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公开(公告)号：US5952150A
公开(公告)日：1999-09-14
申请号：US892200
申请日：1997-07-14
CPC分类号： G03F7/038 , G03F7/0045 , G03F7/039 , Y10S430/122 , Y10S430/128
摘要： A positive-tone or negative-tone radiation sensitive resin composition which allows easy preparation of a resist, exhibits superior storage stability, high sensitivity, and high resolution capability, and is capable of producing excellent resist patterns. The positive-tone type composition comprises (A) a disulfonylmethane derivative in which the main chain with two sulfonyl groups bonded forms a three to eleven member cyclic carbon structure and (B) (a) a resin protected by an acid decomposable group or (b) an alkali-soluble resin and an alkali-solubility control agent. The negative-tone type composition comprises the component (A), (C) an alkali-soluble resin, and (D) a cross-linking agent.
摘要翻译： 可以容易地制备抗蚀剂的正色调或负色度辐射敏感性树脂组合物，显示出优异的储存稳定性，高灵敏度和高分辨能力，并且能够产生优异的抗蚀剂图案。 正调型组合物包含（A）二磺酰基甲烷衍生物，其中具有两个磺酰基键合的主链形成三至十一个环状碳结构，（B）（a）由酸可分解基团保护的树脂或（b ）碱溶性树脂和碱溶性控制剂。 负色型组合物包含组分（A），（C）碱溶性树脂和（D）交联剂。
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22.发明申请POSITIVE-TYPE RADIATION-SENSITIVE RESIN COMPOSITION FOR PRODUCING A METAL-PLATING FORMED MATERIAL, TRANSCRIPTION FILM AND PRODUCTION METHOD OF A METAL-PLATING FORMED MATERIAL 审中-公开用于生产金属成型材料的正型类型的辐射敏感性树脂组合物，转印膜和金属镀层材料的生产方法公开(公告)号：US20090288855A1
公开(公告)日：2009-11-26
申请号：US12512211
申请日：2009-07-30
CPC分类号： G03F7/0392 , H01L24/11 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/00
摘要： The positive-type radiation-sensitive resin composition for producing a metal-plating formed material relating to the present invention comprises (A) a polymer containing a structural unit having an acid-dissociative functional group, which is dissociated in the presence of an acid to generate an acidic functional group, and a crosslinking structure; (B) a radiation-sensitive acid generator; and (C) an organic solvent. The positive-type radiation-sensitive resin composition is excellent in sensitivity and resolution, exhibits excellent adhesion to a substrate, leaves no residue at an opening after development, and is capable of preventing occurrence of crack in the resin film after metal plating and push-in of plated metal into the resin film.
摘要翻译： 用于生产本发明的金属镀覆成形材料的正型辐射敏感性树脂组合物包含（A）含有具有酸解离官能团的结构单元的聚合物，其在酸存在下分解成 产生酸性官能团和交联结构; （B）辐射敏感酸产生剂; 和（C）有机溶剂。 正型辐射敏感性树脂组合物的灵敏度和分辨率优异，表现出对基材的优异粘附性，在显影后的开口处不留下残留物，并且能够防止在金属电镀和推压后的树脂膜中发生裂纹， 将电镀金属插入树脂膜中。
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公开(公告)号：US07495332B2
公开(公告)日：2009-02-24
申请号：US11563355
申请日：2006-11-27
CPC分类号： H01L23/49822 , H01L23/49811 , H01L23/49816 , H01L2224/16 , H01L2224/16235 , H01L2924/01019 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H05K1/0271 , H05K1/0373 , H05K1/115 , H05K3/28 , H05K3/4007 , H05K3/4602 , H05K2201/0133 , H05K2201/0367 , H05K2201/068 , H05K2201/10674
摘要： A multilayer printed wiring board is equipped with a core board 20, a build-up layer 30 formed on the core board 20 so as to have a conductor pattern 32 on the upper surface thereof, a low-elasticity layer 40 formed on the build-up layer 30, lands 52 that are provided on the upper surface of the low-elasticity layer 40 and connected to an IC chip 70 via solder bumps 66, and conductor posts 50 that penetrate through the low-elasticity layer 40 and electrically connect the lands 52 to the conductor pattern 32. The low-elasticity layer 40 is formed of resin composition containing epoxy resin, phenol resin, cross-linked rubber particles and a hardening catalyst.
