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56 条记录 (耗时 0.021 秒)

    Curable resin composition for sealing LED element
    21.
    发明申请
    Curable resin composition for sealing LED element 审中-公开
    用于密封LED元件的可固化树脂组合物

    公开(公告)号：US20060229408A1

    公开(公告)日：2006-10-12

    申请号：US11399434

    申请日：2006-04-07

    申请人： Hisashi Shimizu ,  Tsutomu Kashiwagi ,  Toshio Shiobara

    发明人： Hisashi Shimizu ,  Tsutomu Kashiwagi ,  Toshio Shiobara

    IPC分类号： C08L83/06 ,  C08G77/08

    CPC分类号： H01L23/293 ,  C08G77/12 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08L83/04 ,  H01L2924/0002 ,  C08L2666/52 ,  C08L2666/54 ,  H01L2924/00

    摘要： A curable resin composition for sealing an LED element is provided. The composition includes (i) an organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 5×103, (ii) a condensation catalyst, (iii) a solvent, and (iv) a finely powdered inorganic filler. It is suited to formation of a coating film or the like with excellent heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion, and is ideal for applications such as the sealing of LED elements.

    摘要翻译： 提供一种用于密封LED元件的可固化树脂组合物。 组合物包括（i）聚​​苯乙烯当量重均分子量为至少5×10 3的有机聚硅氧烷，（ii）缩合催化剂，（iii）溶剂和（iv）细粉末状无机物 填料。 适合于形成具有优异的耐热性，耐紫外光性，光学透明性，韧性和粘合性的涂膜等，并且是诸如LED元件的密封等应用的理想选择。

    Hybrid integrated circuit device
    22.
    发明授权
    Hybrid integrated circuit device 有权
    混合集成电路器件

    公开(公告)号：US06730933B1

    公开(公告)日：2004-05-04

    申请号：US09536898

    申请日：2000-03-28

    申请人： Hisashi Shimizu ,  Noriaki Sakamoto ,  Yoshiyuki Kobayashi

    发明人： Hisashi Shimizu ,  Noriaki Sakamoto ,  Yoshiyuki Kobayashi

    IPC分类号： H01L2715

    CPC分类号： H01L25/0753 ,  F21V29/00 ,  F21Y2115/10 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

    摘要： In a light irradiation device in which a light emitting element is attached to a printed circuit board, the heat radiation properties are enhanced, and improvement of the light emitting efficiency, reduction of the size and weight, and prevention of temporal changes are realized. A Cu pattern covered with Ni is formed on a metal substrate 11. Light emitting elements 11 are mounted on the pattern in the form of a series circuit. Metal substrates in each of which the series connection is formed are connected to one another in parallel. Since Ni has excellent corrosion resistance and a high reflection efficiency, the surfaces of the substrates themselves can be used as reflective plates. A lens 37 is formed for each of the light emitting elements, whereby the emission efficiency can be further improved. A transparent substrate 50 is bonded via a seal 51, and temporal changes of a light emitting element 10 and electrodes which are sealed therein are suppressed.

    摘要翻译： 在其中将发光元件附着在印刷电路板上的光照射装置中，提高了散热性能，并且实现了发光效率的提高，尺寸和重量的减小以及防止时间变化。 在金属基板11上形成被Ni覆盖的Cu图案。发光元件11以串联电路的形式安装在图案上。 其中形成有串联连接的金属基板彼此并联连接。 由于Ni具有优异的耐腐蚀性和高反射效率，所以基板本身的表面可以用作反射板。 为每个发光元件形成透镜37，从而可以进一步提高发光效率。透明基板50通过密封件51接合，发光元件10的时间变化和密封在其中的电极被抑制 。

    Hybrid integrated circuit device
    23.
    发明授权
    Hybrid integrated circuit device 有权
    混合集成电路器件

