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公开(公告)号：US20140264649A1
公开(公告)日：2014-09-18
申请号：US13949291
申请日：2013-07-24
Applicant: Robert Bosch GmbH
Inventor： Christoph Schelling
CPC classification number: B81B3/0021 , B81B7/008 , B81B2201/0228 , B81B2201/0235 , B81B2207/015 , B81C1/0019 , B81C1/00246 , B81C2203/0136 , B81C2203/0145 , B81C2203/0714 , G01C19/5733 , G01C19/5769 , G01P15/0802 , G01P15/125
Abstract: A micromechanical structure includes a substrate, a micromechanical functional structure, and a conductor track arrangement. The substrate has a top side, and the micromechanical functional structure is formed in the substrate on the top side. The conductor track arrangement is formed above the top side of the substrate, and the conductor track arrangement includes at least two insulation layers of non-conductive material and a conductor track layer of conductive material located between the at least two insulation layers.
Abstract translation: 微机械结构包括基板，微机械功能结构和导体轨道布置。 基板具有顶侧，并且微机械功能结构形成在顶侧的基板中。 导体轨道布置形成在衬底的顶侧上方，并且导体轨道装置包括至少两个非导电材料的绝缘层和位于至少两个绝缘层之间的导电材料的导体轨道层。
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公开(公告)号：US20240158222A1
公开(公告)日：2024-05-16
申请号：US18055151
申请日：2022-11-14
Applicant: Robert Bosch GmbH
Inventor： Christoph Schelling , Timothy Schultz
IPC: B81B3/00
CPC classification number: B81B3/0021 , B81B2201/05 , B81B2203/0118 , B81B2203/0127 , B81B2203/0315 , B81B2207/053
Abstract: A fluidic microelectromechanical system (MEMS) device includes fluid interaction elements (FIEs) that are configured to be monitored by a sensing device to generate an electrical signal in response to a fluid flow through the device. The FIEs include a serial arrangement of cantilevered lever arms to achieve increased sensitivity in a fluid flow sensor as compared to some conventional MEMS devices.
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公开(公告)号：US11959802B2
公开(公告)日：2024-04-16
申请号：US17413198
申请日：2019-12-06
Applicant: Robert Bosch GmbH
Inventor： Ralf Noltemeyer , Martin Husnik , Eugen Baumgart , Marc Schmid , Reinhold Roedel , Benedikt Stein , Christoph Schelling , Christoph Daniel Kraemmer
CPC classification number: G01J3/26 , G01J3/0202 , G01J3/0208 , G01J3/0256 , G01J3/2803 , G01J2003/1226 , G01J2003/2813
Abstract: A spectrometer device includes an optical interference filter which is designed to filter specific wavelength ranges of an incident light beam on passage through the optical interference filter. The spectrometer device also includes a detector device which is designed to detect the filtered light beam. Further, the spectrometer device includes a focusing device with a reflective surface. The focusing device is designed to focus the filtered light beam onto the detector device by reflection on the surface.
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24.发明申请公开(公告)号：US20220221709A1
公开(公告)日：2022-07-14
申请号：US17609578
申请日：2020-04-29
Applicant: Robert Bosch GmbH
Inventor： Christoph Schelling , Christoph Daniel Kraemmer , Reinhold Roedel
Abstract: The disclosure relates to a mirror device for an interferometer device including a first mirror layer and a second mirror layer, which are arranged in parallel on top of one another and spaced apart from one another by a mirror layer spacing. The mirror layer spacing forms an intermediate space between the first and the second mirror layer. The intermediate space includes a gas or a vacuum, and at least one spacing structure which extends at least partially between the first and the second mirror layer. The spacing structure has a material that is the same as or different from the first and/or second mirror layer.
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公开(公告)号：US20220003534A1
公开(公告)日：2022-01-06
申请号：US17294950
申请日：2019-11-12
Applicant: Robert Bosch GmbH
Inventor： Benedikt Stein , Martin Husnik , Christoph Schelling , Thomas Buck , Christoph Daniel Kraemmer , Reinhold Roedel
Abstract: The disclosure relates to an interferometer including a substrate, and an intermediate layer region applied on the substrate. A first mirror device and a second mirror device are aligned plane-parallel with one another and are separated from one another by a first distance and are framed in or on the intermediate layer region, the intermediate layer region removed in at least one of an inner region below the first mirror device and below the second mirror device. A laterally structured electrode including a first subregion and a second laterally separated subregion which are configured to be connected to different electrical potentials. The electrode arranged at a second distance from the first or the second mirror device, the first subregion extending in the inner region and arranged on the intermediate layer region and the second subregion extending in an outer region of the intermediate layer region.
