公开(公告)号：US10115713B2

公开(公告)日：2018-10-30

申请号：US14430625

申请日：2013-09-26

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Luca Haiberger ,  Markus Wicke ,  Yanqi Wang

IPC: H01L33/00 ,  H01L31/10 ,  H01L25/16 ,  H01L31/14 ,  H01L31/0232 ,  H05B33/08

Abstract: An optoelectronic assembly includes at least one first component that emits first electromagnetic radiation and at least one first photosensitive component that controls the first component. The first photosensitive component connects in parallel to the first component and has a first radiation-sensitive region in a beam path of the first electromagnetic radiation.

公开(公告)号：US10020433B2

公开(公告)日：2018-07-10

申请号：US15308648

申请日：2015-05-07

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Luca Haiberger

IPC: H01L33/00 ,  H01L33/56 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62 ,  H01L33/50

CPC classification number: H01L33/56 ,  H01L33/486 ,  H01L33/502 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2933/0058 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An optoelectronic component includes a housing, wherein a cavity is formed on an upper side of the housing, which is delimited by a wall, the housing has an empty space, the wall is arranged between the cavity and the empty space, the housing has a surface, the empty space is arranged between the surface of the housing and the wall, the wall and the surface are arranged at least partially parallel to each other, the wall includes an optically transparent material, and the wall has a wall thickness of 1 μm to 100 μm.

公开(公告)号：US20150236000A1

公开(公告)日：2015-08-20

申请号：US14430625

申请日：2013-09-26

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Luca Haiberger ,  Markus Wicke ,  Yanqi Wang

IPC: H01L25/16 ,  H01L31/0232 ,  H05B33/08 ,  H01L31/14

CPC classification number: H01L25/167 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An optoelectronic assembly includes at least one first component that emits first electromagnetic radiation and at least one first photosensitive component that controls the first component. The first photosensitive component connects in parallel to the first component and has a first radiation-sensitive region in a beam path of the first electromagnetic radiation.

Abstract translation: 光电组件包括发射第一电磁辐射的至少一个第一部件和控制第一部件的至少一个第一光敏部件。 第一感光部件与第一部件并联连接，并且在第一电磁辐射的光束路径中具有第一辐射敏感区域。

公开(公告)号：US11596333B2

公开(公告)日：2023-03-07

申请号：US16604083

申请日：2018-05-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Luca Haiberger

IPC: A61B5/1455 ,  A61B5/00 ,  H01L25/16

Abstract: An optoelectronic sensor module and a method for producing an optoelectronic sensor module are disclosed. In an embodiment an optoelectronic sensor module includes a first semiconductor transmitter chip configured to emit radiation of a first wavelength, a second semiconductor transmitter chip configured to emit radiation of a second wavelength different from the first wavelength, a semiconductor detector chip configured to detect the radiation of the first and second wavelengths, and a first potting body being opaque to the radiation of the first and the second wavelength, wherein the first potting body directly covers side surfaces of the chips and mechanically connects the chips located in a common plane to one another, wherein a distance between the chips is less than or equal to twice an average diagonal length of the chips, and wherein the sensor module is adapted to rest against a body part to be examined.

公开(公告)号：US11482512B2

公开(公告)日：2022-10-25

申请号：US16279108

申请日：2019-02-19

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Luca Haiberger

IPC: H01L25/16 ,  H01L33/36 ,  H01L23/31

Abstract: An optoelectronic component includes an optoelectronic semiconductor chip that generates primary radiation during intended operation of the semiconductor chip, which primary radiation is coupled out via an emission side of the semiconductor chip, an optical element on the emission side and including a plurality of transmission fields arranged laterally side by side, wherein each transmission field is individually and independently electrically controllable, the transmission fields each include an electrochromic material, the transmission fields are such that, by electrically driving a transmission field, the transmittance of the electrochromic material for a radiation coming from the direction of the semiconductor chip during operation is changed and transmittance of the optical element in the region of the respective transmission field is changed for the respective radiation.

公开(公告)号：US20220102562A1

公开(公告)日：2022-03-31

申请号：US17425596

申请日：2020-01-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Luca Haiberger ,  Daniel Richter

IPC: H01L31/0232 ,  H01L31/173 ,  G02B6/42

Abstract: In an embodiment an optoelectronic sensor arrangement includes a carrier substrate, an illuminating device, a frequency-selective optical element and a photodetector, wherein the illuminating device and the photodetector form a stacked arrangement on or with the carrier substrate, wherein the frequency-selective optical element is arranged between the illuminating device and the photodetector, wherein the photodetector is arranged in a cavity of the carrier substrate which is covered by the illuminating device and/or the frequency-selective optical element, and wherein the frequency-selective optical element includes a divider mirror and an optical filter.

公开(公告)号：US20190259738A1

公开(公告)日：2019-08-22

申请号：US16279108

申请日：2019-02-19

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Luca Haiberger

IPC: H01L25/16 ,  H01L23/31 ,  H01L33/36

Abstract: An optoelectronic component includes an optoelectronic semiconductor chip that generates primary radiation during intended operation of the semiconductor chip, which primary radiation is coupled out via an emission side of the semiconductor chip, an optical element on the emission side and including a plurality of transmission fields arranged laterally side by side, wherein each transmission field is individually and independently electrically controllable, the transmission fields each include an electrochromic material, the transmission fields are such that, by electrically driving a transmission field, the transmittance of the electrochromic material for a radiation coming from the direction of the semiconductor chip during operation is changed and transmittance of the optical element in the region of the respective transmission field is changed for the respective radiation.

公开(公告)号：US20180145230A1

公开(公告)日：2018-05-24

申请号：US15877270

申请日：2018-01-22

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Luca Haiberger ,  Matthias Sperl

IPC: H01L33/48 ,  H01L23/00 ,  H01L33/00 ,  H01L33/54 ,  H01L33/62

Abstract: An electronic component, an optoelectronic component, and a component arrangement are disclosed. In an embodiment the electronic component includes an electronic semiconductor chip and a molded body, wherein the molded body covers at least one side face of the electronic semiconductor chip, wherein a surface of the electronic semiconductor chip is at least partly not covered by the molded body, wherein the molded body includes a first side face with a peg, and wherein the molded body includes a second side face with a groove matching the peg.