公开(公告)号：US20110101827A1

公开(公告)日：2011-05-05

申请号：US12610771

申请日：2009-11-02

申请人： Sang Won Yoon ,  Alexandros Margomenos

发明人： Sang Won Yoon ,  Alexandros Margomenos

IPC分类号： H02N2/18

CPC分类号： H02N2/186 ,  H01L41/1134 ,  H01L41/1136

摘要： The present invention discloses an energy harvesting device that converts small magnitude and low frequency vibrations into electrical energy. The device can include a base, a low frequency element, and a piezoelectric element. The low frequency element can be movably attached to the base and the piezoelectric element can also be attached to the base and be spaced apart from the low frequency element with a vacant space therebetween. Upon vibration of the low frequency element resulting from environmental vibrations, the low frequency element can impact the piezoelectric element and cause elastic deformation thereto.

摘要翻译： 本发明公开了一种将小振幅和低频振动转换为电能的能量收集装置。 该器件可以包括基极，低频元件和压电元件。 低频元件可以可移动地附接到基座，并且压电元件也可以附接到基座并且与低频元件间隔开，其间具有空隙。 由于环境振动引起的低频元件的振动，低频元件可能会冲击压电元件并引起弹性变形。

公开(公告)号：US08138019B2

公开(公告)日：2012-03-20

申请号：US12611285

申请日：2009-11-03

申请人： Sang Won Yoon ,  Alexandros Margomenos

发明人： Sang Won Yoon ,  Alexandros Margomenos

IPC分类号： H01L21/00 ,  H01L21/30

CPC分类号： H01L25/0657 ,  B81C1/00238 ,  B81C2203/0771 ,  B81C2203/0792 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/1148 ,  H01L2224/1184 ,  H01L2224/11845 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1329 ,  H01L2224/13299 ,  H01L2224/133 ,  H01L2224/276 ,  H01L2224/2784 ,  H01L2224/27845 ,  H01L2224/29011 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/30181 ,  H01L2224/73104 ,  H01L2224/811 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/838 ,  H01L2224/8385 ,  H01L2224/9221 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/1579 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01027 ,  H01L2924/3512

摘要： A process of forming a semiconductor integrated circuit that includes the steps of: forming at least a first element having a first pattern of conductive material and including a polymer layer surrounding the conductive material, forming at least a second element having a second pattern of conductive material and including a polymer layer surrounding the conductive material, positioning the first element relative to the second element, and bonding the polymer layer of the first and second elements at a temperature below a melting temperature of the conductive materials of the first and second elements wherein the conductive material of the first element contacts the conductive material of the second element and is maintained in position by the bonded polymer layers.

摘要翻译： 一种形成半导体集成电路的方法，包括以下步骤：至少形成具有导电材料的第一图案的第一元件，并且包括围绕导电材料的聚合物层，至少形成具有第二导电材料图案的第二元件 并且包括围绕所述导电材料的聚合物层，相对于所述第二元件定位所述第一元件，以及在低于所述第一和第二元件的导电材料的熔融温度的温度下将所述第一和第二元件的聚合物层粘合，其中 第一元件的导电材料接触第二元件的导电材料，并通过结合的聚合物层保持在适当的位置。

公开(公告)号：US07986076B2

公开(公告)日：2011-07-26

申请号：US12610771

申请日：2009-11-02

申请人： Sang Won Yoon ,  Alexandros Margomenos

发明人： Sang Won Yoon ,  Alexandros Margomenos

IPC分类号： H01L41/08

CPC分类号： H02N2/186 ,  H01L41/1134 ,  H01L41/1136

摘要： The present invention discloses an energy harvesting device that converts small magnitude and low frequency vibrations into electrical energy. The device can include a base, a low frequency element, and a piezoelectric element. The low frequency element can be movably attached to the base and the piezoelectric element can also be attached to the base and be spaced apart from the low frequency element with a vacant space therebetween. Upon vibration of the low frequency element resulting from environmental vibrations, the low frequency element can impact the piezoelectric element and cause elastic deformation thereto.

摘要翻译： 本发明公开了一种将小振幅和低频振动转换为电能的能量收集装置。 该器件可以包括基极，低频元件和压电元件。 低频元件可以可移动地附接到基座，并且压电元件也可以附接到基座并且与低频元件间隔开，其间具有空隙。 由于环境振动引起的低频元件的振动，低频元件可能会冲击压电元件并引起弹性变形。

公开(公告)号：US20110101533A1

公开(公告)日：2011-05-05

申请号：US12611285

申请日：2009-11-03

申请人： Sang Won Yoon ,  Alexandros Margomenos

发明人： Sang Won Yoon ,  Alexandros Margomenos

IPC分类号： H01L23/498 ,  H01L21/98

CPC分类号： H01L25/0657 ,  B81C1/00238 ,  B81C2203/0771 ,  B81C2203/0792 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/1148 ,  H01L2224/1184 ,  H01L2224/11845 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1329 ,  H01L2224/13299 ,  H01L2224/133 ,  H01L2224/276 ,  H01L2224/2784 ,  H01L2224/27845 ,  H01L2224/29011 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/30181 ,  H01L2224/73104 ,  H01L2224/811 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/838 ,  H01L2224/8385 ,  H01L2224/9221 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/1579 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01027 ,  H01L2924/3512

摘要： A process of forming a semiconductor integrated circuit that includes the steps of: forming at least a first element having a first pattern of conductive material and including a polymer layer surrounding the conductive material, forming at least a second element having a second pattern of conductive material and including a polymer layer surrounding the conductive material, positioning the first element relative to the second element, and bonding the polymer layer of the first and second elements at a temperature below a melting temperature of the conductive materials of the first and second elements wherein the conductive material of the first element contacts the conductive material of the second element and is maintained in position by the bonded polymer layers.

