公开(公告)号：US20070194087A1

公开(公告)日：2007-08-23

申请号：US11360901

申请日：2006-02-23

Applicant: Jonathan Ogborn ,  Robert Weaver ,  Craig Dallam ,  Randall Burt

Inventor： Jonathan Ogborn ,  Robert Weaver ,  Craig Dallam ,  Randall Burt

IPC: B23K31/12

CPC classification number: B23K35/0227

Abstract: Methods for rating welding electrodes are presented, in which a standardized vertical-down double cap pass welding procedure is performed using a test electrode to create a test weld on a substantially flat workpiece surface, and the electrode is rated according to the amount of porosity in the test weld. A first vertical-down bead-on-plate welding operation is performed to create a substantially straight first weld bead on the workpiece surface, followed by a standardized moderate first slag removal operation to expose an upper portion of the first bead while leaving some slag along one or both longitudinal sides of the first weld bead. A standardized second vertical-down welding operation is then performed with the test electrode to cover the first weld, and another slag removal operation is used to remove any remaining slag. The test electrode is then rated according to the ratio of the number of visually discernable pores in the second weld bead divided by the test weld length.

Abstract translation: 提出了对焊接电极进行评级的方法，其中使用测试电极进行标准化的垂直向下双盖通过焊接程序，以在基本上平坦的工件表面上产生测试焊接，并且根据孔隙度的量来评估电极 测试焊缝。 执行第一垂直向下焊盘焊接操作以在工件表面上产生基本上直的第一焊道，随后进行标准化的适度的第一除渣操作，以暴露第一焊道的上部，同时留下一些炉渣 第一焊道的一个或两个纵向侧面。 然后，用测试电极进行标准化的第二垂直向下焊接操作以覆盖第一焊缝，并且使用另一除渣操作来去除任何剩余的渣。 然后根据第二焊道中视觉上可辨别的孔的数量除以试验焊缝长度的比率对试验电极进行额定。

公开(公告)号：US20070193992A1

公开(公告)日：2007-08-23

申请号：US11357863

申请日：2006-02-21

Applicant: Randall Burt ,  Jon Chiappone ,  Craig Dallam ,  Robert Weaver

Inventor： Randall Burt ,  Jon Chiappone ,  Craig Dallam ,  Robert Weaver

IPC: B23K9/10

CPC classification number: B23K9/0286 ,  B23K31/12 ,  B23K2101/10

Abstract: A method of measuring the quality of a stick electrode used in forming the root bead of a pipe joint, which electrode has a wire diameter, a length substantially greater than 12 inches and an upper exposed rod head. The method comprises: preparing a standardized workpiece including two spaced plates with a groove between the plates having a set profile including a lower gap duplicating the root gap of the pipe joint and mounting the standardized workpiece on an incline with the groove facing upwardly where the incline is at a fixed known angle. Then a stick electrode of the type to be measured is selected and the rod head of the selected electrode is connected to the power lead of a DC power source set to a given output current correlated with the type of electrode. A root bead is laid in the gap from an upper start position on said workpiece by progressively filing the gap and then discontinuing the root bead welding at a lower end position when a given length of the electrode has been consumed; and, measuring the distance between the upper start position and the lower end position with the run out distance being indicative of a quality characteristic of the electrode. This method can be used to measure the run out per time instead of run out per electrode consumed length.

公开(公告)号：US20070187375A1

公开(公告)日：2007-08-16

申请号：US11355552

申请日：2006-02-16

Applicant: Randall Burt ,  Craig Dallam ,  Robert Weaver

Inventor： Randall Burt ,  Craig Dallam ,  Robert Weaver

IPC: B23K9/095

CPC classification number: B23K9/0286 ,  B23K31/12 ,  B23K2101/10

Abstract: Stick welding electrode rating and ranking procedures are provided for determining stackability performance of stick electrodes for pipe welding operations. The rating technique involves performance of a standardized vertical down weld procedure using a stick electrode to form a weld bead in a test workpiece groove, in which the electrode is maintained during welding at a substantially constant angle relative to the workpiece groove. The electrode is advanced toward the groove at a slow speed to deposit molten metal in the groove while keeping the molten metal above the stick electrode end or the arc thereof without dripping. The resulting bead distance is measured along with the welding time and the stick electrode is rated according to a ratio of the weld time and the bead distance.

公开(公告)号：US20070034516A1

公开(公告)日：2007-02-15

申请号：US11392477

申请日：2006-03-28

Applicant: Gregory Wilson ,  Paul McHugh ,  Robert Weaver ,  Thomas Ritzdorf

Inventor： Gregory Wilson ,  Paul McHugh ,  Robert Weaver ,  Thomas Ritzdorf

IPC: C25D21/12

CPC classification number: G05B19/41875 ,  C25D7/123 ,  C25D17/001 ,  C25D21/12 ,  G05B2219/32182 ,  G05B2219/32216 ,  G05B2219/45031 ,  Y02P90/22 ,  Y02P90/265

Abstract: A facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber is described. The facility initially configures the electrical parameters in accordance with either a numerical of the processing chamber or experimental data derived from operating the actual processing chamber. After a workpiece is processed with the initial parameter configuration, the results are measured and a sensitivity matrix based upon the numerical model of the processing chamber is used to select new parameters that correct for any deficiencies measured in the processing of the first workpiece. These parameters are then used in processing a second workpiece, which may be similarly measured, and the results used to further refine the parameters.

