公开(公告)号：US20080254660A1

公开(公告)日：2008-10-16

申请号：US12214026

申请日：2008-06-16

申请人： Frank Stepniak ,  Larry Siebens ,  Charles Bindics ,  Anthony Reed

发明人： Frank Stepniak ,  Larry Siebens ,  Charles Bindics ,  Anthony Reed

IPC分类号： H01R3/00

CPC分类号： H01H33/02 ,  H01H1/385 ,  H01H31/32 ,  H01H33/025 ,  H01H33/565 ,  H01H2003/0273 ,  H01H2009/0292

摘要： An electrical switch which includes an insulative housing having a wall defining an axial bore therein, a first electrical contact disposed in the housing bore and a second electrical contact movably disposed in the housing bore between an open position and a closed position. When the contacts are in their open position, the second electrical contact is spaced apart from the first electrical contact and when the contacts are in their closed position, the second electrical contact is in electrical contact with the first electrical contact. The switch includes features to enhance safety and operation by reducing the possibility of arcing or flashover before and during the switching operation and to provide of visual indication of the state of the switch.

摘要翻译： 一种电气开关，其包括具有在其中限定轴向孔的壁的绝缘壳体，设置在所述壳体孔中的第一电触点和在打开位置和闭合位置之间可移动地设置在所述壳体孔中的第二电触点。 当触点处于其打开位置时，第二电触头与第一电触头间隔开，并且当触头处于其闭合位置时，第二电触点与第一电触点电接触。 该开关包括通过减少切换操作之前和期间的电弧或闪络的可能性来增强安全性和操作的特征，并提供开关状态的可视指示。

公开(公告)号：US20070141882A1

公开(公告)日：2007-06-21

申请号：US11642464

申请日：2006-12-20

申请人： Frank Stepniak

发明人： Frank Stepniak

IPC分类号： H01R13/53

CPC分类号： H01R13/53 ,  G01R15/16 ,  H01C7/12 ,  H01G4/12 ,  Y10S439/921

摘要： A separable electrical connector component generally including an insulating housing, a current carrying element disposed within the insulative housing and a voltage control device disposed within the housing. The housing has a mid-section, a first insertion end extending from the mid-section in a first direction, a second insertion end extending from the mid-section in a second direction opposite the first direction and a third section extending outwardly from the mid-section between the first and second insertion ends. The current carrying member extends through the first insertion end, the mid-section and the second insertion end. The voltage control device is disposed within the third section of the housing and is in electrical communication with the current carrying element.

摘要翻译： 通常包括绝缘壳体的可分离电连接器部件，设置在绝缘壳体内的载流元件和设置在壳体内的电压控制装置。 壳体具有中间部分，从中间部分沿第一方向延伸的第一插入端，从中间部分沿与第一方向相反的第二方向延伸的第二插入端和从中间部分向中延伸的第三部分 在第一和第二插入端之间。 电流承载构件延伸穿过第一插入端，中间部分和第二插入端。 电压控制装置设置在壳体的第三部分内并与载流元件电连通。

公开(公告)号：US20070089896A1

公开(公告)日：2007-04-26

申请号：US11256915

申请日：2005-10-24

申请人： Frank Stepniak ,  Larry Siebens

发明人： Frank Stepniak ,  Larry Siebens

IPC分类号： H02G15/08

CPC分类号： H02G15/064 ,  H01R13/53

摘要： An electrical connector component for sending and receiving communication signals through a power distribution line generally includes an internal conductor, an insulative housing surrounding the conductor and a signal filtering device having a medium-voltage end in electrical contact with the internal conductor and an opposite low-voltage terminal. The signal filtering device is adapted to substantially block passage of power signals yet substantially permit passage of communication signals between the medium-voltage end and the low-voltage terminal. In a method for sending and receiving communication signals through a power distribution line, an access point on a power distribution line is provided without de-energizing the power distribution line, passage of power signals through the access point is blocked and passage of communication signals through the access point are permitted.

