公开(公告)号：US08513073B1

公开(公告)日：2013-08-20

申请号：US13600625

申请日：2012-08-31

申请人： Veeraraghavan S. Basker ,  Tenko Yamashita ,  Chun-Chun Yeh

发明人： Veeraraghavan S. Basker ,  Tenko Yamashita ,  Chun-Chun Yeh

IPC分类号： H01L21/336

CPC分类号： H01L29/66795 ,  H01L29/66545

摘要： A method of forming a fin field effect transistor (finFET) device includes forming a silicon fin on a substrate; forming an inner spacer adjacent to a first portion of the silicon fin; forming silicon germanium regions adjacent to a second portion of the silicon fin and the inner spacer; and oxidizing the silicon germanium regions, such that the second portion of the silicon fin that is located adjacent to the silicon germanium regions is converted to a silicon germanium channel region during oxidizing of the silicon germanium regions, and such that the first portion of the silicon fin is protected by the inner spacer during oxidation of the silicon germanium regions, wherein the first portion of the silicon fin comprises a silicon buffer region located between the silicon germanium channel region and a source/drain region of the finFET device.

摘要翻译： 形成鳍状场效应晶体管（finFET）器件的方法包括在衬底上形成硅鳍片; 形成与所述硅片的第一部分相邻的内隔片; 形成与所述硅鳍片和所述内部间隔物的第二部分相邻的硅锗区域; 以及氧化硅锗区域，使得位于硅锗区附近的硅鳍片的第二部分在氧化硅锗区域期间被转换成硅锗沟道区，并且使硅的第一部分 在硅锗区域的氧化期间，鳍片由内部间隔物保护，其中硅片的第一部分包括位于硅锗沟道区域和finFET器件的源极/漏极区域之间的硅缓冲区域。

公开(公告)号：US08716797B2

公开(公告)日：2014-05-06

申请号：US12611444

申请日：2009-11-03

申请人： Veeraraghavan S. Basker ,  Chang Kangguo ,  Bruce B. Doris ,  Johnathan E. Faltermeier

发明人： Veeraraghavan S. Basker ,  Chang Kangguo ,  Bruce B. Doris ,  Johnathan E. Faltermeier

IPC分类号： H01L27/12

CPC分类号： H01L29/66795 ,  H01L21/26586 ,  H01L21/823431 ,  H01L29/66803 ,  H01L29/785

摘要： A FinFET having spacers with a substantially uniform profile along the length of a gate stack which covers a portion of a fin of semiconductor material formed on a substrate is provided by depositing spacer material conformally on both the fins and gate stack and performing an angled ion impurity implant approximately parallel to the gate stack to selectively cause damage to only spacer material deposited on the fin. Due to the damage caused by the angled implant, the spacer material on the fins can be etched with high selectivity to the spacer material on the gate stack.

摘要翻译： 通过在翅片和栅极堆叠上共同沉积间隔材料并执行成角度的离子杂质来提供具有覆盖形成在衬底上的半导体材料的翅片的一部分的栅极叠层长度上具有基本上均匀分布的间隔物的FinFET 大致平行于栅极堆叠的植入物选择性地仅对沉积在鳍片上的间隔物材料造成损害。 由于由成角度的植入物引起的损伤，翅片上的间隔物材料可以以高选择性蚀刻到栅极堆叠上的间隔物材料。

公开(公告)号：US08703572B2

公开(公告)日：2014-04-22

申请号：US13269955

申请日：2011-10-10

申请人： Veeraraghavan S. Basker ,  Richard Q. Williams

发明人： Veeraraghavan S. Basker ,  Richard Q. Williams

IPC分类号： H01L21/331

CPC分类号： H01L28/60 ,  H01L27/108 ,  H01L27/10861 ,  H01L28/91 ,  H01L29/66181 ,  H01L29/945

摘要： A method and structure is directed to eDRAM cells with high-conductance electrodes. The method includes forming upper layers on a semiconductor substrate and forming an opening in the upper layers. The method further includes forming a trench in the semiconductor substrate, aligned with the opening. The method further includes forming a metal plate on all exposed surface in the trench by applying a metallic aqueous solution with an electrical bias to a backside of the semiconductor substrate.

