公开(公告)号：US09431378B2

公开(公告)日：2016-08-30

申请号：US14515802

申请日：2014-10-16

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Joachim Reill ,  Georg Bogner ,  Stefan Grötsch

IPC: H01L25/13 ,  H01L25/075 ,  H01L33/62 ,  H05K1/02 ,  H01L33/64 ,  H01L33/46 ,  H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H05K1/05

CPC classification number: H01L25/13 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/486 ,  H01L33/505 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0203 ,  H05K1/05 ,  H05K3/445 ,  H05K2201/10106 ,  H05K2201/10409 ,  H01L2924/00014

Abstract: A light-emitting diode includes a carrier including a metallic basic body having an outer face including a mounting face; and at least two light-emitting diode chips affixed to the carrier at least indirectly at the mounting face, wherein the at least two light-emitting diode chips are embedded in a reflective coating covering the mounting face and side faces of the at least two light-emitting diode chips, the at least two light-emitting diode chips have radiation exit surfaces facing away from the carrier, and the at least two light-emitting diode chips protrude with radiation exit surfaces out of the reflective coating, or the reflective coating terminates flush with the radiation exit surfaces of the at least two light-emitting diode chips.

Abstract translation: 发光二极管包括：载体，其包括具有包括安装面的外表面的金属基体; 以及至少两个发光二极管芯片至少间接地固定在所述安装面上，其中所述至少两个发光二极管芯片被嵌入到覆盖所述安装面和所述至少两个光的侧面的反射涂层中 所述至少两个发光二极管芯片具有背离载体的辐射出射表面，并且所述至少两个发光二极管芯片从辐射出射表面突出出反射涂层，或者反射涂层终止 与至少两个发光二极管芯片的辐射出射表面齐平。

公开(公告)号：US20160069539A1

公开(公告)日：2016-03-10

申请号：US14782673

申请日：2014-04-01

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Stefan Grötsch ,  Michael Brandl

IPC: F21V13/08

CPC classification number: F21V13/08 ,  F21Y2115/10 ,  F21Y2115/15 ,  F21Y2115/30 ,  H01L33/507 ,  H01L33/60 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2924/00

Abstract: A method of producing a conversion element includes providing a conversion body that converts electromagnetic radiation with regard to the wavelength thereof; applying an inorganic material to at least one portion of the conversion body; and forming a reflective layer that reflects the electromagnetic radiation and/or converted electromagnetic radiation with the inorganic material such that the inorganic material of the reflective layer enters into an adhesive connection with the conversion body.

Abstract translation: 一种转换元件的制造方法，其特征在于，提供转换体，其相对于其波长转换电磁辐射; 将无机材料施加到转化体的至少一部分; 以及形成反射层，其使所述电磁辐射和/或转换的电磁辐射与所述无机材料反射，使得所述反射层的无机材料进入与所述转换体的粘合连接。

公开(公告)号：US20150108531A1

公开(公告)日：2015-04-23

申请号：US14398557

申请日：2013-05-07

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Stefan Grötsch ,  Michael Zitzlsperger

IPC: H01L33/62 ,  H01L33/64 ,  H01L21/48 ,  H01L23/495

CPC classification number: H01L33/62 ,  H01L21/4828 ,  H01L23/49568 ,  H01L33/64 ,  H01L33/644 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2933/0066 ,  H01L2933/0075 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2224/4554

Abstract: A method of producing a component carrier for an electronic component includes a lead frame section including an electrically conductive material, the lead frame section having a first contact section that forms a first electrical contact element, a second contact section that forms a second electrical contact element, and a reception region that receives the electronic component, at least the reception region and the second contact section being electrically conductively connected to one another, a thermally conductive and electrically insulating intermediate element that dissipates heat from the reception region and electrically insulates the reception region formed at least on an opposite side of the lead frame section from the reception region, and a thermal contact that thermally contacts the electronic component formed at least on a side of the intermediate element facing away from the reception region.

Abstract translation: 一种制造电子部件用部件载体的方法包括：引线框架部分，其包括导电材料，所述引线框架部分具有形成第一电接触元件的第一接触部分，形成第二电接触元件的第二接触部分 以及接收电子部件的接收区域，至少所述接收区域和所述第二接触部彼此导电连接，导热和电绝缘的中间元件，其从所述接收区域散热并使所述接收区域电绝缘 至少在引线框架部分的与接收区域相反的一侧上形成热接触部，该热接触部与形成在远离接收区域的中间元件的至少一侧形成的电子部件热接触。

公开(公告)号：US20240278645A1

公开(公告)日：2024-08-22

申请号：US18652629

申请日：2024-05-01

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias GOLDBACH ,  Stefan Grötsch ,  Lugwig Hofbauer ,  Sebastian Wittmann ,  Robert Regensburger ,  Thomas Schwarz ,  Michael Brandl ,  Andreas Dobner ,  Sebastian Stigler

