公开(公告)号：US08564117B2

公开(公告)日：2013-10-22

申请号：US13442546

申请日：2012-04-09

申请人： Sang Won Yoon ,  Koji Shiozaki

发明人： Sang Won Yoon ,  Koji Shiozaki

IPC分类号： H01L23/045

CPC分类号： H01L23/49827 ,  H01L23/04 ,  H01L23/055 ,  H01L23/10 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L25/0655 ,  H01L2224/11849 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/819 ,  H01L2924/01029 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention is an apparatus for integrating multiple devices. The apparatus includes a substrate having a first via and a second via, a semiconductor chip positioned on a top portion of the substrate and positioned between the first via and the second via, first and second bumps positioned on the semiconductor chip, and an interposer wafer having a first interposer spring assembly and a second interposer spring assembly, the first interposer spring assembly having a first interposer spring and a first electrical connection attached to the first interposer spring, and the second interposer spring assembly having a second interposer spring and a second electrical connection attached to the second interposer spring.

摘要翻译： 本发明是用于集成多个装置的装置。 该装置包括具有第一通孔和第二通孔的基板，位于基板的顶部并且位于第一通孔和第二通孔之间的半导体芯片，位于半导体芯片上的第一和第二凸块以及插入件晶片 具有第一插入件弹簧组件和第二插入件弹簧组件，所述第一插入件弹簧组件具有第一插入件弹簧和连接到第一插入件弹簧的第一电连接件，并且第二插入件弹簧组件具有第二插入件弹簧和第二插入件弹簧 连接到第二插入件弹簧。

公开(公告)号：US20120325539A1

公开(公告)日：2012-12-27

申请号：US13165660

申请日：2011-06-21

申请人： Sang Won Yoon ,  Satoshi Yasuda ,  Koji Shiozaki

发明人： Sang Won Yoon ,  Satoshi Yasuda ,  Koji Shiozaki

IPC分类号： H05K1/18 ,  B05D1/36 ,  B23K35/02 ,  B05D5/00

CPC分类号： B23K35/262 ,  H01L21/4846 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/83193 ,  H01L2224/83825 ,  H01L2224/94 ,  H01L2924/01029 ,  H01L2924/0132 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/1579 ,  Y10T428/12222 ,  H01L2924/0105 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2224/83

摘要： Devices, methods and systems are disclosed herein to describe the wettability characteristics of the material forming a bonding area, a non-bonding area, and a melted bonding material. The melted bonding material may have a high degree of cohesion and may result in a very high contact angle (e.g., between 90°-180°) in the non-bonding area thereby preventing or limiting the flow of a melted material into the non-bonding area, which often results when the melted bonding material forms a low contact angle (e.g., between 0°-90°) in the bonding area. In other words, by choosing a material for the non-bonding area to have low wettability characteristics when compared to the melted materials of the bonding area or by treating the material forming the non-bonding area to have much lower wettability characteristics, the melted materials of the bonding area may be prevented from flowing into the non-bonding area.

摘要翻译： 本文公开的装置，方法和系统用于描述形成接合区域，非结合区域和熔融粘合材料的材料的润湿性能。 熔融的粘合材料可能具有高度的内聚力，并且可能导致非接合区域中的非常高的接触角（例如在90°-180°之间），从而防止或限制熔化的材料流入非接触区域， 粘结区域，这通常在熔融粘合材料在粘合区域中形成低接触角（例如0°-90°）时产生。 换句话说，通过选择与接合区域的熔融材料相比具有低润湿性特性的非粘结区域的材料或通过处理形成非粘结区域的材料具有低得多的润湿特性，熔融材料 可以防止粘合区域流入非接合区域。

公开(公告)号：US08154119B2

公开(公告)日：2012-04-10

申请号：US12751980

申请日：2010-03-31

申请人： Sang Won Yoon ,  Koji Shiozaki

发明人： Sang Won Yoon ,  Koji Shiozaki

IPC分类号： H01L23/34 ,  H01L23/12

CPC分类号： H01L23/49827 ,  H01L23/04 ,  H01L23/055 ,  H01L23/10 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L25/0655 ,  H01L2224/11849 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/819 ,  H01L2924/01029 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention is an apparatus for integrating multiple devices. The apparatus includes a substrate having a first via and a second via, a semiconductor chip positioned on a top portion of the substrate and positioned between the first via and the second via, first and second bumps positioned on the semiconductor chip, and an interposer wafer having a first interposer spring assembly and a second interposer spring assembly, the first interposer spring assembly having a first interposer spring and a first electrical connection attached to the first interposer spring, and the second interposer spring assembly having a second interposer spring and a second electrical connection attached to the second interposer spring.

