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    FLEXIBLE PRESS FIT PINS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
    23.
    发明申请
    FLEXIBLE PRESS FIT PINS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS 有权
    用于半导体封装的柔性印刷引线及相关方法

    公开(公告)号：US20150364847A1

    公开(公告)日：2015-12-17

    申请号：US14703002

    申请日：2015-05-04

    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

    Inventor： Yushuang YAO ,  Chee Hiong CHEW ,  Atapol PRAJUCKAMOL

    IPC: H01R13/05

    CPC classification number: H01R13/05 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01R12/57 ,  H01R12/585 ,  H01R43/02 ,  H01R43/16 ,  H01L2924/00014

    Abstract: A pin for a semiconductor package includes an upper contact portion having a contact surface configured to mechanically and electrically couple with a pin receiver. A lower portion of the pin is configured to flex to allow an upper portion of the pin to move towards an upper contact surface of a horizontal base of the pin in response to a pressure applied along a direction collinear with a longest length of the pin towards the upper contact surface of the horizontal base when the pin is inserted into a pin receiver. Some implementations of pins include a vertical stop to stop movement of the pin when a surface of the vertical stop contacts the upper contact surface of the horizontal base. Varying implementations of pins include: two curved legs and one vertical stop; two partially curved legs and no vertical stop, and; a single leg bent into an N-shape.

    Abstract translation: 用于半导体封装的引脚包括具有被配置为与引脚接收器机械和电耦合的接触表面的上接触部分。 销的下部被构造为弯曲以允许销的上部部分响应于沿与销的最长长度共线的方向施加的压力而朝销的水平底座的上接触表面移动，朝向 当销插入针式接收器时，水平底座的上接触面。 销的一些实施方案包括垂直停止以在垂直止动件的表面接触水平底座的上接触表面时停止销的运动。 销的不同实现包括：两个弯曲的腿和一个垂直停止; 两个部分弯曲的腿，没有垂直的停止，和; 单腿弯曲成N形。

    POWER MODULE PACKAGE BASEPLATE WITH STEP RECESS DESIGN
    24.
    发明公开
    POWER MODULE PACKAGE BASEPLATE WITH STEP RECESS DESIGN 审中-公开

    公开(公告)号：US20230369176A1

    公开(公告)日：2023-11-16

    申请号：US18357931

    申请日：2023-07-24

    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

    Inventor： Yushuang YAO ,  Vemmond Jeng Hung NG

    IPC: H01L23/492 ,  H01L21/48

    CPC classification number: H01L23/4924 ,  H01L21/4871

    Abstract: Implementations described herein are related to a semiconductor device package having an improved baseplate. In such an improved baseplate, there is a recess cut out of a region of a surface of the baseplate such that the recess has a first sidewall having a first thickness above a recess base and a second sidewall having a second thickness above the recess base. A substrate, e.g., a direct bonded copper (DBC) substrate, may be attached to the baseplate at a recess base using, e.g., a solder layer between the recess base and a surface of the substrate.

    POWER MODULE
    28.
    发明申请
    POWER MODULE 有权

    公开(公告)号：US20220208666A1

    公开(公告)日：2022-06-30

    申请号：US17655216

    申请日：2022-03-17

    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

    Inventor： Qing YANG ,  Yong LIU ,  Yushuang YAO

    IPC: H01L23/498 ,  H01L25/18 ,  H01L21/48 ,  H01L25/07 ,  H01L23/00 ,  H01L23/32

    Abstract: A power module can include a casing mounted to a baseplate that contains a substrate with circuitry. The circuitry can include pins for coupling signals to/from the circuitry. These pins can extend through a cover portion of the casing so that an electronic substrate, such as a printed circuit board (PCB) can be press-fit onto the pins. When press-fit, the electronic substrate is supported and positioned by support pillars that extend from the base plate to above the cover portion of the casing. If the pins and the support pillars have different coefficients of thermal expansion, damage to connection points between the pins and the circuitry may occur. Here, a power module is disclosed that has thermally matched pins and support pillars so that when the system is thermally cycled over a range of temperatures, the connection points are not damaged by forces induced by thermal expansion.

    POWER MODULE PACKAGE BASEPLATE WITH STEP RECESS DESIGN
    29.
    发明申请
    POWER MODULE PACKAGE BASEPLATE WITH STEP RECESS DESIGN 有权

    公开(公告)号：US20220157696A1

    公开(公告)日：2022-05-19

    申请号：US16949869

    申请日：2020-11-18

    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

    Inventor： Yushuang YAO ,  Vemmond Jeng Hung NG

    IPC: H01L23/492 ,  H01L21/48

    Abstract: Implementations described herein are related to a semiconductor device package having an improved baseplate. In such an improved baseplate, there is a recess cut out of a region of a surface of the baseplate such that the recess has a first sidewall having a first thickness above a recess base and a second sidewall having a second thickness above the recess base. A substrate, e.g., a direct bonded copper (DBC) substrate, may be attached to the baseplate at a recess base using, e.g., a solder layer between the recess base and a surface of the substrate.

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