摘要翻译： 多层印刷电路板配备有芯板20，形成在芯板20上的积层30，以在其上表面具有导体图案32，形成在构建层20上的低弹性层40， 上层30，设置在低弹性层40的上表面上并通过焊锡凸块66连接到IC芯片70的焊盘52以及穿过低弹性层40并导电连接焊盘的导体柱50 低弹性层40由包含环氧树脂，酚醛树脂，交联橡胶颗粒和硬化催化剂的树脂组合物形成。
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公开(公告)号：US20070190465A1
公开(公告)日：2007-08-16
申请号：US10593812
申请日：2005-03-24
CPC分类号： G03F7/405 , C08F220/18 , C08F220/30 , C08F220/58 , C08L33/066 , C08L33/26 , C25D5/022 , G03F7/0392 , G03F7/40 , H01L24/11 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , C08L2666/04 , H01L2924/00
摘要： It is an object of the present invention to provide a production process capable of precisely producing a plated shaped article of a large thickness such as a bump or a wiring, a positive radiation-sensitive resin composition which is preferably used for the process and has excellent sensitivity and resolution, and a transfer film using the composition. The above object is achieved by a positive radiation-sensitive resin composition comprising (A) a polymer containing structural units represented by the following formula (1) and/or the following formula (2) and an acid-dissociable functional group (b), (B) a component which generates an acid by irradiation with radiation and (C) and organic solvent, and is achieved by producing a positive radiation-sensitive resin film using the composition.
摘要翻译： 本发明的目的是提供一种能够精确地制造诸如凸块或布线的大厚度的镀覆成形制品的生产方法，优选用于该方法并具有优异的阳离子敏感性树脂组合物 灵敏度和分辨率，以及使用该组合物的转印膜。 上述目的是通过一种正型辐射敏感性树脂组合物实现的，其包含（A）含有由下式（1）和/或下式（2）表示的结构单元和酸解离官能团（b）的聚合物， （B）通过辐射照射产生酸的组分和（C）和有机溶剂，并且通过使用该组合物生产正性辐射敏感树脂膜来实现。
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公开(公告)号：US06727032B1
公开(公告)日：2004-04-27
申请号：US08797620
申请日：1997-02-07
IPC分类号： G03F7039
CPC分类号： C08G61/06 , C08G61/08 , C08L65/00 , G03F7/0045 , G03F7/039 , G03F7/0395 , Y10S430/106
摘要： A radiation-sensitive resin composition including (A) a resin containing an alicyclic skeleton in its backbone, and (B) a radiation-sensitive acid-generating agent, is provided. This composition is excellent in transparency with respect to radiation and dry etching resistance, and can give a photoresist pattern excellent in adhesion to substrates, sensitivity, resolution, and developability.