摘要翻译： 一种形成半导体集成电路的方法，包括以下步骤：至少形成具有导电材料的第一图案的第一元件，并且包括围绕导电材料的聚合物层，至少形成具有第二导电材料图案的第二元件 并且包括围绕所述导电材料的聚合物层，相对于所述第二元件定位所述第一元件，以及在低于所述第一和第二元件的导电材料的熔融温度的温度下将所述第一和第二元件的聚合物层粘合，其中 第一元件的导电材料接触第二元件的导电材料，并通过结合的聚合物层保持在适当的位置。

公开(公告)号：USD639256S1

公开(公告)日：2011-06-07

申请号：US29361543

申请日：2010-05-12

申请人： Yong Ho Lee ,  Sang Won Yoon ,  A Reum Kwon

设计人： Yong Ho Lee ,  Sang Won Yoon ,  A Reum Kwon

公开(公告)号：USD635943S1

公开(公告)日：2011-04-12

申请号：US29364733

申请日：2010-06-28

申请人： Yong Soo Kim ,  Sang Won Yoon ,  Yong Ho Lee

设计人： Yong Soo Kim ,  Sang Won Yoon ,  Yong Ho Lee

公开(公告)号：USD624512S1

公开(公告)日：2010-09-28

申请号：US29354172

申请日：2010-01-20

申请人： Yong Soo Kim ,  Sang Won Yoon ,  A Reum Kwon ,  Yong Ho Lee

设计人： Yong Soo Kim ,  Sang Won Yoon ,  A Reum Kwon ,  Yong Ho Lee

公开(公告)号：US08814030B2

公开(公告)日：2014-08-26

申请号：US13723055

申请日：2012-12-20

申请人： Sang Won Yoon

发明人： Sang Won Yoon

IPC分类号： B23K31/02 ,  B23K20/16

CPC分类号： B23K31/02 ,  B23K20/16 ,  H01L24/29 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32503 ,  H01L2224/32507 ,  H01L2224/83447 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/94 ,  H01L2224/83 ,  H01L2924/00014

摘要： Alloy formation systems and methods and a mechanism, strategy and design for power electronics having high operating temperatures. The system creates a bondline targeted for performance in power electronics. The system provides for sequential alloy growth in high temperature operating power electronics. The system is at least applicable to wafer-to-wafer, die-to-wafer, die-to-substrate, or die-to-die bonding.

摘要翻译： 合金形成系统和方法以及具有高工作温度的电力电子器件的机理，策略和设计。 该系统创建了一个针对电力电子产品性能的绑定线。 该系统提供高温工作电力电子设备中顺序合金生长。 该系统至少适用于晶片到晶片，晶片到晶片，管芯到衬底或管芯到管芯的接合。

公开(公告)号：US20130270327A1

公开(公告)日：2013-10-17

申请号：US13723055

申请日：2012-12-20

申请人： Sang Won Yoon

发明人： Sang Won Yoon

IPC分类号： B23K31/02

CPC分类号： B23K31/02 ,  B23K20/16 ,  H01L24/29 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32503 ,  H01L2224/32507 ,  H01L2224/83447 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/94 ,  H01L2224/83 ,  H01L2924/00014

摘要： Alloy formation systems and methods and a mechanism, strategy and design for power electronics having high operating temperatures. The system creates a bondline targeted for performance in power electronics. The system provides for sequential alloy growth in high temperature operating power electronics. The system is at least applicable to wafer-to-wafer, die-to-wafer, die-to-substrate, or die-to-die bonding.

摘要翻译： 合金形成系统和方法以及具有高工作温度的电力电子器件的机理，策略和设计。 该系统创建了一个针对电力电子产品性能的绑定线。 该系统提供高温工作电力电子设备中的顺序合金生长。 该系统至少适用于晶片到晶片，晶片到晶片，管芯到衬底或管芯到管芯的接合。

公开(公告)号：US20130270326A1

公开(公告)日：2013-10-17

申请号：US13448632

申请日：2012-04-17

申请人： Sang Won Yoon ,  Koji Shiozaki

发明人： Sang Won Yoon ,  Koji Shiozaki

IPC分类号： B23K31/02 ,  B23K37/04 ,  B23K20/00

CPC分类号： B23K20/02 ,  B23K20/16 ,  B23K2101/36 ,  H01L24/83 ,  H01L2224/83 ,  H01L2224/83825 ,  H01L2224/8383

摘要： A bonding structure enabling fast and reliable methods to fabricate a substantially homogeneous bondline with reduced dependency of a thickness limitation is disclosed. Also, this system creates a bondline targeted for performance in power electronics. This system is highly adaptable as various structures and fabrication options may be implemented. This enables diverse fabrication selection and creates less dependency on outside conditions. The disclosed system is at least applicable to wafer-to-wafer, die-to-wafer, die-to-substrate, or die-to-die bonding.

摘要翻译： 公开了一种能够快速且可靠地制造基本上均匀的粘合线的接合结构，其具有减小的厚度限制的依赖性。 此外，该系统还创建了一个针对电力电子产品性能的粘合线。 该系统是高度适应性的，因为可以实现各种结构和制造选项。 这使得能够进行多样化的制造选择并且对外部条件产生较少的依赖性。 所公开的系统至少适用于晶片到晶片，晶片到晶片，管芯到衬底或管芯到管芯的接合。