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公开(公告)号:US11336078B2
公开(公告)日:2022-05-17
申请号:US16611372
申请日:2018-06-08
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Sven Gerhard , Christoph Eichler , Alfred Lell , Bernhard Stojetz
Abstract: A semiconductor laser diode is specified, the semiconductor laser diode includes a semiconductor layer sequence having an active layer which has a main extension plane and which, in operation, is adapted to generate light in an active region and to emit light via a light-outcoupling surface, the active region extending from a rear surface opposite the light-outcoupling surface to the light-outcoupling surface along a longitudinal direction in the main extension plane, the semiconductor layer sequence having a surface region on which a first cladding layer is applied in direct contact, the first cladding layer having a transparent material from a material system different from the semiconductor layer sequence, and the first cladding layer being structured and having a first structure.
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公开(公告)号:US11086138B2
公开(公告)日:2021-08-10
申请号:US16320550
申请日:2017-07-24
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Bernhard Stojetz , Alfred Lell , Christoph Eichler , Andreas Löffler , Harald König , André Somers , Clemens Vierheilig
IPC: H04N13/30 , G02B30/27 , H04N13/305 , H04N13/32 , H04N13/307 , G02B30/24 , G02B30/35
Abstract: A method of autostereoscopic imaging including providing an autostereoscopic illumination unit including a lens field composed of a multiplicity of individual lenses or concave mirrors, and modulating an emission characteristic of the light source such that the individual lenses or the concave mirrors are illuminated only partly by the light source, wherein light from the light source impinges on the individual lenses or concave mirrors such that an emission characteristic of a three-dimensional object is imitated, the lens field extends over a spatial angle range of at least 2 sr relative to the light source or an external observer, the individual lenses or concave mirrors are distributed over the lens field and are at least partially sequentially irradiated, and the light source is formed by one or more lasers and the laser or each of the lasers irradiates/irradiate only one of the individual lenses at a specific point in time.
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公开(公告)号:US10270225B2
公开(公告)日:2019-04-23
申请号:US15773162
申请日:2016-11-02
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Bernhard Stojetz , Alfred Lell , Christoph Eichler , Andreas Löffler , André Somers
IPC: H01S5/00 , H01S5/40 , H01S5/20 , H01S5/10 , H01S5/022 , H01S5/026 , H01S5/343 , H01S5/323 , H01S5/028 , H01S5/42
Abstract: A semiconductor laser arrangement and a projector are disclosed. In an embodiment the semiconductor laser arrangement includes at least two electrically pumped active zones, each active zone configured to emit laser radiation of a different emission wavelength and a semiconductor-based waveguide structure, wherein the active zones are electrically independently operable of one another, wherein the active zones optically follow directly one another along a beam direction and are arranged in a descending manner with regard to their emission wavelengths, wherein at least in a region of a last active zone along the beam direction, a laser radiation of all active zones jointly runs through the waveguide structure, wherein at least the last active zone comprises a plurality of waveguides which are stacked one above the other and are oriented parallel to one another, wherein one of the waveguides is configured for the radiation emitted by the last active zone.
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公开(公告)号:US20180062346A1
公开(公告)日:2018-03-01
申请号:US15794374
申请日:2017-10-26
Applicant: OSRAM Opto Semiconductors GmbH , OSRAM GmbH
Inventor: Markus Horn , Andreas Breidenassel , Karsten Auen , Bernhard Stojetz , Thomas Schwarz
CPC classification number: H01S5/02208 , H01L2924/19107 , H01S5/02216 , H01S5/02236 , H01S5/02248 , H01S5/02272 , H01S5/02276 , H01S5/02296 , H01S5/02469 , H01S5/02476 , H01S5/4018 , H01S5/4025 , H01S5/4031 , H01S5/405
Abstract: A laser component includes a housing, the housing including a base surface and side walls which are perpendicular to the base surface, wherein a first carrier block and a second carrier block are arranged parallel to each other at the base surface, a first laser chip arranged on a longitudinal side of the first carrier block; and a further laser chip arranged on a longitudinal side of the second carrier block, wherein an emission direction of the first laser chip and the further laser chip is oriented perpendicular to the base surface.
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公开(公告)号:US09531163B2
公开(公告)日:2016-12-27
申请号:US14697228
申请日:2015-04-27
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Bernhard Stojetz , Alfred Lell , Christoph Eichler
CPC classification number: H01S5/22 , H01S5/0202 , H01S5/0203 , H01S5/0207 , H01S5/0213 , H01S5/0653 , H01S5/2022 , H01S5/3013 , H01S5/34313 , H01S5/34333 , H01S2301/17
Abstract: A semiconductor laser diode includes a substrate. A semiconductor layer sequence on the substrate has at least one active layer designed for generating laser light that is emitted along an emission direction during operation. At least one filter layer has a main extension plane that is parallel to a main extension plane of the active layer and that is designed to scatter and/or absorb light that propagates in the semiconductor layer sequence and/or the substrate in addition to the laser light.
