公开(公告)号：USD708139S1

公开(公告)日：2014-07-01

申请号：US29456638

申请日：2013-05-31

Applicant: Samsung Electro-Mechanics Co., Ltd.

Designer： Do Jae Yoo ,  Sun Ho Kim ,  Kwang Soo Kim ,  Bum Seok Suh

公开(公告)号：US20140110833A1

公开(公告)日：2014-04-24

申请号：US14060456

申请日：2013-10-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae Yoo ,  Si Joong Yang

IPC: H01L23/00

CPC classification number: H01L23/049 ,  H01L21/4853 ,  H01L23/3735 ,  H01L23/42 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/16151 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/0665

Abstract: Disclosed herein is a power module package. The power module package includes a substrate having one surface formed with a circuit pattern including a chip mounting pad and an external connection pad and the other surface; a semiconductor chip mounted on the chip mounting pad; and an external connection terminal having one terminal and the other terminal, the one terminal being connected to the external connection pad and the other terminal protruding to the outside, in which the external connection pad and the external connection terminal are bonded to each other by welding.

Abstract translation: 这里公开了功率模块封装。 功率模块封装包括具有形成有包括芯片安装焊盘和外部连接焊盘以及另一表面的电路图案的一个表面的基板; 安装在芯片安装垫上的半导体芯片; 以及具有一个端子和另一个端子的外部连接端子，一个端子连接到外部连接焊盘，另一个端子突出到外部，其中外部连接焊盘和外部连接端子通过焊接彼此接合 。

公开(公告)号：US20140001619A1

公开(公告)日：2014-01-02

申请号：US13846591

申请日：2013-03-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae Yoo ,  Young Ki Lee ,  Bum Seok Suh ,  Joon Seok Chae

IPC: H01L23/495 ,  H01L21/50

CPC classification number: H01L23/495 ,  H01L21/50 ,  H01L23/055 ,  H01L23/13 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/492 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L24/96 ,  H01L25/072 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/12042 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00

Abstract: Disclosed herein is a power module package including an external connection terminal, a substrate in which a fastening unit allowing one end of the external connection terminal to be insertedly fastened thereinto is formed to penetrate in a thickness direction thereof, and a semiconductor chip mounted on one surface of the substrate.

公开(公告)号：US10356911B2

公开(公告)日：2019-07-16

申请号：US14732550

申请日：2015-06-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae Yoo ,  Jae Hyun Lim ,  Jong In Ryu ,  Kyu Hwan Oh ,  Ki Ju Lee

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H05K3/28 ,  H05K3/40 ,  H01L23/31

Abstract: An electronic device module includes: a board including at least one mounting electrode and at least one external connection electrode and having a protective insulation layer which is provided on an outer surface thereof; at least one electronic device mounted on the mounting electrodes; a molded part sealing the electronic device; and at least one connective conductor of which one end is bonded to the external connection electrode of the board and which penetrates through the molded part to be disposed in the molded part, wherein the protective insulation layer is disposed to be spaced apart from the connective conductor.

公开(公告)号：US09894790B2

公开(公告)日：2018-02-13

申请号：US14260994

申请日：2014-04-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae Yoo ,  Eun Jung Jo ,  Jae Hyun Lim

IPC: H05K7/00 ,  H05K5/06 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K5/065 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/115 ,  H05K3/0047 ,  H05K2201/09827 ,  H05K2203/107 ,  H01L2924/00014

Abstract: There are provided an electronic component module in which an external terminal is disposed outwardly from a mold part by a plating process and a manufacturing method thereof. The electronic component module includes a substrate, at least one electronic component mounted on the substrate, a mold part sealing the electronic component, and at least one connection conductor having one end bonded to one surface of the substrate and formed in the mold part so as to penetrate through the mold part. The connection conductor is formed to have a form in which horizontal cross-sectional areas of the connection conductor are gradually reduced toward the substrate and includes at least one step.

公开(公告)号：US09633923B2

公开(公告)日：2017-04-25

申请号：US14339075

申请日：2014-07-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae Yoo ,  Jae Hyun Lim ,  Sun Ho Kim

IPC: H01L23/31 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L23/3121 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/19107 ,  Y10T29/4913 ,  H01L2924/00

Abstract: There are provided an electronic device module capable of increasing a degree of integration by mounting electronic components on both surfaces of a board, and a manufacturing method thereof. The electronic device module includes a board having mounting electrodes formed on both surfaces thereof, a plurality of electronic devices mounted on the mounting electrodes, a molded portion sealing the electronic devices, at least one connection wire having one end bonded to one surface of the board and the other end exposed to the outside of the molded portion, and an external connection terminal coupled to the other end of the connection wire.