摘要翻译： 方法和结构针对具有高电导电极的eDRAM细胞。 该方法包括在半导体衬底上形成上层并在上层形成开口。 该方法还包括在半导体衬底中形成与开口对准的沟槽。 该方法还包括通过将具有电偏压的金属水溶液施加到半导体衬底的背面而在沟槽的所有暴露表面上形成金属板。

公开(公告)号：US20120322243A1

公开(公告)日：2012-12-20

申请号：US13596593

申请日：2012-08-28

申请人： Veeraraghavan S. Basker ,  John M. Cotte ,  Hariklia Deligianni ,  Matteo Flotta

发明人： Veeraraghavan S. Basker ,  John M. Cotte ,  Hariklia Deligianni ,  Matteo Flotta

IPC分类号： H01L21/326

CPC分类号： C25D5/54 ,  C25D5/006 ,  C25D5/02 ,  C25D7/123 ,  C25D11/005 ,  C25D11/024 ,  C25D17/001 ,  C25F3/14 ,  H01L21/28079 ,  H01L21/2885

摘要： An electrochemical process comprising: providing a 125 mm or larger semiconductor wafer in electrical contact with a conducting surface, wherein at least a portion of the semiconductor wafer is in contact with an electrolytic solution, said semiconductor wafer functioning as a first electrode; providing a second electrode in the electrolytic solution, the first and second electrode connected to opposite ends of an electric power source; and irradiating a surface of the semiconductor wafer with a light source as an electric current is applied across the first and the second electrodes. The invention is also directed to an apparatus including a light source and electrochemical components to conduct the electrochemical process.

公开(公告)号：US20120318666A1

公开(公告)日：2012-12-20

申请号：US13561599

申请日：2012-07-30

申请人： Veeraraghavan S. Basker ,  Eduard Cartier ,  Hariklia Deligianni ,  Rajarao Jammy ,  Vamsi K. Paruchuri

发明人： Veeraraghavan S. Basker ,  Eduard Cartier ,  Hariklia Deligianni ,  Rajarao Jammy ,  Vamsi K. Paruchuri

IPC分类号： C25D19/00

CPC分类号： C25D5/18 ,  C25D5/024 ,  C25D17/001 ,  C25D17/002 ,  C25D17/005 ,  H01L21/2885 ,  H01L21/7624

摘要： An electroplating apparatus and method for depositing a metallic layer on the surface of a wafer is provided wherein said apparatus and method do not require physical attachment of an electrode to the wafer. The surface of the wafer to be plated is positioned to face the anode and a plating fluid is provided between the wafer and the electrodes to create localized metallic plating. The wafer may be positioned to physically separate and lie between the anode and cathode so that one side of the wafer facing the anode contains a catholyte solution and the other side of the wafer facing the cathode contains an anolyte solution. Alternatively, the anode and cathode may exist on the same side of the wafer in the same plating fluid. In one example, the anode and cathode are separated by a semi permeable membrane.

摘要翻译： 提供了一种用于在晶片的表面上沉积金属层的电镀设备和方法，其中所述设备和方法不需要将电极物理附接到晶片。 要镀覆的晶片的表面被定位成面对阳极，并且在晶片和电极之间设置电镀液以产生局部金属电镀。 晶片可以被定位成物理分离并且位于阳极和阴极之间，使得面向阳极的晶片的一侧包含阴极电解液，并且晶片的面向阴极的另一侧包含阳极电解液。 或者，阳极和阴极可以存在于同一电镀液中晶片的同一侧。 在一个实例中，阳极和阴极被半透膜隔开。

公开(公告)号：US20120181613A1

公开(公告)日：2012-07-19

申请号：US13009271

申请日：2011-01-19

申请人： Veeraraghavan S. Basker ,  Toshiharu Furukawa ,  Steven J. Holmes ,  Sivananda K. Kanakasabapathy

发明人： Veeraraghavan S. Basker ,  Toshiharu Furukawa ,  Steven J. Holmes ,  Sivananda K. Kanakasabapathy

IPC分类号： H01L27/088 ,  H01L21/8234 ,  H01L21/8238

CPC分类号： H01L29/66477 ,  H01L21/823418 ,  H01L21/823468 ,  H01L29/78

摘要： A method for forming a field effect transistor device includes forming a first gate stack and a second gate stack on a substrate, depositing a first photoresist material over the second gate stack and a portion of the substrate, implanting ions in exposed regions of the substrate to define a first source region and a first drain region adjacent to the first gate stack, depositing a first protective layer over the first source region, the first gate stack, the first drain region, and the first photoresist material, removing portions of the first protective layer to expose the first photoresist material and to define a first spacer disposed on a portion of the first source region and a portion of the first drain region, removing the first photoresist material, and removing the first spacer.