    公开(公告)号：US06548832B1

    公开(公告)日：2003-04-15

    申请号：US09536921

    申请日：2000-03-28

    申请人： Noriaki Sakamoto ,  Hisashi Shimizu ,  Susumu Ota ,  Yoshiyuki Kobayashi

    发明人： Noriaki Sakamoto ,  Hisashi Shimizu ,  Susumu Ota ,  Yoshiyuki Kobayashi

    IPC分类号： H01L3300

    CPC分类号： H01L25/0753 ,  F21V29/00 ,  F21Y2115/10 ,  H01L33/52 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/48472 ,  H01L2924/12041 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： In a light irradiation device in which a light emitting element is attached to a printed circuit board, the heat radiation properties are enhanced, and improvement of the light emitting efficiency and reduction of the size and weight are realized. A Cu pattern covered with Ni is formed on a metal substrate 11. Light emitting elements 11 are mounted on the pattern in the form of a series circuit. Metal substrates in each of which the series connection is formed are connected to one another in parallel. Since Ni has excellent corrosion resistance and a high reflection efficiency, the surfaces of the substrates themselves can be used as reflective plates. A lens 37 is formed for each of the light emitting elements, whereby the emission efficiency can be further improved. When a circuit is configured in one region of a hybrid integrated circuit substrate, a position recognition mark 53 and a flow stop 57 are disposed in the open region. Also the region is covered with Ni so as to function as reflecting means.

    摘要翻译： 在其中发光元件附着在印刷电路板上的光照射装置中，散热性能得到提高，并且实现了发光效率的提高和尺寸和重量的降低。 在金属基板11上形成覆盖有Ni的Cu图案。发光元件11以串联电路的形式安装在图案上。 其中形成有串联连接的金属基板彼此并联连接。 由于Ni具有优异的耐腐蚀性和高反射效率，所以基板本身的表面可以用作反射板。 为每个发光元件形成透镜37，从而可以进一步提高发光效率。当在混合集成电路基板的一个区域中配置电路时，将位置识别标记53和流动停止器57设置在 开放区域。 此外，该区域被Ni覆盖，以起到反射装置的作用。

    Phosphonium borate compound, making method, curing catalyst, and epoxy resin composition
    24.
    发明授权
    Phosphonium borate compound, making method, curing catalyst, and epoxy resin composition 有权
    硼酸鏻化合物，制法，固化催化剂和环氧树脂组合物

    公开(公告)号：US06235865B1

    公开(公告)日：2001-05-22

    申请号：US09345390

    申请日：1999-06-30

    申请人： Hisashi Shimizu ,  Minoru Takei ,  Toshio Shiobara

    发明人： Hisashi Shimizu ,  Minoru Takei ,  Toshio Shiobara

    IPC分类号： B01J3122

    CPC分类号： C08K5/55 ,  B01J31/0268 ,  B01J31/146 ,  C07F9/54 ,  C08G59/688 ,  C08L63/00

    摘要： Phosphonium borate compounds of formula (1) are novel. R1, R2, R3 and R4 each are a monovalent organic group having an aromatic or heterocyclic ring or a monovalent aliphatic group, at least one of R1, R2, R3 and R4 which are bonded to phosphorus atom and at least one of R1, R2, R3 and R4 which are bonded to boron atom are each an organic group derived by releasing a proton from a proton donor selected from among an aromatic carboxylic acid having at least one carboxyl group, an aromatic carboxylic acid having at least one acid anhydride group and at least one carboxyl group, a phenol compound having at least one phenolic hydroxyl group, an aromatic compound having at least one carboxyl group and at least one phenolic hydroxyl group, and an aliphatic carboxylic acid having at least one carboxyl group. The phosphonium borate compounds are useful as a latent curing catalyst for epoxy resin compositions. The epoxy resin compositions are improved in shelf stability, fast-curing ability and flow and cure into products having moisture resistance and improved electrical properties.

    摘要翻译： 式（1）的硼酸鏻化合物是新颖的.R1，R2，R3和R4各自是具有芳族或杂环或一价脂族基的一价有机基团，R 1，R 2，R 3和R 4中的至少一个是键合的 磷原子和与硼原子键合的R 1，R 2，R 3和R 4中的至少一个各自是通过从质子供体中释放质子衍生的有机基团，所述质子供体选自具有至少一个羧基的芳族羧酸， 具有至少一个酸酐基和至少一个羧基的芳族羧酸，具有至少一个酚羟基的酚化合物，至少一个羧基和至少一个酚羟基的芳族化合物和脂族羧酸 具有至少一个羧基。 硼酸鏻化合物可用作环氧树脂组合物的潜在固化催化剂。 环氧树脂组合物在贮存稳定性，快速固化能力和流动性方面得到改进，并且固化成具有防潮性和改善的电性能的产品。

