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    Method for fabricating plated product
    22.
    发明授权
    Method for fabricating plated product 有权
    电镀产品的制造方法

    公开(公告)号：US08092666B2

    公开(公告)日：2012-01-10

    申请号：US12076866

    申请日：2008-03-25

    Applicant: Ryoji Matsuoka ,  Muneo Furutani ,  Masato Nasu ,  Takeshi Inoue

    Inventor： Ryoji Matsuoka ,  Muneo Furutani ,  Masato Nasu ,  Takeshi Inoue

    IPC: C25D5/02

    CPC classification number: C25D17/12 ,  C25D5/00 ,  C25D7/00 ,  C25D17/007

    Abstract: A bumper molding is fabricated by disposing segmented anodes 31 and 32 on surfaces 22 and 24 of a base material 20, which are to be plated, and performing electroplating so as to form metal films on the surfaces 22 and 24, respectively. The curvature of a surface of a concave portion, which is formed in each part of the surfaces 22 and 24 so that the surface of the concave portion is away from the segmented anodes 31 and 32, respectively, is larger than those of other portions at a part serving as a border between the second plated surface 22 and the fourth plated surface 24. Accordingly, the distance from the part serving as the border between the second plated surface 22 and the fourth plated surface 24 to a metal case 50a corresponding to this part is set so as to be shorter than those from each of the other parts to the metal cases 50a and 50b respectively corresponding to the segmented anodes 31 and 32.

    Abstract translation: 通过将分段阳极31和32设置在要被电镀的基材20的表面22和24上并进行电镀以分别在表面22和24上形成金属膜来制造保险杠模制件。 形成在表面22和24的每个部分中的凹部的表面的曲率分别大于凹部的表面远离分段的阳极31和32的曲率大于其他部分的曲率 作为第二电镀表面22和第四电镀表面24之间的边界的部分。因此，从第二电镀表面22和第四镀覆表面24之间的边界部分到与其对应的金属壳体50a的距离 部分被设定为比分别对应于分段阳极31和32的金属壳体50a和50b的其它部分的那些短。

    Copper Foil for Printed Circuit
    23.
    发明申请
    Copper Foil for Printed Circuit 有权
    铜箔用于印刷电路

    公开(公告)号：US20110262764A1

    公开(公告)日：2011-10-27

    申请号：US13129848

    申请日：2009-11-13

    Applicant: Hideta Arai ,  Naoki Higuchi

    Inventor： Hideta Arai ,  Naoki Higuchi

    IPC: B32B15/08 ,  B32B15/01

    CPC classification number: H05K3/384 ,  C25D1/04 ,  C25D3/58 ,  C25D5/00 ,  C25D7/0614 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723

    Abstract: Provided is a copper foil for a printed circuit with an electrodeposited ternary-alloy layer composed of copper, cobalt and nickel formed on a surface of the copper foil, wherein the electrodeposited layer comprises dendritic particles grown on the copper foil surface, and the entire surface of the copper foil is covered with particles having an area as seen from above the copper foil surface of 0.1 to 0.5 μm2 at a density of 1000 particles/10000 μm2 or less, particles exceeding 0.5 μm2 at a density of 100 particles/10000 μm2 or less, and particles less than 0.1 μm2 as the remainder. Roughening particles formed dendritically in a roughening treatment based on copper-cobalt-nickel alloy plating are inhibited from shedding from the copper foil surface, and the phenomenon known as powder falling and uneven treatment are thereby inhibited.

    Abstract translation: 提供一种用于印刷电路的铜箔，其具有形成在铜箔表面上的由铜，钴和镍组成的电沉积三元合金层，其中电沉积层包括在铜箔表面上生长的树枝状颗粒，并且整个表面 的铜箔的表面被覆有从铜箔表面上方观察到的面积为0.1〜0.5μm2的粒子，密度为1000个/10000μm2以下，粒子超过0.5μm2，密度为100个/10000μm2，或 较少，颗粒小于0.1μm2作为其余部分。 基于铜 - 钴 - 镍合金电镀的粗糙化处理中的树脂形成的粗糙粒子被抑制从铜箔表面脱落，从而被抑制粉末落下和不均匀处理的现象。