摘要翻译： 一种用于形成场效应晶体管器件的方法包括在衬底上形成第一栅极堆叠和第二栅极叠层，在第二栅极堆叠上沉积第一光致抗蚀剂材料和衬底的一部分，将衬底的暴露区域中的离子注入到 限定与第一栅极堆叠相邻的第一源极区域和第一漏极区域，在第一源极区域，第一栅极堆叠层，第一漏极区域和第一光致抗蚀剂材料上沉积第一保护层，去除第一保护层 以露出第一光致抗蚀剂材料并且限定设置在第一源极区域和第一漏极区域的一部分上的第一间隔物，去除第一光致抗蚀剂材料，以及移除第一间隔物。

公开(公告)号：US20090206447A1

公开(公告)日：2009-08-20

申请号：US12031761

申请日：2008-02-15

申请人： Veeraraghavan S. Basker ,  Toshiharu Furukawa ,  William R. Tonti

发明人： Veeraraghavan S. Basker ,  Toshiharu Furukawa ,  William R. Tonti

IPC分类号： H01L23/525 ,  H01L21/44

CPC分类号： H01L23/5252 ,  C25D5/02 ,  C25D5/10 ,  C25D21/12 ,  H01L21/2885 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed are embodiments of a circuit and method for electroplating a feature (e.g., a BEOL anti-fuse device) onto a wafer. The embodiments eliminate the use of a seed layer and, thereby, minimize subsequent processing steps (e.g., etching or chemical mechanical polishing (CMP)). Specifically, the embodiments allow for selective electroplating metal or alloy materials onto an exposed portion of a metal layer in a trench on the front side of a substrate. This is accomplished by providing a unique wafer structure that allows a current path to be established from a power supply through a back side contact and in-substrate electrical connector to the metal layer. During electrodeposition, current flow through the current path can be selectively controlled. Additionally, if the electroplated feature is an anti-fuse device, current flow through this current path can also be selectively controlled in order to program the anti-fuse device.

摘要翻译： 公开了用于将特征（例如，BEOL反熔丝器件）电镀到晶片上的电路和方法的实施例。 这些实施例消除了种子层的使用，从而使随后的处理步骤（例如，蚀刻或化学机械抛光（CMP））最小化。 具体地，实施例允许将金属或合金材料选择性地电镀到衬底前侧的沟槽中的金属层的暴露部分上。 这是通过提供一种独特的晶片结构来实现的，该晶片结构允许从电源通过后侧接触和衬底上的电连接器建立到金属层的电流路径。 在电沉积期间，可以选择性地控制通过电流路径的电流。 此外，如果电镀特征是反熔丝器件，则也可以选择性地控制通过该电流路径的电流，以便编程反熔丝器件。

公开(公告)号：US20090057154A1

公开(公告)日：2009-03-05

申请号：US12198274

申请日：2008-08-26

申请人： Veeraraghavan S. Basker ,  John M. Cotte ,  Hariklia Deligianni ,  Matteo Flotta

发明人： Veeraraghavan S. Basker ,  John M. Cotte ,  Hariklia Deligianni ,  Matteo Flotta

IPC分类号： C25D7/12 ,  C25D5/00 ,  C25D17/10

CPC分类号： C25D5/54 ,  C25D5/006 ,  C25D5/02 ,  C25D7/123 ,  C25D11/005 ,  C25D11/024 ,  C25D17/001 ,  C25F3/14 ,  H01L21/28079 ,  H01L21/2885

摘要： An electrochemical process comprising: providing a 125 mm or larger semiconductor wafer in electrical contact with a conducting surface, wherein at least a portion of the semiconductor wafer is in contact with an electrolytic solution, said semiconductor wafer functioning as a first electrode; providing a second electrode in the electrolytic solution, the first and second electrode connected to opposite ends of an electric power source; and irradiating a surface of the semiconductor wafer with a light source as an electric current is applied across the first and the second electrodes. The invention is also directed to an apparatus including a light source and electrochemical components to conduct the electrochemical process.