公开(公告)号：US09209114B2

公开(公告)日：2015-12-08

申请号：US13846591

申请日：2013-03-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae Yoo ,  Young Ki Lee ,  Bum Seok Suh ,  Joon Seok Chae

IPC: H01L23/34 ,  H01L23/495 ,  H01L21/50 ,  H01L23/373 ,  H01L23/055 ,  H01L23/14 ,  H01L23/492 ,  H01L23/498 ,  H01L25/07 ,  H01L23/00 ,  H01L23/13

CPC classification number: H01L23/495 ,  H01L21/50 ,  H01L23/055 ,  H01L23/13 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/492 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L24/96 ,  H01L25/072 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/12042 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00

Abstract: Disclosed herein is a power module package including an external connection terminal, a substrate in which a fastening unit allowing one end of the external connection terminal to be insertedly fastened thereinto is formed to penetrate in a thickness direction thereof, and a semiconductor chip mounted on one surface of the substrate.

Abstract translation: 这里公开了一种功率模块封装，其包括外部连接端子，基板，其中允许将外部连接端子的一端插入其中的紧固单元沿其厚度方向穿透;以及半导体芯片，其安装在一个 基板的表面。

公开(公告)号：US20150228625A1

公开(公告)日：2015-08-13

申请号：US14607062

申请日：2015-01-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Hyun Lim ,  Do Jae Yoo ,  Eun Jung Jo ,  Kyu Hwan Oh ,  Jong In Ryu

IPC: H01L25/065 ,  H01L21/56 ,  H01L51/50 ,  H01L23/522 ,  H01L23/31

CPC classification number: H01L23/3107 ,  H01L21/568 ,  H01L23/00 ,  H01L23/3114 ,  H01L24/00 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/48095 ,  H01L2924/13055 ,  H01L2924/00

Abstract: There are provided a semiconductor package and a method of manufacturing the same. According to an exemplary embodiment of the present disclosure, a semiconductor package includes: a semiconductor device formed in a multilayer; a plurality of wires electrically connected to both sides of a plurality of semiconductor devices; a first mold via electrically connected to the plurality of wires which are formed at one side of the plurality of semiconductor devices; a second mold via electrically connected to the plurality of wires which are formed at the other side of the plurality of semiconductor device; and a first molding part enclosing the plurality of semiconductor device and formed to expose upper surface parts of the first mold via and the second mold via.

Abstract translation: 提供半导体封装及其制造方法。 根据本公开的示例性实施例，半导体封装包括：形成为多层的半导体器件; 多个电线电连接到多个半导体器件的两侧; 第一模具电路，其电连接到形成在所述多个半导体器件的一侧的所述多根导线; 第二模具，其电连接到形成在所述多个半导体器件的另一侧的所述多根导线; 以及封闭所述多个半导体器件并形成为暴露所述第一模具通孔和所述第二模具通孔的上表面部分的第一模制部件。

公开(公告)号：US20140220743A1

公开(公告)日：2014-08-07

申请号：US14252780

申请日：2014-04-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae Yoo ,  Young Ki Lee ,  Bum Seok Suh ,  Joon Seok Chae

IPC: H01L23/495 ,  H01L23/00

CPC classification number: H01L23/495 ,  H01L21/50 ,  H01L23/055 ,  H01L23/13 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/492 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L24/96 ,  H01L25/072 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/12042 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00

Abstract: Disclosed herein is a power module package including an external connection terminal, a substrate in which a fastening unit allowing one end of the external connection terminal to be insertedly fastened thereinto is formed to penetrate in a thickness direction thereof, and a semiconductor chip mounted on one surface of the substrate.

Abstract translation: 这里公开了一种功率模块封装，其包括外部连接端子，基板，其中允许将外部连接端子的一端插入其中的紧固单元沿其厚度方向穿透;以及半导体芯片，其安装在一个 基板的表面。

公开(公告)号：US20140167242A1

公开(公告)日：2014-06-19

申请号：US14103574

申请日：2013-12-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Hyun Kim ,  Kwang Soo Kim ,  Sun Woo Yun ,  Young Ki Lee ,  Do Jae Yoo

IPC: H01L23/02

CPC classification number: H01L23/053 ,  H01L23/3735 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Disclosed herein is a power module package including: a first module configured of a first substrate having one surface and the other surface, a first semiconductor chip mounted on one surface of the first substrate, and a first sealing member formed to cover the first semiconductor chip mounted on one surface of the first substrate from both sides in a thickness direction of the first substrate and expose the other surface of the first substrate; and a case enclosing the first module.

Abstract translation: 本文公开了一种功率模块封装，包括：第一模块，其由具有一个表面和另一个表面的第一衬底构成，安装在第一衬底的一个表面上的第一半导体芯片和形成为覆盖第一半导体芯片的第一密封构件 在第一基板的厚度方向上从两侧安装在第一基板的一个表面上，并露出第一基板的另一个表面; 以及包围第一模块的壳体。