公开(公告)号：US07206539B2

公开(公告)日：2007-04-17

申请号：US11079883

申请日：2005-03-15

申请人： Akihiko Kawahara ,  Tadayuki Sawai ,  Kazuya Korematu ,  Toru Nishikawa

发明人： Akihiko Kawahara ,  Tadayuki Sawai ,  Kazuya Korematu ,  Toru Nishikawa

IPC分类号： G03G15/08

CPC分类号： G03G15/0808 ,  G03G2215/0617

摘要： A non-magnetic single component developing device that is included in combination with a photoreceptor in an image forming apparatus 1 of the electro-photographic system. The non-magnetic single component developing device includes a developing roller, a supplying roller, a doctor, a toner bath and a stirring blade. The supplying roller contains a rubber foam at least in its surface layer portion, the rubber foam including closed cells and open cells and having a foam ratio (porosity) of 0.75 to 0.85 and an average foam cell diameter of 350 to 500 μm.

摘要翻译： 与电摄影系统的图像形成装置1中的感光体组合包括的非磁性单组分显影装置。 非磁性单组分显影装置包括显影辊，供给辊，刮刀，调色剂浴和搅拌叶片。 供给辊至少在其表层部分包含橡胶泡沫，橡胶泡沫包括闭孔和开孔，泡沫比（孔隙率）为0.75至0.85，平均泡沫泡孔直径为350-500μm。

公开(公告)号：US20070013342A1

公开(公告)日：2007-01-18

申请号：US11485555

申请日：2006-07-13

申请人： Katsuhiro Suzuki ,  Toru Nishikawa

发明人： Katsuhiro Suzuki ,  Toru Nishikawa

IPC分类号： H02J7/00

CPC分类号： H02J7/0031

摘要： The battery pack is provided with batteries, a charging FET device to control battery charging, a discharging FET device to control battery discharging, and a control section to control the charging FET device and the discharging FET device. If one FET device is in the ON state and the other FET device is in the OFF state, and furthermore, current flow greater than or equal to a prescribed value is detected through the body (=parasitic) diode of the OFF state FET device for greater than or equal to a prescribed time interval, the control section switches the ON state FET device to the OFF state to prevent damage to the OFF state FET device.

摘要翻译： 电池组具有电池，用于控制电池充电的充电FET装置，用于控制电池放电的放电FET装置，以及控制充电FET装置和放电FET装置的控制部。 如果一个FET器件处于ON状态，另一个FET器件处于OFF状态，此外，通过OFF状态FET器件的体（=寄生）二极管检测电流大于或等于规定值的电流， 大于或等于规定的时间间隔时，控制部分将导通状态的FET器件切换到OFF状态，以防止对OFF状态FET器件的损坏。

公开(公告)号：US20060208183A1

公开(公告)日：2006-09-21

申请号：US11374093

申请日：2006-03-14

申请人： Isao Hayami ,  Toru Nishikawa ,  Masaya Tateyanagi ,  Syouichi Tanaka

发明人： Isao Hayami ,  Toru Nishikawa ,  Masaya Tateyanagi ,  Syouichi Tanaka

IPC分类号： H01J5/02 ,  H01J40/14

CPC分类号： G01J1/42 ,  G01J1/02 ,  G01J1/0271 ,  G01J2001/4247

摘要： A tester according to the present invention can conduct a test on optical devices each having a different positional relation between a position of a contact face of an external contact terminal and a direction of light emitted from a semiconductor laser element.

摘要翻译： 根据本发明的测试器可以对在外部接触端子的接触面的位置和从半导体激光元件发射的光的方向之间具有不同位置关系的光学器件进行测试。

公开(公告)号：US5878943A

公开(公告)日：1999-03-09

申请号：US753018

申请日：1996-11-19

申请人： Toru Nishikawa ,  Ryohei Satoh ,  Masahide Harada ,  Tetsuya Hayashida ,  Mitugu Shirai

发明人： Toru Nishikawa ,  Ryohei Satoh ,  Masahide Harada ,  Tetsuya Hayashida ,  Mitugu Shirai

IPC分类号： B23K1/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H05K3/34

CPC分类号： H01L24/12 ,  B23K1/0016 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/16 ,  H05K3/3489 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01054 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/3025 ,  H05K2203/086 ,  H05K2203/087 ,  H05K2203/095 ,  H05K2203/1157

摘要： In soldering together two members such as electronic circuit devices, after an oxide or contaminated layer has been removed from the surface of a solder material or bonding pad, for example, the members are aligned in an oxidizing atmosphere. Then the solder material is heated in a nonoxidizing atmosphere to melt the solder and bond the members. Cleaning of the solder material or bonding pad is performed by sputter-cleaning, laser cleaning, mechanical polishing, or cutting.