Abstract translation: 描述了一种用于选择和精炼用于在处理室中处理微电子工件的电参数的设备。 该设施最初根据处理室的数值或从操作实际处理室得到的实验数据来配置电参数。 在用初始参数配置处理工件之后，测量结果，并且使用基于处理室的数值模型的灵敏度矩阵来选择校正在第一工件的处理中测量的任何缺陷的新参数。 然后将这些参数用于处理可以类似地测量的第二工件，并且用于进一步改进参数的结果。

公开(公告)号：US20060124096A1

公开(公告)日：2006-06-15

申请号：US11302181

申请日：2005-12-12

Applicant: Robert Weaver

Inventor： Robert Weaver

IPC: F01L1/18

CPC classification number: F01L1/181 ,  Y10T29/49295 ,  Y10T29/49645 ,  Y10T74/20882 ,  Y10T74/2142 ,  Y10T74/2152 ,  Y10T74/216

Abstract: The present invention provides an improved rocker arm system for actuating poppet valves in high performance internal combustion engines. The rocker arm provides trunnion journals extending from each side fitted to outboard bearing mounts to guide the motion of the rocker arm. An I-beam rocker arm having high stiffness and low mass is disclosed.

Abstract translation: 本发明提供一种用于在高性能内燃机中驱动提升阀的改进的摇臂系统。 摇臂提供从安装在外侧轴承座上的每一侧延伸的耳轴轴颈，以引导摇臂的运动。 公开了具有高刚度和低质量的工字梁摇臂。

公开(公告)号：US20050245083A1

公开(公告)日：2005-11-03

申请号：US11053050

申请日：2005-02-07

Applicant: Linlin Chen ,  Gregory Wilson ,  Paul McHugh ,  Robert Weaver ,  Thomas Ritzdorf

Inventor： Linlin Chen ,  Gregory Wilson ,  Paul McHugh ,  Robert Weaver ,  Thomas Ritzdorf

IPC: C25D3/38 ,  C25D5/02 ,  C25D5/08 ,  C25D5/10 ,  C25D5/50 ,  C25D7/12 ,  C25D17/10 ,  C25D21/12 ,  H01L21/288 ,  H01L21/44 ,  H01L21/768

CPC classification number: H01L21/76868 ,  C25D3/38 ,  C25D5/08 ,  C25D5/10 ,  C25D5/50 ,  C25D7/123 ,  C25D17/02 ,  C25D17/10 ,  C25D17/12 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/76843 ,  H01L21/76873 ,  H01L21/76877 ,  H01L2221/1089 ,  Y10S204/07 ,  Y10T428/12493

Abstract: A process for metallization of a workpiece, such as a semiconductor workpiece. In an embodiment, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate copper directly onto a barrier layer material, or enhance an ultra-thin copper seed layer which has been deposited on the barrier layer using a deposition process such as PVD. The resulting copper layer provides an excellent conformal copper coating that fills trenches, vias, and other microstructures in the workpiece. When used for seed layer enhancement, the resulting copper seed layer provide an excellent conformal copper coating that allows the microstructures to be filled with a copper layer having good uniformity using electrochemical deposition techniques. Further, copper layers that are electroplated in the disclosed manner exhibit low sheet resistance and are readily annealed at low temperatures.

Abstract translation: 用于对诸如半导体工件的工件进行金属化的工艺。 在一个实施方案中，使用碱性电解铜浴将铜电镀到种子层上，将铜直接电镀到阻挡层材料上，或者使用沉积方法增强已经沉积在阻挡层上的超薄铜籽晶层 作为PVD。 所得到的铜层提供了一种优异的保形铜涂层，其填充工件中的沟槽，通孔和其它微结构。 当用于种子层增强时，所得到的铜种子层提供了优异的共形铜涂层，其允许使用电化学沉积技术使微结构填充具有良好均匀性的铜层。 此外，以所公开的方式电镀的铜层表现出低的薄层电阻，并且在低温下容易退火。

公开(公告)号：US20050167273A1

公开(公告)日：2005-08-04

申请号：US11096972

申请日：2005-03-31

Applicant: Gregory Wilson ,  Paul McHugh ,  Robert Weaver ,  Thomas Ritzdorf

Inventor： Gregory Wilson ,  Paul McHugh ,  Robert Weaver ,  Thomas Ritzdorf

IPC: B23H3/02 ,  C25B9/00 ,  C25C3/16 ,  C25C3/20 ,  C25D5/00 ,  C25D5/02 ,  C25D17/00 ,  C25D21/12 ,  C25F7/00 ,  G06F19/00

CPC classification number: C25D21/12 ,  C25D17/001 ,  C25F3/30

Abstract: A facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber is described. The facility initially configures the electrical parameters in accordance with either a mathematical model of the processing chamber or experimental data derived from operating the actual processing chamber. After a workpiece is processed with the initial parameter configuration, the results are measured and a sensitivity matrix based upon the mathematical model of the processing chamber is used to select new parameters that correct for any deficiencies measured in the processing of the first workpiece. These parameters are then used in processing a second workpiece, which may be similarly measured, and the results used to further refine the parameters. In some embodiments, the facility analyzes a profile of the seed layer applied to a workpiece, and determines and communicates to a material deposition tool a set of control parameters designed to deposit material on the workpiece in a manner that compensates for deficiencies in the seed layer.