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公开(公告)号:US20150055667A1
公开(公告)日:2015-02-26
申请号:US14533292
申请日:2014-11-05
Applicant: OSRAM Opto Semiconductors GmbH , OSRAM GmbH
Inventor: Markus Horn , Andreas Breidenassel , Karsten Auen , Bernhard Stojetz , Thomas Schwarz
CPC classification number: H01S5/02208 , H01L2924/19107 , H01S5/02216 , H01S5/02236 , H01S5/02248 , H01S5/02272 , H01S5/02276 , H01S5/02296 , H01S5/02469 , H01S5/02476 , H01S5/4018 , H01S5/4025 , H01S5/4031 , H01S5/405
Abstract: A laser component includes a housing in which a first carrier block is arranged. A first laser chip having an emission direction is arranged on a longitudinal side of the first carrier block. The first laser chip electrically conductively connects to a first contact region arranged on the first carrier block and a second contact region arranged on the first carrier block. There is a respective electrically conductive connection between the first contact region and a first contact pin of the housing and between the second contact region and a second contact pin of the housing.
Abstract translation: 激光部件包括其中布置有第一载体块的壳体。 具有发射方向的第一激光芯片布置在第一载体块的纵向侧上。 第一激光芯片导电地连接到布置在第一载体块上的第一接触区域和布置在第一载体块上的第二接触区域。 在第一接触区域和壳体的第一接触销之间以及在第二接触区域和壳体的第二接触销之间存在相应的导电连接。
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公开(公告)号:US20200321749A1
公开(公告)日:2020-10-08
申请号:US16318084
申请日:2017-07-12
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Sven Gerhard , Christoph Eichler , Alfred Lell , Bernhard Stojetz
Abstract: A semiconductor laser diode includes a semiconductor layer sequence with an active layer having a main extension plane and that generates light in an active region and emits light via a light outcoupling surface during operation, wherein the active region extends from a rear surface opposite the light outcoupling surface to the light outcoupling surface along a longitudinal direction, the semiconductor layer sequence includes a trench structure having at least one trench or a plurality of trenches on at least one side laterally next to the active region, and each trench of the trench structure extends in a longitudinal direction and projects from a top side of the semiconductor layer sequence in a vertical direction into the semiconductor layer sequence, and the trench structure varies in a lateral and/or vertical and/or longitudinal direction with respect to properties of the at least one trench or the plurality of trenches.
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公开(公告)号:US10388823B2
公开(公告)日:2019-08-20
申请号:US15594519
申请日:2017-05-12
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Alfred Lell , Andreas Loeffler , Christoph Eichler , Bernhard Stojetz , Andre Somers
IPC: H01L33/00 , H01L21/67 , H01L33/62 , H01L21/687 , H01L33/26 , H01L33/32 , H01S5/32 , H01S5/10 , H01S5/40 , H01S5/22 , H01S5/323 , H01S5/026 , H01S5/20 , H01S5/227
Abstract: A semiconductor chip (100) is provided, having a first semiconductor layer (1), which has a lateral variation of a material composition along at least one direction of extent. Additionally provided is a method for producing a semiconductor chip (100).
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公开(公告)号:US10361534B2
公开(公告)日:2019-07-23
申请号:US16069674
申请日:2017-02-23
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Bernhard Stojetz , Alfred Lell , Christoph Eichler , Andreas Löffler
Abstract: A semiconductor light source is disclosed. In an embodiment a semiconductor light source includes at least one semiconductor laser configured to generate a primary radiation and at least one coupling-out element comprising a continuous base region and rigid light guide columns extending away from the base region, the light guide columns acting as waveguides for the primary radiation, wherein the primary radiation is irradiated into the base region during operation, is led through the base region to the light guide columns and is directionally emitted from the light guide columns so that an intensity half-value angle of the emitted primary radiation is at most 90°.
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公开(公告)号:US20190173264A1
公开(公告)日:2019-06-06
申请号:US16092495
申请日:2017-03-27
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Bernhard Stojetz , Georg Brüderl
Abstract: In an embodiment a laser include a semiconductor layer sequence having an active zone for generating radiation and an electrical contact web arranged on a top side of the semiconductor layer sequence, wherein the contact web is located on the top side only in an electrical contact region or is in electrical contact with the top side only in the contact region so that the active zone is supplied with current only in places during operation, wherein the contact web comprises a plurality of metal layers at least partially stacked one above the other, wherein at least one of the metal layers comprises a structuring so that the at least one metal layer only partially covers the contact region and has at least one opening or interruption, and wherein the structuring reduces stresses of the semiconductor layer sequence on account of different thermal expansion coefficients of the metal layers.
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