摘要翻译： 本发明是用于集成多个装置的装置。 该装置包括具有第一通孔和第二通孔的基板，位于基板的顶部并且位于第一通孔和第二通孔之间的半导体芯片，位于半导体芯片上的第一和第二凸块以及插入件晶片 具有第一插入件弹簧组件和第二插入件弹簧组件，所述第一插入件弹簧组件具有第一插入件弹簧和连接到第一插入件弹簧的第一电连接件，并且第二插入件弹簧组件具有第二插入件弹簧和第二插入件弹簧 连接到第二插入件弹簧。

公开(公告)号：US20110241196A1

公开(公告)日：2011-10-06

申请号：US12751980

申请日：2010-03-31

申请人： Sang Won Yoon ,  Koji Shiozaki

发明人： Sang Won Yoon ,  Koji Shiozaki

IPC分类号： H01L23/498

CPC分类号： H01L23/49827 ,  H01L23/04 ,  H01L23/055 ,  H01L23/10 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L25/0655 ,  H01L2224/11849 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/819 ,  H01L2924/01029 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention is an apparatus for integrating multiple devices. The apparatus includes a substrate having a first via and a second via, a semiconductor chip positioned on a top portion of the substrate and positioned between the first via and the second via, first and second bumps positioned on the semiconductor chip, and an interposer wafer having a first interposer spring assembly and a second interposer spring assembly, the first interposer spring assembly having a first interposer spring and a first electrical connection attached to the first interposer spring, and the second interposer spring assembly having a second interposer spring and a second electrical connection attached to the second interposer spring.

摘要翻译： 本发明是用于集成多个装置的装置。 该装置包括具有第一通孔和第二通孔的基板，位于基板的顶部并且位于第一通孔和第二通孔之间的半导体芯片，位于半导体芯片上的第一和第二凸块以及插入件晶片 具有第一插入件弹簧组件和第二插入件弹簧组件，所述第一插入件弹簧组件具有第一插入件弹簧和连接到第一插入件弹簧的第一电连接件，并且第二插入件弹簧组件具有第二插入件弹簧和第二插入件弹簧 连接到第二插入件弹簧。

公开(公告)号：US20110101533A1

公开(公告)日：2011-05-05

申请号：US12611285

申请日：2009-11-03

申请人： Sang Won Yoon ,  Alexandros Margomenos

发明人： Sang Won Yoon ,  Alexandros Margomenos

IPC分类号： H01L23/498 ,  H01L21/98

CPC分类号： H01L25/0657 ,  B81C1/00238 ,  B81C2203/0771 ,  B81C2203/0792 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/1148 ,  H01L2224/1184 ,  H01L2224/11845 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1329 ,  H01L2224/13299 ,  H01L2224/133 ,  H01L2224/276 ,  H01L2224/2784 ,  H01L2224/27845 ,  H01L2224/29011 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/30181 ,  H01L2224/73104 ,  H01L2224/811 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/838 ,  H01L2224/8385 ,  H01L2224/9221 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/1579 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01027 ,  H01L2924/3512

摘要： A process of forming a semiconductor integrated circuit that includes the steps of: forming at least a first element having a first pattern of conductive material and including a polymer layer surrounding the conductive material, forming at least a second element having a second pattern of conductive material and including a polymer layer surrounding the conductive material, positioning the first element relative to the second element, and bonding the polymer layer of the first and second elements at a temperature below a melting temperature of the conductive materials of the first and second elements wherein the conductive material of the first element contacts the conductive material of the second element and is maintained in position by the bonded polymer layers.

摘要翻译： 一种形成半导体集成电路的方法，包括以下步骤：至少形成具有导电材料的第一图案的第一元件，并且包括围绕导电材料的聚合物层，至少形成具有第二导电材料图案的第二元件 并且包括围绕所述导电材料的聚合物层，相对于所述第二元件定位所述第一元件，以及在低于所述第一和第二元件的导电材料的熔融温度的温度下将所述第一和第二元件的聚合物层粘合，其中 第一元件的导电材料接触第二元件的导电材料，并通过结合的聚合物层保持在适当的位置。

公开(公告)号：US07818737B2

公开(公告)日：2010-10-19

申请号：US11345287

申请日：2006-02-02

申请人： Su Hyun Shin ,  Dong Gyun Ahn ,  Sang Won Yoon

发明人： Su Hyun Shin ,  Dong Gyun Ahn ,  Sang Won Yoon

IPC分类号： G06F9/44 ,  G06F9/45

CPC分类号： H04N21/435 ,  G06F8/65 ,  H04N21/4345 ,  H04N21/818

摘要： A method and apparatus for upgrading software of a video device is disclosed. A software program associated with the video device is downloaded using wireless communication to upgrade the video device. This allows the software program to be more quickly downloaded. The apparatus includes a tuner unit, a storage unit, and a controller. The tuner unit receives a plurality of ROM files into which a software program associated with a video device has been divided. The storage unit stores the received ROM files. The controller reads the stored ROM files and upgrades the video device.

摘要翻译： 公开了一种用于升级视频设备的软件的方法和装置。 使用无线通信下载与视频设备相关联的软件程序来升级视频设备。 这样可以更快地下载软件程序。 该装置包括调谐器单元，存储单元和控制器。 调谐器单元接收与视频设备相关联的软件程序已被划分的多个ROM文件。 存储单元存储所接收的ROM文件。 控制器读取存储的ROM文件并升级视频设备。