公开(公告)号：US20060192320A1

公开(公告)日：2006-08-31

申请号：US11364631

申请日：2006-02-27

Applicant: Toshinobu Tokita ,  Hirohisa Ota ,  Eigo Kawakami ,  Kazuyuki Kasumi ,  Takashi Nakamura

Inventor： Toshinobu Tokita ,  Hirohisa Ota ,  Eigo Kawakami ,  Kazuyuki Kasumi ,  Takashi Nakamura

IPC: B29C59/02

CPC classification number: B82Y10/00 ,  B81C99/009 ,  B81C2201/0152 ,  B81C2201/036 ,  B82Y40/00 ,  G03F7/0002

Abstract: One object of the present invention is to provide a pattern transferring mold which can provide a starting area of mold release easily and certainly and a pattern transferring apparatus with the same. A pattern transferring mold is disclosed which is used in a pattern transferring apparatus that brings the mold into contact with a photo-curing resin on a substrate and cures the photo-curing resin by light irradiation to transfer a pattern formed on the mold onto the photo-curing resin. The mold comprises a bottom face which contacts the photo-curing resin, the bottom face portion including a first area in which the pattern is formed and a second area formed outside the first area. The mold has a mold-releasing shape in the second area, the mold-releasing shape providing a starting area of mold release from the cured photo-curing resin.

Abstract translation: 本发明的一个目的是提供一种图案转印模具，其可以容易且确定地提供脱模的起始区域和具有该图案转印模具的图案转印装置。 公开了一种图案转印模具，其用于使模具与基板上的光固化树脂接触的图案转印装置，并通过光照射固化光固化树脂，以将形成在模具上的图案转印到照片上 固化树脂。 模具包括与光固化树脂接触的底面，底面部分包括形成图案的第一区域和形成在第一区域外部的第二区域。 模具在第二区域具有脱模形状，脱模形状提供了从固化的光固化树脂脱模的起始区域。

公开(公告)号：US06936181B2

公开(公告)日：2005-08-30

申请号：US10251103

申请日：2002-09-20

Applicant: Colin Bulthaup ,  Chris Spindt

Inventor： Colin Bulthaup ,  Chris Spindt

IPC: B29C43/02 ,  B41M1/24 ,  B41M3/00 ,  B81C1/00 ,  G03F7/00 ,  H01L51/40 ,  B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00

CPC classification number: G03F7/0002 ,  B29C43/021 ,  B29C2043/023 ,  B41M1/24 ,  B41M3/006 ,  B81C1/0046 ,  B81C2201/036 ,  B82Y10/00 ,  B82Y40/00 ,  H01L51/0004

Abstract: The current invention is directed to a method of patterning a surface or layer in the fabrication of a micro-device. In accordance with a preferred embodiment of the invention, a first mask structure is formed by depositing a layer of a first material onto the surface or layer and embossing the layer with a micro-stamp structure. The layer is preferably embossed as a liquid, which is solidified or cured to form the first mask structure. The first mask structure can be used as an etch-stop mask which is removed in a subsequent processing step or, alternatively, the first mask structure can remain a functional layer of the micro-device. In further embodiments, unmasked regions of the surface or layer are chemically treated through the first mask structure and/or a second material is deposited onto the unmasked regions of the surface or layer through the first mask structure to form a second mask structure and/or a second functional layer of the micro-device.

Abstract translation: 本发明涉及在微型器件的制造中图案化表面或层的方法。 根据本发明的优选实施例，通过在表面或层上沉积第一材料层并用微型印模结构压印该层来形成第一掩模结构。 该层优选为液体压花，其被固化或固化以形成第一掩模结构。 第一掩模结构可以用作在后续处理步骤中去除的蚀刻停止掩模，或者替代地，第一掩模结构可以保留在微型器件的功能层。 在另外的实施例中，通过第一掩模结构化学处理表面或层的未掩蔽区域，和/或通过第一掩模结构将第二材料沉积到表面或层的未掩蔽区域上，以形成第二掩模结构和/或 微器件的第二功能层。

公开(公告)号：US20040206391A1

公开(公告)日：2004-10-21

申请号：US10843949

申请日：2004-05-12

Inventor： Guillaume Guzman ,  Jean-Pierre Themont

IPC: F15C001/06

CPC classification number: B81C1/00119 ,  B01L3/5027 ,  B33Y70/00 ,  B33Y80/00 ,  B81B2201/058 ,  B81B2203/0353 ,  B81C1/00071 ,  B81C2201/019 ,  B81C2201/036 ,  C03B19/063 ,  C03B23/20 ,  Y10T137/0391 ,  Y10T137/0402 ,  Y10T137/2224 ,  Y10T137/6416

Abstract: The present invention relates to microfluidic devices and to their method of manufacture. The microfluidic devices are original by their specific structure (of sandwich type) and by the materials from which they are made (mainly glasses, glass ceramics, ceramics), and also by their specific method of manufacture, which is based on a vacuum-forming operation. The microfluidic device includes a first assembly including a microstructure and a first substrate, wherein the microstructure is constructed and arranged on the substrate under vacuum. A second assembly includes a second substrate positioned on the microstructure after the first assembly is presintered and adhered thereto by heat treatment to form a one-piece microstructure defining at least one recess between the first and second substrates.