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Patent Agency Ranking
公开(公告)号：US20210356321A1
公开(公告)日：2021-11-18
申请号：US17277642
申请日：2019-10-22
Applicant: Robert Bosch GmbH
Inventor： Ralf Noltemeyer , Benedikt Stein , Christian Huber , Christoph Schelling , Christoph Daniel Kraemmer , Reinhold Roedel
Abstract: The disclosure relates to an interferometer element for use in a spectrometer which includes a micromechanical Fabry-Perot filter element, which has at least a first mirror element, a second mirror element, and a third mirror element. Each of the first mirror element, the second mirror element, and the third mirror element are arranged in series in an optical path of the interferometer element, and at least one of a first distance between the first and second mirror elements, and a second distance between the second and third mirror elements is modifiable.
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公开(公告)号：US20210164836A1
公开(公告)日：2021-06-03
申请号：US17262892
申请日：2019-07-09
Applicant: Robert Bosch GmbH
Inventor： Martin Husnik , Christian Huber , Reinhold Roedel , Benedikt Stein , Christoph Schelling
Abstract: A spectrometer device includes a Fabry-Perot interferometer unit, which comprises a first carrier substrate, wherein the first carrier substrate is arranged on a lower side of the Fabry-Perot interferometer unit and includes an optical aperture. The spectrometer includes at least one of a first substrate, which is arranged on an upper side of the Fabry-Perot interferometer unit, which faces away from the lower side, and a second substrate with the first carrier substrate arranged with the lower side on the second substrate. The spectrometer further includes a photodetector device arranged on or in the at least one of the second substrate and the first substrate. A first electrical connection region of the photodetector device and a second electrical connection region of the Fabry-Perot interferometer unit are electrically contacted from the same direction.
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公开(公告)号：US10830590B2
公开(公告)日：2020-11-10
申请号：US15867433
申请日：2018-01-10
Applicant: Robert Bosch GmbH
Inventor： Christoph Schelling , Ricardo Zamora
IPC: G01C19/5712 , B81C1/00 , G01L9/00 , G01L9/12 , G01P15/08 , G01P15/125
Abstract: A micromechanical sensor includes a base substrate, a cap substrate, and a MEMS substrate that is connected to each of the base and cap substrates by respective metallic bond connections and that includes a mechanical functional layer including movable MEMS elements, an electrode device for acquiring an indication of a movement of the MEMS elements and fashioned by layer deposition, and a sacrificial layer that is lower than the mechanical function layer, is fashioned by layer deposition, and is omitted in a region underneath the movable MEMS elements.
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29.发明授权公开(公告)号：US10607888B2
公开(公告)日：2020-03-31
申请号：US16475755
申请日：2018-04-06
Applicant: Robert Bosch GmbH
Inventor： Christoph Schelling , Johannes Classen , Simon Genter
IPC: H01L21/768 , H01L23/48 , H01L23/00
Abstract: A conductive through-plating for a substrate includes a metal component, a first conductive structure situated on or in the environment of a surface of the substrate, and a second conductive structure situated on or in the environment of a further surface of the substrate. A method for producing the through-plating includes, in a first step, at least partially applying above the surface a grid structure that includes a group of openings; in a second step following the first step, carrying out an etching producing a trench in the substrate and at least partially also underneath the group of openings; and, in a fifth step following the second step, carrying out a metallization situating a metal component at least partially in the trench such that the metal component is part of a seal sealing the trench in the area of the surface.
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30.发明申请公开(公告)号：US20180257932A1
公开(公告)日：2018-09-13
申请号：US15914092
申请日：2018-03-07
Applicant: Robert Bosch GmbH
Inventor： Benjamin Steuer , Christoph Schelling , Daniel Pantel , Stefan Pinter
CPC classification number: B81C1/00626 , B81B7/0067 , B81B2201/042 , B81C2201/0123 , B81C2201/0133 , B81C2201/016 , B81C2201/053 , G02B26/0833
Abstract: A method for manufacturing a micromechanical device includes providing a silicon substrate having a front side and a rear side, where a first normal of the front side deviates by a first angle from the direction of the silicon substrate; forming in the front side first and second trenches that are spaced apart from and essentially parallel to each other, with the first and second trenches extending along a direction of the deviation; forming on the front side a first etching mask that covers the front side except for a first opening area between the first and second trenches; and anisotropically etching the front side using the etching mask, thereby forming in the opening area an oblique surface having a second angle to the first normal, which approximately corresponds to the first angle.
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