    TECHNOLOGY FOR THE DEPOSITION OF ELECTRICALLY AND CHEMICALLY ACTIVE LAYERS FOR USE IN BATTERIES, FUEL CELLS AND OTHER ELECTROCHEMICAL DEVICES
    24.
    发明申请
    TECHNOLOGY FOR THE DEPOSITION OF ELECTRICALLY AND CHEMICALLY ACTIVE LAYERS FOR USE IN BATTERIES, FUEL CELLS AND OTHER ELECTROCHEMICAL DEVICES 审中-公开
    用于电池，燃料电池和其他电化学装置的电化学和活性层沉积技术

    公开(公告)号：US20110247936A1

    公开(公告)日：2011-10-13

    申请号：US13082358

    申请日：2011-04-07

    Applicant: Victor Stancovski

    Inventor： Victor Stancovski

    IPC: C25D13/00 ,  B05D3/14 ,  B05D3/06 ,  C25D13/22 ,  B05D1/36

    CPC classification number: C25D5/00 ,  C23C18/1675 ,  C25D5/003 ,  C25D5/006 ,  C25D5/18 ,  C25D5/20 ,  C25D13/22 ,  H01M4/0423 ,  H01M4/0428 ,  H01M4/0438 ,  H01M4/8867 ,  H01M12/06

    Abstract: A process and method is described for the deposition of the enhanced chemical and electrochemical activity layers essential for the operation of a battery, fuel cell or other electrochemical devices like sensors.A precise and well-calibrated combination of agents with specific values, like exterior electric fields (direct current (d.c.), alternative current (a.c.), variable magnetic fields, and acoustic/elastic fields are used in tailoring of interface properties essential for the operation of the device with enhanced properties.This invention describes processes for doping the active interfaces in electrodes, leading to the enhancement of properties and to an increased degree of control via a synergistic combination of (any of the following): direct current (d.c.) field, variable alternative current (a.c.) field, variable acoustic/elastic field, variable magnetic field and a variation of the partial pressure of oxygen and/or other gases in the interior of the electrode deposition reactor.This invention describes processes that achieve a combination of graded functionality and graded porosity ideal for the enhancement of the operation of batteries, fuel cells and electrochemical reactors, characterized by improved figures of merit.

    Abstract translation: 描述了用于沉积电池，燃料电池或其它电化学装置如传感器操作所必需的增强的化学和电化学活性层的方法和方法。 使用具有特定值（例如外部电场（直流），替代电流（ac），可变磁场和声/弹性场）的特定值的精确和精确校准的组合来定制操作所必需的界面特性 本发明描述了用于在电极中掺杂活性界面的方法，其通过（以下任何一种）的协同组合来提高性能和增加的控制程度：直流（dc）场 ，可变替代电流（ac）场，可变声/弹性场，可变磁场以及电极沉积反应器内部的氧气和/或其它气体的分压的变化本发明描述了实现组合 分级功能和分级孔隙度理想用于增强电池，燃料电池和电化学反应器的运行 通过改善品质来表征。

    PROCESS AND APPARATUS FOR ELECTROPLATING SUBSTRATES
    25.
    发明申请
    PROCESS AND APPARATUS FOR ELECTROPLATING SUBSTRATES 审中-公开
    电镀基板的工艺和装置

    公开(公告)号：US20110062028A1

    公开(公告)日：2011-03-17

    申请号：US12883551

    申请日：2010-09-16

    Applicant: Lothar Lippert ,  Stefan Dauwe

    Inventor： Lothar Lippert ,  Stefan Dauwe

    IPC: C25D5/18 ,  C25B9/06

    CPC classification number: C25D5/18 ,  C25D5/00 ,  C25D5/006 ,  C25D5/08 ,  C25D7/126 ,  C25D17/001 ,  C25D21/12 ,  H01L31/022425 ,  Y02E10/50

    Abstract: An apparatus for electroplating one or more surfaces (2,3) on one or more substrates (1), especially solar cells (1a), is described. The apparatus includes an electrochemical coating bath (13), which has a coating tank (12) filled with an electrochemical coating liquid (14). The apparatus also includes a conveying device (15) for transporting the substrate through the coating bath (13), a light source circuit (60) with light sources (64) for irradiating the substrate (1) and an electrolytic cell rectifier circuit (50) for the substrate with anodes (54). The apparatus is characterized by a device for generating synchronous current pulses and light pulses, so that during a time interval between the current pulses the irradiating of the substrate or substrates is interrupted. A process for electrochemical plating of the surface of the substrate or substrates is also described.

