公开(公告)号：US4112631A

公开(公告)日：1978-09-12

申请号：US364671

申请日：1973-05-29

申请人： Robert N. Howard

发明人： Robert N. Howard

IPC分类号： B24D3/00 ,  C09K3/14 ,  B24D3/06 ,  B24D3/24

CPC分类号： C09K3/1472 ,  C09K3/1436

摘要： A capsule containing fine abrasive grains dispersed in a liquid or low melting solid grinding aid can be substituted for conventional abrasive polishing grains. A novel coated abrasive structure is made by bonding such capsules to a backing sheet.

公开(公告)号：US3618272A

公开(公告)日：1971-11-09

申请号：US3618272D

申请日：1968-09-19

申请人： FORD MOTOR CO

发明人： WHALEN THOMAS J ,  ALSTEN ROY L VAN

IPC分类号： B23F19/04 ,  B24B1/00 ,  C09K3/14 ,  B24B3/00

CPC分类号： B24B1/00 ,  B23F19/04 ,  C09K3/1472

摘要： GEAR TEETH OF AUTOMOTIVE HYPOID GEAR SETS ARE LAPPED WITH AN AQUEOUS BASE LAPPING COMPOSITION. THE LAPPING COMPOSITION IS APPLIED CONTINUOUSLY WHILE DRIVING ONE MEMBER OF THE GEAR SET AND BRAKING THE OTHER MEMBER. AN EXPENSIVE AND NON-HAZAROUS AQUEOUS SOLUTION IS USED TO REMOVE LAPPING COMPOSITION AFTER THE LAPPING OPERATION.

公开(公告)号：US2944879A

公开(公告)日：1960-07-12

申请号：US65501057

申请日：1957-04-25

申请人： KENMORE RES COMPANY

发明人： ALLEN LLOYD R ,  WOODARD DUDLEY H

IPC分类号： C09K3/14

CPC分类号： C09K3/1472

公开(公告)号：US1497836A

公开(公告)日：1924-06-17

申请号：US55633022

申请日：1922-04-24

申请人： WOOD IMES MFG COMPANY

发明人： BENEDICT GEORGE W

IPC分类号： C09K3/14

CPC分类号： C09K3/1472

公开(公告)号：US20240050792A1

公开(公告)日：2024-02-15

申请号：US18383173

申请日：2023-10-24

申请人： DAIKIN INDUSTRIES, LTD.

发明人： Kazuhiro TAKAHASHI

IPC分类号： A62D1/00 ,  B01D3/14 ,  B01D3/36 ,  C07C17/383 ,  C08J9/12 ,  C08J9/14 ,  C09K3/14 ,  C09K3/30 ,  C09K5/04 ,  C11D7/50 ,  H01B3/56

CPC分类号： A62D1/0057 ,  B01D3/143 ,  B01D3/36 ,  C07C17/383 ,  C08J9/127 ,  C08J9/146 ,  C09K3/1472 ,  C09K3/30 ,  C09K5/045 ,  C11D7/5018 ,  C11D7/5036 ,  H01B3/56 ,  C08J2203/142 ,  C08J2203/182 ,  C09K2205/122 ,  C09K2205/22 ,  C09K2205/32

摘要： The present disclosure provides a novel azeotropic or azeotrope-like composition comprising hydrogen fluoride and 1,1,2-trifluoroethane (HFC-143), 1-chloro-2, 2-difluoroethane (HCFC-142), or 1,2-dichloro-1-fluoroethane (HCFC-141); and a separation method using the composition.
An azeotropic or azeotrope-like composition comprising hydrogen fluoride and HFC-143. An azeotropic or azeotrope-like composition comprising hydrogen fluoride and HCFC-142. An azeotropic or azeotrope-like composition comprising hydrogen fluoride and HCFC-141. A separation method of a composition comprising hydrogen fluoride and at least one member selected from the group consisting of HFC-143, HCFC-142, and HCFC-141.

公开(公告)号：US10037894B2

公开(公告)日：2018-07-31

申请号：US14376382

申请日：2013-01-29

申请人： Hitachi Chemical Company, Ltd.

发明人： Yasuhiro Ichige ,  Kouji Haga ,  Seiichi Kondo

IPC分类号： H01L21/302 ,  H01L21/461 ,  C09K13/00 ,  C03C15/00 ,  C03C25/68 ,  H01L21/321 ,  C23F1/00 ,  C09G1/00 ,  C23F1/14 ,  B24B37/04 ,  C09K3/14 ,  C09G1/02

CPC分类号： H01L21/3212 ,  B24B37/044 ,  C09G1/00 ,  C09G1/02 ,  C09K3/1409 ,  C09K3/1463 ,  C09K3/1472 ,  C23F1/00 ,  C23F1/14

摘要： The present invention relates to a metal polishing liquid for polishing at least a part of metal in a substrate having the metal, comprising, component A: a metal solubilizer containing amino acids, component B: compounds having the benzotriazole skeleton, and component C: an acrylic acid polymer having the weight average molecular weight of 10,000 or more, and having the mass ratio between the component B and the component C, (component B:component C), to be 1:1 to 1:5. Use of the metal polishing liquid can simultaneously yield high polishing rates and low etching rates at higher level, enabling to form an embedded pattern with higher reliability.