    Epoxy resin compositions and cured products
    26.
    发明授权
    Epoxy resin compositions and cured products 失效
    环氧树脂组合物和固化产物

    公开(公告)号：US5643975A

    公开(公告)日：1997-07-01

    申请号：US413929

    申请日：1995-03-30

    申请人： Toshio Shiobara ,  Hisashi Shimizu

    发明人： Toshio Shiobara ,  Hisashi Shimizu

    IPC分类号： C08G59/62 ,  C08F24/00 ,  C08F30/08 ,  C08F224/00 ,  C08F230/08 ,  C08F291/02 ,  C08G59/00 ,  C08G59/20 ,  C08G59/32 ,  C08L51/00 ,  C08L63/00 ,  C09J163/00 ,  C08L9/02

    CPC分类号： C08L51/00 ,  C08L63/00 ,  Y10S525/942

    摘要： An epoxy resin composition for semiconductor encapsulation use comprising an epoxy resin, a phenol resin, and an inorganic filler is improved by blending therein a component which is obtained by copolymerizing or homopolymerizing a reactive monomer having a vinyl group and an epoxy or phenolic hydroxyl group in a molecule thereof with or preferably in the presence of a thermoplastic elastomer or organic synthetic rubber. Alternatively, the modifying component (C) is obtained by copolymerizing a reactive monomer and a silane monomer with or preferably in the presence of a thermoplastic elastomer or organic synthetic rubber. The composition cures to products having improved thermal shock resistance and adherence.

    摘要翻译： 包含环氧树脂，酚醛树脂和无机填料的用于半导体封装用途的环氧树脂组合物通过在其中掺入通过使具有乙烯基和环氧或酚羟基的反应性单体共聚或均聚而得到的组分 其分子具有或优选在热塑性弹性体或有机合成橡胶的存在下。 或者，改性组分（C）通过在热塑性弹性体或有机合成橡胶存在下共聚合反应性单体和硅烷单体而获得。 该组合物固化成具有改善的耐热冲击性和粘附性的产品。

    Allyl or propenyl group-containing naphthalene derivatives
    27.
    发明授权
    Allyl or propenyl group-containing naphthalene derivatives 失效
    含烯丙基或含丙烯基的萘衍生物

    公开(公告)号：US5171869A

    公开(公告)日：1992-12-15

    申请号：US825222

    申请日：1992-01-24

    申请人： Toshio Shiobara ,  Kazutoshi Tomiyoshi ,  Hisashi Shimizu ,  Manabu Narumi

    发明人： Toshio Shiobara ,  Kazutoshi Tomiyoshi ,  Hisashi Shimizu ,  Manabu Narumi

    IPC分类号： C07D303/27 ,  C07C39/225 ,  C07D303/24 ,  C08F290/00 ,  C08F299/02 ,  C08G8/08 ,  C08G8/24 ,  C08G8/36 ,  C08G59/08 ,  C08G59/32

    CPC分类号： C07D303/24 ,  C08G59/3218 ,  C08G8/08

    摘要： A naphthalene of the following formula (1) having at least two allyl or propenyl groups ##STR1## wherein each G represents a hydrogen atoms or ##STR2## R.sup.1 's independently represent a hydrogen atom or an unsubstituted or substituted monovalent hydrocarbon group having from 1 to 6 carbon atoms, R.sup.2 's independently represent a hydrogen atom, an allyl group or a propenyl group, R.sup.3 represents an allyl group or a propenyl group, X represents a hydrogen atom or a halogen atom, and n is an integer of from 0 to 6. The derivative is useful for modifying curable resins or resin compositions to provide cured products which have a low water absorption, high strength and a high glass transition temperature. The derivative has good working properties and a good heat resistance.

    摘要翻译： 具有至少两个烯丙基或丙烯基的下式（1）的萘，其中每个G表示氢原子，或者R 1独立地表示氢原子或未取代或取代的一价烃基，其具有 1〜6个碳原子，R2独立地表示氢原子，烯丙基或丙烯基，R3表示烯丙基或丙烯基，X表示氢原子或卤素原子，n表示0〜 该衍生物可用于改性可固化树脂或树脂组合物以提供具有低吸水性，高强度和高玻璃化转变温度的固化产物。 该衍生物具有良好的加工性能和良好的耐热性。