(公告)日：2020-03-12

申请号：US16567468

申请日：2019-09-11

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI

IPC: H01L33/62 ,  H01L33/56

Abstract: A method of producing a light source device includes providing a light emitting device having a substrate including a base member that includes a bottom surface and a recess. The substrate further including a wiring portion in the recess. The method further including providing a support substrate having a support base member, a first wiring pattern on a top surface of the support base member and including a joining region, and an insulating region, and applying a solder member such that the solder member on the insulating region has a volume larger than that of the solder member on the joining region. The light emitting device is placed on the support substrate while the solder member is separate from a portion of the wiring portion positioned in the vicinity of the bottom surface and the wiring portion is joined to the joining region.

公开(公告)号：US20190295994A1

公开(公告)日：2019-09-26

申请号：US16360750

申请日：2019-03-21

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Yukiko YOKOTE

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/54 ,  H01L33/48 ,  H01L33/50

Abstract: A light emitting device includes: a substrate including a base member including an upper surface, a lower surface and one or more lateral surfaces, and defining a recess that is opened at the upper surface and the lateral surfaces and surrounds an outer perimeter of the upper surface; a first light emitting element; a second light emitting element; a light guide member covering the first and the second light emitting elements and the upper surface of the base member; and a first reflective member having a closed-ring shape surrounding the upper surface of the base member and the light guide member, a portion of the first reflective member being located in the recess. At least one of the lateral surfaces of the base member and corresponding at least one of one or more outer lateral surfaces of the first reflective member are in the same plane.

公开(公告)号：US20180315914A1

公开(公告)日：2018-11-01

申请号：US16028331

申请日：2018-07-05

Applicant: NICHIA CORPORATION

Inventor： Shimpei SASAOKA ,  Takuya NAKABAYASHI

IPC: H01L33/62 ,  H01L33/54 ,  H01L33/56 ,  H01L33/38 ,  H05K1/03 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L33/38 ,  H01L33/486 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/18301 ,  H05K1/0313 ,  H01L2924/00014

Abstract: A method of manufacturing a light emitting device includes providing molded packages each of which has a recess. A light emitting component is mounted on a bottom surface of the recess. At least one sealing member covering the light emitting component is formed within the recess. A lead frame including a first lead and a second lead is provided, the first lead having a first groove on an upper surface of the first lead the second lead having a second groove on an upper surface of the second lead. Spaces are formed, each of the spaces being surrounded with an upper metal mold, a lower metal mold, and the lead frame by cooperatively holding the lead frame with the upper metal mold and the lower metal mold. The spaces and the first groove and the second groove are filled with a resin.

公开(公告)号：US20180226549A1

公开(公告)日：2018-08-09

申请号：US15888266

申请日：2018-02-05

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Tadaaki IKEDA

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/62 ,  H01L33/50 ,  H01L23/00 ,  C09K11/77 ,  C09K11/08 ,  C09K11/61

CPC classification number: H01L33/60 ,  C09K11/0883 ,  C09K11/617 ,  C09K11/7734 ,  H01L23/562 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/502 ,  H01L33/62 ,  H01L33/642

Abstract: A light emitting device includes a mounting board, first and second light emitting elements and a light reflective covering member. The mounting board includes an insulating base, first and second lands arranged, and an intermediate part arranged between the first and second lands. The first and second light emitting elements are flip-chip mounted on the first and second lands, respectively. The light reflective covering member is provided above the intermediate part and covers lateral surfaces of the first and second light emitting elements. The light reflective covering member defines a recess part arranged above the intermediate part with a bottom of the recess part being positioned below top surfaces of the first and second light emitting elements and above the top surface of the intermediate part, and a surface of the light reflective covering member defining the recess part constitutes a part of an outer surface of the light emitting device.

公开(公告)号：US20180122783A1

公开(公告)日：2018-05-03

申请号：US15853852

申请日：2017-12-25

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Tadaaki Ikeda

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/60 ,  H01L33/56 ,  H01L33/48 ,  H01L33/54 ,  H01L33/50

CPC classification number: H01L25/0753 ,  H01L33/483 ,  H01L33/502 ,  H01L33/504 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

Abstract: A light emitting device includes a first light emitting element, a second light emitting element, a substrate, and a light reflective covering member. A first land is provided in a substrate front surface and includes a first terminal and a second terminal. A second land is provided in the substrate front surface and includes a third terminal and a fourth terminal. An intermediate wiring is provided between the first land and the second land in the substrate front surface. A first wiring is provided in a substrate back surface and is electrically connected to the first terminal through a first through-via. A second wiring is provided in the substrate back surface and is electrically connected to the fourth terminal through a second through-via. A third wiring is provided in the substrate back surface and is electrically connected to the second terminal and the third terminal through a third through-via.