公开(公告)号：US06797211B1

公开(公告)日：2004-09-28

申请号：US09786832

申请日：2001-06-13

Applicant: Ewald Karl Michael Guenther ,  Zhong Chen ,  Brian Cotterell

Inventor： Ewald Karl Michael Guenther ,  Zhong Chen ,  Brian Cotterell

IPC: B29C5902

CPC classification number: H01L51/0023 ,  B81B7/0006 ,  B81C2201/036 ,  H01L27/3281 ,  H01L51/5206 ,  H01L2251/105

Abstract: A method of fabricating a device, including mechanically patterning a device layer using a stamp containing a desired pattern. The device layer is formed on a plastic or polymeric substrate. The stamp is pressed against the substrate under a load which patterns the device layer without cracking the device layer in the non-patterned areas.

Abstract translation: 一种制造器件的方法，包括使用包含期望图案的印模对器件层进行机械图案化。 器件层形成在塑料或聚合物基底上。 在图案化装置层的负载下，将印模压在基板上，而不破坏未图案化区域中的装置层。

公开(公告)号：US06595232B2

公开(公告)日：2003-07-22

申请号：US10163215

申请日：2002-06-04

Applicant: Guillaume Guzman ,  Jean-Pierre Themont

Inventor： Guillaume Guzman ,  Jean-Pierre Themont

IPC: F15C106

CPC classification number: B81C1/00119 ,  B01L3/5027 ,  B33Y70/00 ,  B33Y80/00 ,  B81B2201/058 ,  B81B2203/0353 ,  B81C1/00071 ,  B81C2201/019 ,  B81C2201/036 ,  C03B19/063 ,  C03B23/20 ,  Y10T137/0391 ,  Y10T137/0402 ,  Y10T137/2224 ,  Y10T137/6416

Abstract: The present invention relates to microfluidic devices and to their method of manufacture. The microfluidic devices are original by their specific structure (of sandwich type) and by the materials from which they are made (mainly glasses, glass ceramics, ceramics), and also by their specific method of manufacture, which is based on a vacuum-forming operation. The microfluidic device includes a first assembly including a microstructure and a first substrate, wherein the microstructure is constructed and arranged on the substrate under vacuum. A second assembly includes a second substrate positioned on the microstructure after the first assembly is presintered and adhered thereto by heat treatment to form a one-piece microstructure defining at least one recess between the first and second substrates.

公开(公告)号：US20030082485A1

公开(公告)日：2003-05-01

申请号：US10251103

申请日：2002-09-20

Inventor： Colin Bulthaup ,  Chris Spindt

IPC: G03C005/00

CPC classification number: G03F7/0002 ,  B29C43/021 ,  B29C2043/023 ,  B41M1/24 ,  B41M3/006 ,  B81C1/0046 ,  B81C2201/036 ,  B82Y10/00 ,  B82Y40/00 ,  H01L51/0004

Abstract: The current invention is directed to a method of patterning a surface or layer in the fabrication of a micro-device. In accordance with a preferred embodiment of the invention, a first mask structure is formed by depositing a layer of a first material onto the surface or layer and embossing the layer with a micro-stamp structure. The layer is preferably embossed as a liquid, which is solidified or cured to form the first mask structure. The first mask structure can be used as an etch-stop mask which is removed in a subsequent processing step or, alternatively, the first mask structure can remain a functional layer of the micro-device. In further embodiments, unmasked regions of the surface or layer are chemically treated through the first mask structure and/or a second material is deposited onto the unmasked regions of the surface or layer through the first mask structure to form a second mask structure and/or a second functional layer of the micro-device.

Abstract translation: 本发明涉及在微型器件的制造中图案化表面或层的方法。 根据本发明的优选实施例，通过在表面或层上沉积第一材料层并用微型印模结构压印该层来形成第一掩模结构。 该层优选为液体压花，其被固化或固化以形成第一掩模结构。 第一掩模结构可以用作在后续处理步骤中去除的蚀刻停止掩模，或者替代地，第一掩模结构可以保留在微型器件的功能层。 在另外的实施例中，通过第一掩模结构化学处理表面或层的未掩蔽区域，和/或通过第一掩模结构将第二材料沉积到表面或层的未掩蔽区域上，以形成第二掩模结构和/或 微器件的第二功能层。

公开(公告)号：US06471903B2

公开(公告)日：2002-10-29

申请号：US09956520

申请日：2001-09-19

Applicant: Faiz Feisal Sherman ,  Vadim Vladimirovich Yuzhakov ,  Vladimir Gartstein ,  Grover David Owens

Inventor： Faiz Feisal Sherman ,  Vadim Vladimirovich Yuzhakov ,  Vladimir Gartstein ,  Grover David Owens