摘要翻译： 提供了包含（A）在其主链中含有脂环族骨架的树脂和（B）辐射敏感性的酸产生剂的辐射敏感性树脂组合物。 该组合物在耐辐照和耐干蚀刻性方面的透明性优异，并且可以得到对基材的粘附性，灵敏度，分辨率和显影性优异的光致抗蚀剂图案。
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公开(公告)号：US06171750B2
公开(公告)日：2001-01-09
申请号：US09094469
申请日：1998-06-10
IPC分类号： G03F7023
CPC分类号： G03F7/0233
摘要： A radiation-sensitive resin composition including (A) an alkali-soluble novolak resin obtained by condensing a particular combination of a first phenol having formula: wherein R1 and R2 are the same or different and each represent an alkyl group, a cycloalkyl group, an alkoxyl group or an aryl group; and a second phenol selected from the group consisting of phenol, o-cresol, m-cresol, p-cresol, 2,3-dimethylphenol, 2,5-dimethylphenol, 2,6-dimethylphenol, 3,4-dimethylphenol, 3,5-dimethylphenol, 2,3,5-trimethylphenol, 3,4,5-trimethylphenol, resorcinol, 2-methylresorcinol, 4-ethylresorcinol, hydroquinone, methylhydroquinone, catechol, 4-methyl-catechol, pyrogallol, phloroglucinol, thymol and isothymol with an aldehyde in the presence of an acidic catalyst; and (B) a quinonediazidosulfonic acid ester compound. This composition exhibits good resolution, developability, heat resistance, pattern shape, exposure margin and focal latitude in a well balanced state. It also can effectively prevent occurrence of scum and also has a good sensitivity.
摘要翻译： 一种辐射敏感性树脂组合物，其包含（A）通过将具有下式的第一酚的特定组合缩合得到的碱溶性酚醛清漆树脂：其中R1和R2相同或不同，并且各自表示烷基，环烷基， 烷氧基或芳基; 和选自苯酚，邻甲酚，间甲酚，对甲酚，2,3-二甲基苯酚，2,5-二甲基苯酚，2,6-二甲基苯酚，3,4-二甲基苯酚， 5-二甲基苯酚，2,3,5-三甲基苯酚，3,4,5-三甲基苯酚，间苯二酚，2-甲基间苯二酚，4-乙基间苯二酚，氢醌，甲基氢醌，儿茶酚，4-甲基邻苯二酚，连苯三酚，间苯三酚，百里酚和异黄酮 在酸性催化剂存在下的醛; 和（B）醌二叠氮磺酸酯化合物。 该组合物在良好平衡状态下表现出良好的分辨率，显影性，耐热性，图案形状，曝光余量和焦点纬度。 也可以有效防止浮渣的发生，并具有良好的灵敏度。
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公开(公告)号：US6143460A
公开(公告)日：2000-11-07
申请号：US314124
申请日：1999-05-19
CPC分类号： G03F7/0045 , G03F7/039 , Y10S430/106
摘要： A novel diazodisulfone compound capable of generating acid having high sensitivity to far ultraviolet rays typified by a KrF excimer laser and the like and capable of providing a resist with superior resolution and patterns when used as a photoacid generator for a chemically amplified resist, and a radiation-sensitive resin composition comprising the diazodisulfone compound. The diazodisulfone compound is represented by the following formulas (1) and (2). ##STR1## The radiation-sensitive resin composition comprises the diazodisulfone compound and resin represented by 4-hydroxystyrene/4-(1'-ethoxyethoxy)styrene copolymer.
摘要翻译： 一种能够产生以KrF准分子激光器等为代表的远紫外线具有高灵敏度的酸并且当用作化学放大抗蚀剂的光酸产生剂时能够提供具有优异分辨率和图案的抗蚀剂的新型重氮二砜化合物， 包含重氮二砜化合物的敏感性树脂组合物。 重氮二砜化合物由下式（1）和（2）表示。 辐射敏感性树脂组合物包含重氮二砜化合物和由4-羟基苯乙烯/ 4-（1'-乙氧基乙氧基）苯乙烯共聚物表示的树脂。
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公开(公告)号：US5700852A
公开(公告)日：1997-12-23
申请号：US414592
申请日：1995-03-31
IPC分类号： C09D113/02 , D21H19/58 , C08L83/00
CPC分类号： D21H19/58 , C09D113/02
摘要： A paper coating composition which comprises as a binder a latex of a copolymer (referred to hereinafter the particle A) consisting of (a) 20 to 80% by weight of an aliphatic conjugated diene monomer unit, (b) 0.5 to 10% by weight of an ethylenically unsaturated carboxylic acid monomer unit and (c) 20 to 79.5% by weight of a unit of another monomer copolymerizable with the above components (a) and (b) and having two glass transition points in the range of from -100.degree. C. to 50.degree. C. the difference between the two transition points being at least 5.degree. C.