IPC: B60K35/00 ,  B60K35/60 ,  H01B3/30 ,  H01B7/00 ,  H01B13/10 ,  H01L33/62

CPC classification number: B60K35/00 ,  H01B3/30 ,  H01B7/0018 ,  H01B13/103 ,  H01L33/62 ,  B60K35/60 ,  B60K2360/332 ,  B60K2360/47 ,  B60K2360/48 ,  B60K2360/785 ,  H01L2933/0066

Abstract: It is provided a window of a vehicle, optoelectronic circuits, in particular optoelectronic circuits for a window of a vehicle and a method for manufacturing a window of a vehicle including at least one optoelectronic component. It is further provided a display comprising at least one display module each comprising at least one optoelectronic array with a plurality of optoelectronic components, each optoelectronic component forming a pixel comprising at least one subpixel, in particular a μLED. In addition, a method for manufacturing a display module comprising at least one optoelectronic array with a plurality of optoelectronic components, each optoelectronic component forming a pixel comprising at least one subpixel, in particular a μLED, is provided.

公开(公告)号：US09739452B2

公开(公告)日：2017-08-22

申请号：US14782673

申请日：2014-04-01

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Stefan Grötsch ,  Michael Brandl

IPC: B32B3/00 ,  F21V13/08 ,  H01L33/60 ,  H01L33/50 ,  H01L33/64 ,  F21Y115/30 ,  F21Y115/10 ,  F21Y115/15

CPC classification number: F21V13/08 ,  F21Y2115/10 ,  F21Y2115/15 ,  F21Y2115/30 ,  H01L33/507 ,  H01L33/60 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2924/00

Abstract: A method of producing a conversion element includes providing a conversion body that converts electromagnetic radiation with regard to the wavelength thereof; applying an inorganic material to at least one portion of the conversion body; and forming a reflective layer that reflects the electromagnetic radiation and/or converted electromagnetic radiation with the inorganic material such that the inorganic material of the reflective layer enters into an adhesive connection with the conversion body.

公开(公告)号：US20160258588A1

公开(公告)日：2016-09-08

申请号：US15032502

申请日：2014-12-04

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Stefan Grötsch ,  Norbert Häfner

IPC: F21S8/10 ,  H01L33/48 ,  H01L25/075 ,  F21V23/04 ,  F21V23/00

CPC classification number: F21S41/192 ,  F21S41/141 ,  F21V23/005 ,  F21V23/04 ,  F21Y2101/00 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/156 ,  H01L33/486 ,  H01L33/505 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/0002 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An optoelectronic semiconductor component and an adaptive headlight are disclosed. In an embodiment an optoelectronic semiconductor component includes a carrier having a carrier top side and a carrier underside, a plurality of active zones, which are fitted at the carrier top side and which are designed for emitting radiation, electrical contact locations at the carrier underside, which are designed for electrically connecting the semiconductor component and a drive unit for electrically addressing the semiconductor component and for electrically driving the active zones, wherein the active zones are fitted in a regular grid at the carrier top side, wherein the grid has a grid pitch, wherein geometrical midpoints of radiation main sides of the active zones lie on grid points of the grid, and wherein a distance between the geometrical midpoints of marginal active zones and a closest edge of the carrier is at most 50% of the grid pitch.

Abstract translation: 公开了一种光电子半导体部件和自适应头灯。 在一个实施例中，光电子半导体部件包括具有载体顶侧和载体下侧的载体，多个有源区，其安装在载体顶侧并且被设计用于发射辐射，载体下侧的电接触位置， 它们被设计用于电连接半导体部件和用于电寻址半导体部件并用于电驱动有源区的驱动单元，其中有源区被安装在载体顶侧的规则栅格中，其中栅格具有网格间距 其中有源区域的辐射主侧面的几何中点位于网格的网格点上，并且其中边缘有效区域的几何中点与载体的最近边缘之间的距离为网格间距的至多50％。

公开(公告)号：US20160195231A1

公开(公告)日：2016-07-07

申请号：US14909554

申请日：2014-07-31

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Stefan Grötsch

IPC: F21S8/10

CPC classification number: F21S41/16 ,  F21S41/135 ,  F21S41/14 ,  F21S41/141 ,  F21S41/143 ,  F21S41/24 ,  F21S41/25 ,  F21S41/285 ,  F21S41/645 ,  F21S41/675 ,  F21Y2115/10 ,  F21Y2115/30 ,  G03B21/2033

Abstract: A lighting arrangement includes a light source, a taper, and a two-dimensional image generator, wherein the taper guides light from the light source to the two-dimensional image generator, and the lighting arrangement is configured as a motor vehicle headlamp.

Abstract translation: 照明装置包括光源，锥形和二维图像生成器，其中，锥度将来自光源的光引导到二维图像发生器，并且照明装置被配置为机动车辆前照灯。