摘要翻译： 一种电化学方法，包括：提供与导电表面电接触的125mm或更大的半导体晶片，其中所述半导体晶片的至少一部分与电解液接触，所述半导体晶片用作第一电极; 在所述电解液中提供第二电极，所述第一和第二电极连接到电源的相对端; 并且在第一和第二电极之间施加用作为电流的光源照射半导体晶片的表面。 本发明还涉及一种包括光源和用于进行电化学过程的电化学组分的设备。

公开(公告)号：US07368045B2

公开(公告)日：2008-05-06

申请号：US11050790

申请日：2005-01-27

申请人： Philippe M. Vereecken ,  Veeraraghavan S. Basker ,  Cyril Cabral, Jr. ,  Emanuel I. Cooper ,  Hariklia Deligianni ,  Martin M. Frank ,  Rajarao Jammy ,  Vamsi Krishna Paruchuri ,  Katherine L. Saenger ,  Xiaoyan Shao

发明人： Philippe M. Vereecken ,  Veeraraghavan S. Basker ,  Cyril Cabral, Jr. ,  Emanuel I. Cooper ,  Hariklia Deligianni ,  Martin M. Frank ,  Rajarao Jammy ,  Vamsi Krishna Paruchuri ,  Katherine L. Saenger ,  Xiaoyan Shao

IPC分类号： C25D5/02 ,  C25D11/04

CPC分类号： H01L21/2885 ,  C25D3/50 ,  C25D5/02 ,  C25D5/024 ,  C25D5/54 ,  C25D7/123 ,  C25D9/04 ,  C25F3/14 ,  H01L21/28079 ,  H01L21/28114 ,  H01L21/76885 ,  H01L29/513 ,  H01L29/517 ,  H01L29/78648

摘要： A method is provided for electroplating a gate metal or other conducting or semiconducting material directly on a dielectric such as a gate dielectric. The method involves selecting a substrate, dielectric layer, and electrolyte solution or melt, wherein the combination of the substrate, dielectric layer, and electrolyte solution or melt allow an electrochemical current to be passed from the substrate through the dielectric layer into the electrolyte solution or melt. Methods are also provided for electrochemical modification of dielectrics utilizing through-dielectric current flow.

摘要翻译： 提供了一种用于将栅极金属或其它导电或半导体材料直接电镀在诸如栅极电介质的电介质上的方法。 该方法包括选择衬底，电介质层和电解质溶液或熔体，其中衬底，电介质层和电解质溶液或熔体的组合允许电化学电流从衬底通过电介质层进入电解质溶液或 熔化。 还提供了利用电介质电流流动的电介质电化学修饰方法。

公开(公告)号：US08926805B2

公开(公告)日：2015-01-06

申请号：US13561599

申请日：2012-07-30

申请人： Veeraraghavan S. Basker ,  Eduard Cartier ,  Hariklia Deligianni ,  Rajarao Jammy ,  Vamsi K. Paruchuri

发明人： Veeraraghavan S. Basker ,  Eduard Cartier ,  Hariklia Deligianni ,  Rajarao Jammy ,  Vamsi K. Paruchuri

IPC分类号： C25D17/02 ,  C25D5/18 ,  C25D5/02 ,  H01L21/288 ,  C25D17/00 ,  H01L21/762

CPC分类号： C25D5/18 ,  C25D5/024 ,  C25D17/001 ,  C25D17/002 ,  C25D17/005 ,  H01L21/2885 ,  H01L21/7624

摘要： An electroplating apparatus and method for depositing a metallic layer on the surface of a wafer is provided wherein said apparatus and method do not require physical attachment of an electrode to the wafer. The surface of the wafer to be plated is positioned to face the anode and a plating fluid is provided between the wafer and the electrodes to create localized metallic plating. The wafer may be positioned to physically separate and lie between the anode and cathode so that one side of the wafer facing the anode contains a catholyte solution and the other side of the wafer facing the cathode contains an anolyte solution. Alternatively, the anode and cathode may exist on the same side of the wafer in the same plating fluid. In one example, the anode and cathode are separated by a semi permeable membrane.

摘要翻译： 提供了一种用于在晶片的表面上沉积金属层的电镀设备和方法，其中所述设备和方法不需要将电极物理附接到晶片。 要镀覆的晶片的表面被定位成面对阳极，并且在晶片和电极之间设置电镀液以产生局部金属电镀。 晶片可以被定位成物理分离并且位于阳极和阴极之间，使得面向阳极的晶片的一侧包含阴极电解液，并且晶片的面向阴极的另一侧包含阳极电解液。 或者，阳极和阴极可以存在于同一电镀液中晶片的同一侧。 在一个实例中，阳极和阴极被半透膜隔开。