摘要翻译： 一种纸涂料组合物，其包含由（a）20至80重量％的脂族共轭二烯单体单元组成的共聚物（以下称为颗粒A）的胶乳，（b）0.5至10重量％ 的烯键式不饱和羧酸单体单元和（c）20-79.5重量％的可与上述组分（a）和（b）共聚的另一单体的单元，并且具有-100℃的两个玻璃化转变点 C.至50℃，两个转变点之间的差异至少为5℃。
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29.发明申请Thermosetting Resin Composition, Thermosetting Film, Cured Product of Those, and Electronic Component 审中-公开热固性树脂组合物，热固性薄膜，固化产品和电子部件公开(公告)号：US20080039585A1
公开(公告)日：2008-02-14
申请号：US11719024
申请日：2005-11-09
IPC分类号： C08L71/02
CPC分类号： H05K3/4676 , C08L9/02 , C08L9/06 , C08L13/00 , C08L21/00 , C08L63/00 , H05K1/0353 , H05K1/0393 , H05K3/4635 , H05K2201/0133 , C08L2666/14 , C08L2666/04
摘要： A thermosetting resin composition of the present invention contains an epoxy resin (A), a crosslinked diene-based rubber (B) in which the content of bonded acrylonitrile is less than 10 wt %, and a curing agent (D) and/or a curing catalyst (E). A cured product obtained by curing the thermosetting resin composition is excellent in properties such as electric insulation properties and electrical properties.
摘要翻译： 本发明的热固性树脂组合物含有环氧树脂（A），结合丙烯腈含量小于10重量％的交联二烯系橡胶（B）和固化剂（D）和/或 固化催化剂（E）。 通过固化所述热固性树脂组合物而获得的固化产物具有优异的电绝缘性能和电性能。
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公开(公告)号：US07214471B2
公开(公告)日：2007-05-08
申请号：US10551447
申请日：2004-03-25
IPC分类号： G03F7/033
CPC分类号： G03F7/031 , C08L33/04 , G03F7/029 , G03F7/033 , Y10S430/111 , Y10S430/121 , Y10S430/124 , C08L2666/02
摘要： The photosensitive resin film in an uncured state of the invention comprises (A) a specific alkali-soluble copolymer, (B) a compound having at least one ethylenically unsaturated double bond and (C) a radiation-sensitive radical polymerization initiator by the use of which a coating film having a dry film thickness of 70 μm in an uncured state has a 365 nm radiation transmittance of not less than 10% and a 405 nm radiation transmittance of not less than 60%, contains the radiation-sensitive radical polymerization initiator (C) in an amount of 20 to 40 parts by weight based on 100 parts by weight of the component (A), and has a dry film thickness of not less than 50 μm. According to the photosensitive resin film, a high bump having a height of not less than 50 μm can be readily formed on a chip substrate with high precision though formation of such a high bump is difficult by the conventional technique. Moreover, connection failure of an element can be inhibited, and reliability of an element can be enhanced.
摘要翻译： 本发明的未固化状态的感光性树脂膜包含（A）特定的碱溶性共聚物，（B）具有至少一个烯键式不饱和双键的化合物和（C）使用辐射敏感性自由基聚合引发剂的 在未固化状态下具有70μm的干膜厚度的涂膜具有不小于10％的365nm辐射透射率和不小于60％的405nm辐射透射率，其含有辐射敏感性自由基聚合引发剂（ C）相对于100重量份组分（A）为20至40重量份，干膜厚度不小于50微米。 根据感光性树脂膜，通过以往的技术难以形成这样高的凸起，难以高精度地在芯片基板上形成高度不小于50μm的高凸点。 此外，可以抑制元件的连接故障，并且可以提高元件的可靠性。
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