公开(公告)号：US20060178026A1

公开(公告)日：2006-08-10

申请号：US11386625

申请日：2006-03-22

申请人： Alan Borgstrom ,  Frank Stepniak

发明人： Alan Borgstrom ,  Frank Stepniak

IPC分类号： H01R13/53

CPC分类号： H01R43/26 ,  H01R13/5216 ,  H01R13/5221 ,  H01R13/53 ,  H01R13/629 ,  H01R13/648 ,  H01R24/20 ,  H01R33/7678 ,  H01R2101/00 ,  Y10S439/921 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49218 ,  Y10T29/4922 ,  Y10T29/49224

摘要： A method for forming a separable electrical connector having an electrical interface surface includes the steps of molding an interface shell from a thermoplastic, placing the interface shell against an electrical interface portion of a mold cavity and molding a housing within the mold cavity. When placed in the mold cavity, the interface shell provides a barrier to the mold cavity interface portion, wherein the housing is isolated from the electrical interface potion of the mold cavity by the interface shell. The shell has an inner surface and an outer surface and the housing is bonded to one of the inner and outer surfaces, wherein the other of the inner and outer surfaces of the shell defines the electrical interface surface of the electrical connector.

摘要翻译： 一种用于形成具有电接口表面的可分离电连接器的方法包括以下步骤：从热塑性塑料模制界面壳体，将界面壳体抵靠模腔的电接口部分并将模制腔体模制在模腔内。 当放置在模腔中时，界面壳为模腔界面部分提供屏障，其中壳体通过界面壳与模腔的电接口部分隔离。 壳体具有内表面和外表面，并且壳体结合到内表面和外表面中的一个，其中壳体的内表面和外表面中的另一个限定电连接器的电接口表面。

公开(公告)号：US06943058B2

公开(公告)日：2005-09-13

申请号：US10391231

申请日：2003-03-18

申请人： Arun K. Chaudhuri ,  Derek B. Workman ,  Frank Stepniak ,  Matthew R. Walsh

发明人： Arun K. Chaudhuri ,  Derek B. Workman ,  Frank Stepniak ,  Matthew R. Walsh

IPC分类号： C08K5/54 ,  H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  H01L21/44

CPC分类号： H01L24/29 ,  C08K5/54 ,  H01L21/563 ,  H01L23/293 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014

摘要： A no-flow underfill material and process suitable for underfilling a bumped circuit component. The underfill material initially comprises a dielectric polymer material in which is dispersed a precursor capable of reacting to form an inorganic filler. The underfill process generally entails dispensing the underfill material over terminals on a substrate, and then placing the component on the substrate so that the underfill material is penetrated by the bumps on the component and the bumps contact the terminals on the substrate. The bumps are then reflowed to form solid electrical interconnects that are encapsulated by the resulting underfill layer. The precursor may be reacted to form the inorganic filler either during or after reflow.

摘要翻译： 无流动的底部填充材料和适用于底部填充凸起电路部件的工艺。 底部填充材料最初包括介电聚合物材料，其中分散有能够反应形成无机填料的前体。 底部填充过程通常需要在基底上的端子上分配底部填充材料，然后将部件放置在基板上，使得底部填充材料被部件上的凸块穿透，并且凸块接触基板上的端子。 然后将凸块回流以形成由所得底部填充层封装的固体电互连。 在回流期间或之后，可以将前体反应以形成无机填料。

公开(公告)号：US06802446B2

公开(公告)日：2004-10-12

申请号：US10060812

申请日：2002-02-01

申请人： Arun K. Chaudhuri ,  Frank Stepniak ,  Matthew R. Walsh

发明人： Arun K. Chaudhuri ,  Frank Stepniak ,  Matthew R. Walsh

IPC分类号： B23K3100

CPC分类号： H05K3/321 ,  C08L63/00 ,  C09J9/02 ,  C09J163/00 ,  H01B1/22 ,  H05K3/3489 ,  H05K2201/0218 ,  H05K2203/0425

摘要： A conductive adhesive material characterized by metallurgical bonds between electrically-conductive particles dispersed in a polymer matrix of the material. The polymer matrix has a fluxing capability when heated to reduce metal oxides on the surfaces of the particles. At least the outer surfaces of the particles are formed of a fusible material, so that sufficiently heating the conductive adhesive material will reduce metal oxides on the particles, and at least partially melt the fusible metal, enabling the particles to metallurgically bond to each other and to metal surfaces contacted by the adhesive material.