公开(公告)号：US20170239780A1

公开(公告)日：2017-08-24

申请号：US15530575

申请日：2017-01-31

申请人： Iowa State University Research Foundation, Inc.

发明人： Ludovico Cademartiri ,  Briane Caroline Montoya

IPC分类号： B24B37/04 ,  C23F3/00 ,  C10M125/10

CPC分类号： B24B37/044 ,  C09K3/1436 ,  C09K3/1472 ,  C10M125/10 ,  C10M2201/062 ,  C10N2220/082 ,  C10N2240/10 ,  C10N2240/401 ,  C10N2250/12 ,  C10N2280/00

摘要： A lubricated mechanical polishing (LMP) process is provided that uses hard nanoparticles of less than 5 nm diameter dispersed in a fluid lubricant as a polishing slurry to produce an ultra-smooth surface on a hard metallic or non-metallic substrate with a sub-nanometer surface roughness substantially less than that produced by silica chemical mechanical polishing.

公开(公告)号：US09683155B2

公开(公告)日：2017-06-20

申请号：US14651925

申请日：2013-12-06

申请人： ARKEMA FRANCE

发明人： Dominique Deur-Bert ,  Laurent Wendlinger

IPC分类号： C09K5/04 ,  H01B3/56 ,  C09K3/00 ,  B01F17/00 ,  C09K3/30

CPC分类号： C09K5/045 ,  B01F17/0035 ,  B01F17/0085 ,  C09K3/00 ,  C09K3/1472 ,  C09K3/30 ,  C09K2205/126 ,  C09K2205/13 ,  C09K2205/22 ,  C09K2205/32 ,  H01B3/56

摘要： Compositions containing 2,3,3,3-tetrafluoropropene and 1,2-difluoroethylene, that can be used in multiple fields of application. The composition can include from 45 to 90 mol % of 2,3,3,3-tetrafluoropropene and from 55 to 10 mol % of, 1,2-difluoroethylene. The composition can include from 55 to 80 mol % of 2,3,3,3-tetrafluoropropene and from 45 to 20 mol % of 1,2-difluoroethylene. The composition can include from 62 to 69 mol % of 2,3,3,3-tetrafluoropropene and from 38 to 31 mol % of 1,2-difluoroethylene at a temperature of between −30° C. and 56° C. and a pressure of between 1 and 15 bar.

公开(公告)号：US20170158911A1

公开(公告)日：2017-06-08

申请号：US15332966

申请日：2016-10-24

申请人： Treliant Fang

发明人： Treliant Fang

IPC分类号： C09G1/02 ,  H01L21/02

CPC分类号： C09G1/02 ,  B24C11/00 ,  C09G1/00 ,  C09G1/04 ,  C09K3/1409 ,  C09K3/1463 ,  C09K3/1472 ,  H01L21/02013 ,  H01L21/02024 ,  H01L21/30625 ,  H01L21/3212

摘要： Silicon carbide (SiC) etchants with a generic formula of MXO2, where M is an alkali metal, X is a halogen, O is oxygen are disclosed. When mixed with an abrasive powder in an aqueous slurry form, this MXO2 etchant acts as tribochemical reactant in enhancing the SiC material removal rate during chemical mechanical polishing (CMP). The material removal rates can sometimes go up to a few order of magnitudes, as compared to the slurry without this MXO2 etchant. Typical metal in the formula MXO2 are K (potassium) and Na (sodium), X includes Cl (chlorine), Br (bromine) and I (iodine). The whole series of MXO2 compounds belong to the chemical family of metal halites or ammonium halites. Sodium chlorite, NaClO2, the simplest and most available member of the halite family, is a typical example. The enhanced polishing rate can be utilized to significantly increase the throughput of CMP operation for non-oxide wafer polishing. The polishing waste water from the CMP process can be treated with ease in the waste water treatment facilities because of the absence of toxic heavy metal ions in the polishing formulations.

公开(公告)号：US20170015868A1

公开(公告)日：2017-01-19

申请号：US15278911

申请日：2016-09-28

申请人： YAMAGUCHI SEIKEN KOGYO CO., LTD.

发明人： Toru IWATA ,  Akira SUGAWA

IPC分类号： C09G1/02 ,  C09K3/14 ,  G11B5/84 ,  C01B33/14

CPC分类号： C09G1/02 ,  B24B37/042 ,  B24B37/044 ,  C01B33/14 ,  C01P2004/62 ,  C01P2004/64 ,  C09K3/1409 ,  C09K3/1463 ,  C09K3/1472 ,  G11B5/8404

摘要： Embodiments of the invention provide a polishing composition including colloidal silica, pulverized wet-process silica particles, and a water-soluble polymer compound, wherein the water-soluble polymer compound is a polymer or copolymer having a constituent unit derived from an unsaturated aliphatic carboxylic acid. Various embodiments achieve a high polishing rate and obtain a good surface smoothness and end-face shape without the use of alumina particles.

摘要翻译： 本发明的实施方案提供了一种包括胶体二氧化硅，粉碎湿法二氧化硅颗粒和水溶性聚合物化合物的抛光组合物，其中水溶性高分子化合物是具有衍生自不饱和脂族羧酸的构成单元的聚合物或共聚物 。 在不使用氧化铝颗粒的情况下，各种实施例实现高抛光速率并获得良好的表面平滑度和端面形状。