摘要翻译： 在将诸如电子电路器件的两个部件焊接在氧化物或污染层已经从焊料或焊盘的表面除去之后，例如，这些部件在氧化气氛中对准。 然后将焊料材料在非氧化气氛中加热以熔化焊料并结合该构件。 通过溅射清洗，激光清洗，机械抛光或切割来进行焊料或焊盘的清洁。

公开(公告)号：US5341980A

公开(公告)日：1994-08-30

申请号：US890255

申请日：1992-05-29

申请人： Toru Nishikawa ,  Ryohei Satoh ,  Masahide Harada ,  Tetsuya Hayashida ,  Mitugu Shirai

发明人： Toru Nishikawa ,  Ryohei Satoh ,  Masahide Harada ,  Tetsuya Hayashida ,  Mitugu Shirai

IPC分类号： B23K1/00 ,  B23K1/008 ,  B23K1/20 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/498 ,  H05K3/34 ,  B23K31/02

CPC分类号： H01L24/81 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/206 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/12 ,  H01L24/75 ,  H05K3/3436 ,  H05K3/3489 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/742 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/81141 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H05K2201/10984 ,  H05K2203/025 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/0435 ,  H05K2203/086 ,  H05K2203/087 ,  H05K2203/095 ,  H05K2203/1157 ,  H05K3/3426 ,  Y02P70/613

摘要： In a method of soldering for use in fabricating electronic circuit device, after an oxide layer and/or contaminated layer on a surface of a soldering material and members to be soldered thereby is removed by sputter-cleaning with atom or ion, the members are aligned in an oxidizing atmosphere within a predetermined time period and, then, the soldering material is heated in non-oxidizing atmosphere to performe soldering. An apparatus for performing the above method comprises a sputter cleaning device, an alignment device operable in atmospheric condition and a heating and soldering device in the form of a belt furnace operable in non-oxidizing or reducing environment. Instead of the sputter cleaning device, a mechanical polishing or cutting device can be used to cleaning a surface of solder or a member to be bonded or a solder ball plated with gold may be used. An alignment between two members to be bonded is provided by an alignment mark means which comprises a protrusion on a surface of one member and a complimental recess formed at a center portion of a protrusion means formed on a corresponding surface of the other member.

摘要翻译： 在用于制造电子电路器件的焊接方法中，在焊料的表面上的氧化物层和/或污染层和由此被焊接的部件被去除之后，通过用原子或离子进行溅射清洗，这些部件对准 在预定时间段内的氧化气氛中，然后，在非氧化性气氛中加热焊接材料进行焊接。 用于执行上述方法的装置包括溅射清洁装置，可在大气条件下操作的对准装置和可在非氧化或还原环境中操作的带式炉的形式的加热和焊接装置。 代替溅射清洁装置，可以使用机械抛光或切割装置来清洁焊料或待结合的部件的表面，或者可以使用镀有金的焊球。 要结合的两个构件之间的对准由对准标记装置提供，该对准标记装置包括在一个构件的表面上的突起和形成在形成在另一构件的相应表面上的突出装置的中心部分处的补充凹部。

公开(公告)号：US20120190886A1

公开(公告)日：2012-07-26

申请号：US13496778

申请日：2010-09-10

申请人： Fuminori Kimura ,  Hideaki Kitajima ,  Takao Tanaka ,  Toru Nishikawa

发明人： Fuminori Kimura ,  Hideaki Kitajima ,  Takao Tanaka ,  Toru Nishikawa

IPC分类号： C07C309/14

CPC分类号： A61K31/185

摘要： A composition for lowering a blood uric acid level is characterized by comprising taurine as an active ingredient.

摘要翻译： 用于降低血液尿酸水平的组合物的特征在于包含牛磺酸作为活性成分。

公开(公告)号：US20110205599A1

公开(公告)日：2011-08-25

申请号：US13031201

申请日：2011-02-19

申请人： Takeshi KATO ,  Takahiro Bito ,  Toru Nishikawa ,  Junichi Saito ,  Kazuki Takatsuka ,  Hitoshi Nagahama

发明人： Takeshi KATO ,  Takahiro Bito ,  Toru Nishikawa ,  Junichi Saito ,  Kazuki Takatsuka ,  Hitoshi Nagahama

IPC分类号： H04N1/04

CPC分类号： H04N1/00519 ,  H04N1/00551 ,  H04N1/00557 ,  H04N1/00965 ,  H04N2201/001 ,  H04N2201/0041 ,  H04N2201/0051

摘要： A memory storage section in which a memory attachment section is provided is provided in a place of a platen which place is to be covered with a platen cover. This makes it possible to prevent a young child from accidentally detaching a portable recording medium detachably attached to an image reading device.