IPC: B29C3342

CPC classification number: B29C51/082 ,  A61M37/00 ,  A61M37/0015 ,  A61M2037/0023 ,  A61M2037/003 ,  A61M2037/0053 ,  B26F1/24 ,  B29C33/0033 ,  B29C33/42 ,  B29C37/0053 ,  B29C45/2628 ,  B29C51/00 ,  B29C2059/023 ,  B29L2031/7544 ,  B29L2031/756 ,  B81B2201/055 ,  B81C1/00111 ,  B81C2201/036

Abstract: An array of hollow microneedles is constructed of molded plastic, in which a micro-machining technique is used to fabricate the molds used in a plastic microforming process. The molds are detachable and can be re-used. The preferred process for making the plastic arrays of microneedles is a microinjection technique. In the microinjection method, a molten plastic substance is injected between two micro-machined molds that contain microhole and micropillar arrays. Once the desired shape of the microneedle array has been formed, the mold and the plastic material are cooled down. Next, the molds are separated and the plastic microneedle array is detached from the mold structures.

Abstract translation: 中空微针阵列由模制塑料构成，其中使用微加工技术来制造在塑料微成形过程中使用的模具。 模具是可拆卸的，可以重新使用。 用于制造微针的塑料阵列的优选方法是显微注射技术。 在显微注射方法中，将熔融塑料物质注入包含微孔和微柱阵列的两个微加工模具之间。 一旦已经形成所需的微针阵列形状，就将模具和塑料材料冷却下来。 接下来，模具被分离，并且塑料微针阵列与模具结构分离。

公开(公告)号：US11905163B2

公开(公告)日：2024-02-20

申请号：US16753362

申请日：2019-04-03

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xiaochen Ma ,  Guangcai Yuan ,  Ce Ning ,  Xin Gu ,  Xiao Zhang ,  Chao Li

IPC: B81B1/00 ,  B81C1/00 ,  B01L3/00

CPC classification number: B81B1/002 ,  B01L3/502715 ,  B81C1/00071 ,  B01L2300/0645 ,  B81B2201/05 ,  B81B2203/0338 ,  B81C2201/0111 ,  B81C2201/036

Abstract: A micro-nano channel structure, a method for manufacturing the micro-nano channel structure, a sensor, a method for manufacturing the sensor, and a microfluidic device are provided by the embodiments of the present disclosure. The micro-nano channel structure includes: a base substrate; a base layer, on the base substrate and including a plurality of protrusions; and a channel wall layer, on a side of the plurality of the protrusions away from the base substrate, and the channel wall layer has a micro-nano channel; a recessed portion is provided between adjacent protrusions of the plurality of the protrusions, and an orthographic projection of the micro-nano channel on the base substrate is located within an orthographic projection of the recessed portion on the base substrate.

公开(公告)号：US09718674B2

公开(公告)日：2017-08-01

申请号：US14914015

申请日：2014-08-26

Applicant: SILEX MICROSYSTEMS AB

Inventor： Edvard Kalvesten ,  Thorbjorn Ebefors ,  Niklas Svedin

IPC: H01L23/08 ,  B81B7/00 ,  H01L21/50 ,  B81C1/00 ,  H01L23/00

CPC classification number: B81B7/007 ,  B81B2201/01 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2207/095 ,  B81C1/00301 ,  B81C2201/0153 ,  B81C2201/036 ,  B81C2203/0109 ,  B81C2203/0145 ,  H01L21/50 ,  H01L23/08 ,  H01L24/94 ,  H01L2924/16235

Abstract: A device includes a base substrate (700) with a micro component (702) attached thereto. Suitably it is provided with routing elements (704) for conducting signals to and from the component (702). It also includes spacer members (706) which also can act as conducting structures for routing signals vertically. There is a capping structure (708) of a glass material, provided above the base substrate (700), bonded via the spacer members (706), preferably by eutectic bonding, wherein the capping structure (708) includes vias (710) including metal for providing electrical connection through the capping structure. The vias can be made by a stamping/pressing method entailing pressing needles under heating to soften the glass and applying pressure, to a predetermined depth in the glass. However, other methods are possible, e-g- drilling, etching, blasting.

公开(公告)号：US09168680B2

公开(公告)日：2015-10-27

申请号：US13559640

申请日：2012-07-27

Applicant: Kwangyeol Lee

Inventor： Kwangyeol Lee

IPC: C23F1/00 ,  B29C33/38 ,  B81C1/00

CPC classification number: B29C33/3857 ,  B81C1/00031 ,  B81C2201/036

Abstract: One or more techniques for nano structure fabrication are provided. In an embodiment, an apparatus for manufacturing a nano structure is disclosed. The apparatus includes a stamp having a line pattern on a surface thereof that comprises a plurality of protrusions, a die configured to hold a substrate thereon, and a mechanical processing unit configured to press the plurality of protrusions of the stamp against the substrate with a predetermined pressure so as to form at least one channel pore therebetween.

Abstract translation: 提供一种或多种用于纳米结构制造的技术。 在一个实施例中，公开了一种用于制造纳米结构的装置。 该装置包括在其表面上具有线图案的印模，该印模包括多个凸起，模具，其构造成在其上保持基板;以及机械处理单元，其构造成以预定的方式将印模的多个突起压靠在基板上 以在其间形成至少一个通道孔。