公开(公告)号：US09835303B2

公开(公告)日：2017-12-05

申请号：US14654538

申请日：2013-12-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Siegfried Herrmann ,  Walter Wegleiter ,  Andreas Plöβl

IPC: F21S8/10 ,  H05K3/32 ,  H01L25/075 ,  H01L33/00 ,  H01L33/48 ,  H01L33/62

CPC classification number: H05K3/32 ,  F21S41/141 ,  F21S41/192 ,  F21S43/14 ,  F21S43/195 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0066 ,  H05K3/325 ,  H05K2201/10106 ,  H05K2201/1034 ,  H05K2201/10409 ,  H05K2201/10924 ,  Y10T29/49131 ,  H01L2924/00

Abstract: An optoelectronic device and a method for producing an optoelectronic device are disclosed. An embodiment of an optoelectronic device includes a carrier, an electrically conductive layer arranged on the carrier, at least one semiconductor chip comprising an active layer for generating electromagnetic radiation, wherein the semiconductor chip is electrically conductively and mechanically connected with the carrier via the electrically conductive layer. The device further comprises a holder, wherein a surface of the carrier remote from the semiconductor chip is arranged on the holder, wherein the carrier is mechanically connected with the holder by at least one fastening element and is fastened to the holder, wherein the fastening element passes completely through the carrier, and wherein the semiconductor chip is electrically conductively connected to the holder by the fastening element.

公开(公告)号：US09583467B2

公开(公告)日：2017-02-28

申请号：US14430215

申请日：2013-09-06

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Stefan Illek ,  Thomas Schwarz ,  Jürgen Moosburger ,  Walter Wegleiter

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/62 ,  H01L33/52 ,  H01L33/64

CPC classification number: H01L25/0753 ,  H01L33/505 ,  H01L33/52 ,  H01L33/62 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01L2924/00

Abstract: An optoelectronic semiconductor component and a method for making an optoelectronic semiconductor component are disclosed. In an embodiment the component includes a carrier including at least one conversion-medium body and a potting body, the potting body surrounding the conversion-medium body at least in places, as seen in plan view, electrical contact structures fitted at least indirectly to the carrier and a plurality of optoelectronic semiconductor chips fitted to a main face of the carrier, the optoelectronic semiconductor chips configured to generate radiation, wherein the conversion-medium body is shaped as a plate, wherein the semiconductor chips are directly mechanically connected to the conversion-medium body, and wherein the conversion-medium body is free of cutouts for the electrical contact structures and is not penetrated by the electrical contact structure.

Abstract translation: 公开了一种光电子半导体部件和制造光电半导体部件的方法。 在一个实施例中，部件包括载体，该载体包括至少一个转化介质体和灌封体，灌封体至少在一些地方围绕转化介质体，如平面图所示，电接触结构至少间接地安装在 载体和安装在载体的主面上的多个光电半导体芯片，所述光电子半导体芯片被配置为产生辐射，其中所述转换介质体被成形为板，其中所述半导体芯片直接机械地连接到所述转换 - 中间体，并且其中所述转换介质主体没有用于所述电接触结构的切口并且不被所述电接触结构穿透。

公开(公告)号：US09484508B2

公开(公告)日：2016-11-01

申请号：US14430539

申请日：2013-09-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Georg Dirscherl ,  Walter Wegleiter ,  Caroline Cassignol ,  Karl Weidner

IPC: H01L33/62 ,  H01L33/56 ,  H01L33/48 ,  H01L33/50 ,  H01L33/54

CPC classification number: H01L33/56 ,  H01L33/486 ,  H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention relates to an optoelectronic semiconductor component, which has a carrier element (1), on which an optoelectronic semiconductor chip (2) having at least one active layer is arranged, wherein the active layer is designed to emit or receive light during operation and wherein the semiconductor chip (2) is covered with a protective layer (3) that contains poly-para-xylenes.

Abstract translation: 本发明涉及一种具有载体元件（1）的光电子半导体元件，其上布置有具有至少一个有源层的光电子半导体芯片（2），其中该有源层被设计为在操作期间发射或接收光;以及 其中所述半导体芯片（2）被包含聚对二甲苯的保护层（3）覆盖。

公开(公告)号：US20150070914A1

公开(公告)日：2015-03-12

申请号：US14484069

申请日：2014-09-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Walter Wegleiter ,  Andreas Plößl ,  Frank Singer

IPC: F21V17/10 ,  F21K99/00 ,  F21V29/00

CPC classification number: F21V17/105 ,  F21K9/90 ,  F21V19/003 ,  F21V21/096 ,  F21V29/89 ,  F21Y2101/00 ,  F21Y2115/10 ,  Y10T29/4913

Abstract: An optoelectronic lighting device includes a lighting module with an optoelectronic semiconductor chip. A connection carrier has a first main surface and a second main surface facing away from the first main surface. The lighting module is arranged on the first main surface of the connection carrier, and the connection carrier adheres to a heat sink on account of a magnetic attraction.

Abstract translation: 光电照明装置包括具有光电半导体芯片的照明模块。 连接托架具有第一主表面和远离第一主表面的第二主表面。 照明模块布置在连接托架的第一主表面上，并且连接托架由于吸引力而附着在散热器上。