摘要翻译： 其中设置有存储器连接部分的存储器存储部分设置在待压盖板的位置上。 这使得可以防止幼儿意外地分离可拆卸地附接到图像读取装置的便携式记录介质。

公开(公告)号：US20100251772A1

公开(公告)日：2010-10-07

申请号：US12820171

申请日：2010-06-22

申请人： Hajime Itoh ,  Hironobu Yamamichi ,  Toru Nishikawa ,  Kazuo Ninomiya ,  Hiroaki Hamamoto

发明人： Hajime Itoh ,  Hironobu Yamamichi ,  Toru Nishikawa ,  Kazuo Ninomiya ,  Hiroaki Hamamoto

IPC分类号： C03B37/014 ,  C03B37/00

CPC分类号： C03B5/2252 ,  C03B5/04 ,  C03B5/23 ,  C03B5/2353 ,  Y02P40/55 ,  Y02P40/57

摘要： The present invention is to provide a molten glass producing apparatus realizing simultaneously the production of a glass article of high quality and save-energy in producing molten glass, a molten glass producing method employing the molten glass producing apparatus and a method for producing a glass article.In the molten glass producing apparatus having a vacuum degassing apparatus, the melting tank is provided with a separating means for separating the area for circulating the molten glass in the melting tank into an upstream circulation flow and a downstream circulation flow, the distance from the separating means to the downstream end of the molten glass flow path in the melting tank is from 0.1 LE to 0.45 LF where LF represents the length of the molten glass flow path in the melting tank, a wide portion is formed in a first conduit structure at a upstream side in the flowing direction of molten glass, the width of the wide portion being larger than another area of the conduit structure and means for cooling the molten glass passing through the wide portion is disposed in the wide portion.

摘要翻译： 本发明提供一种熔融玻璃制造装置，同时实现高品质玻璃制品的生产和节能生产熔融玻璃，使用熔融玻璃制造装置的熔融玻璃制造方法和玻璃制品的制造方法 。 在具有真空脱气装置的熔融玻璃制造装置中，熔融槽设置有用于将熔融槽中的熔融玻璃循环的区域分离成上游循环流和下游循环流的分离装置， 在熔化槽中熔融玻璃流路的下游端的装置为0.1LE至0.45LF，其中LF表示熔融槽中的熔融玻璃流路的长度，宽的部分形成在第一导管结构中 在熔融玻璃的流动方向的上游侧，宽部分的宽度大于导管结构的另一区域，并且用于冷却通过宽部分的熔融玻璃的装置设置在宽部分中。

公开(公告)号：US20090311620A1

公开(公告)日：2009-12-17

申请号：US12482663

申请日：2009-06-11

申请人： Kanako Hirata ,  Kazuki Takatsuka ,  Toru Nishikawa

发明人： Kanako Hirata ,  Kazuki Takatsuka ,  Toru Nishikawa

IPC分类号： G03G9/00

CPC分类号： G03G9/1136 ,  G03G9/1138

摘要： A carrier has a thermosetting silicone resin layer formed of a core particle and a thermosetting silicone resin on the surface of the core particle, and the thermosetting silicone resin layer is formed by subjecting a thermosetting silicone resin to a thermosetting treatment at a temperature lower than the melting point of a charge control agent contained in the thermosetting silicone resin layer, and includes an inner region which contains a positively chargeable charge control agent and an outer region which does not contain any positively chargeable charge control agent. The two-component developer containing the carrier as described above is charged into a developing device in an image forming apparatus to form an image.

摘要翻译： 载体在核心颗粒的表面上具有由核心颗粒和热固性硅树脂形成的热固性硅树脂层，并且通过使热固性有机硅树脂在低于所述核心颗粒的温度下进行热固化处理来形成热固性有机硅树脂层 包含在热固性有机硅树脂层中的电荷控制剂的熔点，并且包括含有可带正电荷的电荷控制剂的内部区域和不含任何可带正电荷的电荷控制剂的外部区域。 将包含上述载体的双组分显影剂装入图像形成装置中的显影装置中以形成图像。

公开(公告)号：US20080160440A1

公开(公告)日：2008-07-03

申请号：US12005278

申请日：2007-12-27

申请人： Toru Nishikawa

发明人： Toru Nishikawa

IPC分类号： G03G9/097

CPC分类号： G03G9/1075 ,  G03G9/1131 ,  G03G9/1136 ,  G03G9/1139

摘要： A carrier and a two-component developer are provided. A coating resin layer for coating a core material contains fine particles of titanium oxide which comprise an anatase-type crystal and a rutile-type crystal, and a carrier coating amount of the coating resin layer falls in a range of from 5% by weight to 20% by weight. In addition, a content rate of the rutile-type crystal falls in a range of from 5% to 20% on the basis of the total amount of crystal, and the weight of the fine particles of titanium oxide falls in a range of from 5% by weight to 50% by weight relative to the weight of the core material. Further, the primary particle size of the fine particles of titanium oxide falls in a range of from 40 nm to 80 nm.

摘要翻译： 提供载体和双组分显影剂。 用于涂覆芯材的涂覆树脂层含有包含锐钛矿型晶体和金红石型晶体的细小氧化钛颗粒，涂层树脂层的载体涂布量落在5重量％的范围内，属于 20重量％。 此外，金红石型晶体的含有率基于晶体总量在5％〜20％的范围内，氧化钛微粒的重量在5以下的范围内 相对于芯材的重量为50重量％。 此外，氧化钛微粒的一次粒径在40nm〜80nm的范围内。