摘要翻译： 导电粘合剂材料，其特征在于分散在材料的聚合物基质中的导电颗粒之间的冶金结合。 聚合物基质在加热时具有助熔能力，以减少颗粒表面上的金属氧化物。 至少颗粒的外表面由可熔材料形成，使得充分加热导电粘合剂材料将减少颗粒上的金属氧化物，并且至少部分地熔化可熔金属，使得颗粒彼此冶金结合， 与由粘合剂材料接触的金属表面。

公开(公告)号：US06491548B2

公开(公告)日：2002-12-10

申请号：US09824069

申请日：2001-04-02

申请人： Frank Stepniak ,  Anthony Reed

发明人： Frank Stepniak ,  Anthony Reed

IPC分类号： H01R1368

CPC分类号： H01H9/102 ,  H01H85/205 ,  H01H85/22 ,  H01H2085/0225

摘要： A new elbow canister fuseholder is provided that includes an electrically insulated and shielded housing for placing a fuse in-line between a cable and an electrical apparatus for underground distribution application. An insulating tube is contained within the housing for easy sliding removal of the fuse through an end plug such that the elbow is reusable when a fuse is replaced.

摘要翻译： 提供了一种新的弯管罐保险丝座，其包括电绝缘和屏蔽的壳体，用于将线圈和电气设备之间的线路放置在地下分布应用中。 绝缘管被容纳在壳体内，用于容易地通过端塞滑动去除保险丝，使得当更换保险丝时，弯头可重复使用。

公开(公告)号：US06375062B1

公开(公告)日：2002-04-23

申请号：US09706543

申请日：2000-11-06

申请人： William D. Higdon ,  Frank Stepniak

发明人： William D. Higdon ,  Frank Stepniak

IPC分类号： B23K3102

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/067 ,  H05K3/3473 ,  H05K2201/0305 ,  H05K2203/043 ,  H05K2203/054 ,  H01L2924/00 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2924/013

摘要： A solder bumping method and structure for fine solder bump pitches. The method makes use of a semiconductor device having an input/output pad whose surface is provided with a solderable metal layer that serves as the UBM of the solder bump. A sacrificial layer is formed on the surface of the device to surround the metal layer. A plating seed layer is then formed on the metal layer and the surrounding surface of the sacrificial layer, after which a mask is formed on the seed layer and a via is defined in the mask to expose portions of the seed layer overlying the metal layer and the sacrificial layer. A solder material is deposited on the seed layer exposed within the via. The mask is then removed, followed by removal of a portion of the seed layer that is not covered by the solder material, leaving intact that portion of the seed layer beneath the solder material. The sacrificial layer is then removed, including that portion of the sacrificial layer underlying the seed layer, such that a gap is formed between the substrate and the remaining seed layer. Finally, the solder material is reflowed to form a solder bump into which the remaining seed layer is dissolved.

摘要翻译： 焊锡凸块间距的焊接凸块方法和结构。 该方法利用具有输入/输出焊盘的半导体器件，其表面设置有用作焊料凸块的UBM的可焊接金属层。 在器件的表面上形成牺牲层以围绕金属层。 然后在金属层和牺牲层的周围表面上形成电镀种子层，之后在种子层上形成掩模，并且在掩模中限定通孔以暴露覆盖金属层的种子层的部分，并且 牺牲层。 在暴露在通孔内的种子层上沉积焊料材料。 然后去除掩模，然后除去未被焊料材料覆盖的种子层的一部分，将种子层的该部分保持在焊料材料下方。 然后去除牺牲层，包括在种子层下面的牺牲层的那部分，使得在衬底和剩余的种子层之间形成间隙。 最后，焊料材料被回流以形成其中溶解剩余种子层的焊料凸点。