    Abstract translation: 描述了用于在一个或多个基板（1），特别是太阳能电池（1a）上电镀一个或多个表面（2,3）的装置。 该设备包括电化学涂层浴（13），其具有填充有电化学涂覆液体（14）的涂料槽（12）。 该设备还包括用于将衬底输送通过涂浴（13）的输送装置（15），具有用于照射衬底（1）的光源（64）和电解池整流电路（50）的光源电路（60） ）用于具有阳极（54）的衬底。 该装置的特征在于用于产生同步电流脉冲和光脉冲的装置，使得在电流脉冲之间的时间间隔期间，中断衬底或衬底的照射。 还描述了用于基板或基板的表面的电化学电镀的方法。

    Method for treating the surface of object and apparatus thereof
    26.
    发明授权
    Method for treating the surface of object and apparatus thereof 失效
    处理物体表面的方法及其装置

    公开(公告)号：US07857952B2

    公开(公告)日：2010-12-28

    申请号：US11981136

    申请日：2007-10-31

    Applicant: Hideo Yoshida ,  Seizo Miyata ,  Masato Sone ,  Nobuyoshi Sato

    Inventor： Hideo Yoshida ,  Seizo Miyata ,  Masato Sone ,  Nobuyoshi Sato

    IPC: C25D17/06

    CPC classification number: B08B3/14 ,  C25D5/00 ,  C25D5/08 ,  C25D17/00 ,  C25D21/04 ,  H01L21/02052 ,  H01L21/2885 ,  H01L21/32134

    Abstract: An apparatus for treating the surface of an object to be treated comprising introducing a surface treatment fluid into a reaction vessel (4) capable of receiving an object, introducing the surface treatment fluid into a separation vessel (14) after the object is subjected to surface treatment, and circulating the surface treatment fluid, from which a contaminant has already been removed, to the reaction vessel (4). At the time of treatment on the surface of the object, a circulation passage for the surface treatment fluid including the reaction vessel (4) is communicated and the surface treatment fluid is constantly circulated through the circulation passage.

    Abstract translation: 一种用于处理待处理物体的表面的装置，包括将表面处理流体引入到能够接收物体的反应容器（4）中，在物体经受表面之后将表面处理流体引入分离容器（14） 处理，并且将已经从其中除去污染物的表面处理流体循环到反应容器（4）。 在物体表面处理时，包括反应容器（4）的表面处理流体的循环通道连通，表面处理流体不断循环通过循环通道。

    Plating analyzing method and apparatus
    28.
    发明授权
    Plating analyzing method and apparatus 失效
    电镀分析方法和装置

    公开(公告)号：US07544280B2

    公开(公告)日：2009-06-09

    申请号：US10946616

    申请日：2004-09-22

    Applicant: Koichi Shimizu

    Inventor： Koichi Shimizu

    IPC: C25D5/00 ,  C25D21/12

    CPC classification number: C25D5/00 ,  C25D21/12

    Abstract: A plating analyzing method is disclosed for analyzing an electroplating system having an anode, a cathode and plating liquid, based on a Laplace's equation. The method comprises the steps of making the Laplace's equation discrete by Finite Volume Method; forming simultaneous equations based on the discrete Laplace's equation; and calculating potential distribution using the simultaneous equations. A plating analyzing apparatus is also disclosed, which comprises a unit for making the Laplace's equation discrete by Finite Volume Method and dividing the system into a plurality of elements; potential calculating unit for forming simultaneous equations based on the discrete Laplace's equation, and calculating potential distribution using the simultaneous equations; and current density calculating unit for calculating current density distribution based on the potential distribution.

    Abstract translation: 公开了一种基于拉普拉斯方程分析具有阳极，阴极和电镀液体的电镀系统的电镀分析方法。 该方法包括通过有限体积法使拉普拉斯方程离散的步骤; 基于离散拉普拉斯方程形成联立方程; 并使用联立方程计算电位分布。 还公开了一种电镀分析装置，其包括用于通过有限体积法分离拉普拉斯方程并将系统分成多个元件的单元; 基于离散拉普拉斯方程形成联立方程的潜在计算单元，并使用联立方程计算电位分布; 以及电流密度计算单元，用于基于所述电位分布来计算电流密度分布。

    Selective shield/material flow mechanism
    29.
    发明授权
    Selective shield/material flow mechanism 有权
    选择性屏蔽/物料流动机制

    公开(公告)号：US07425256B2

    公开(公告)日：2008-09-16

    申请号：US11855507

    申请日：2007-09-14

    Applicant: Ralph A. Barrese ,  Gary Gajdorus ,  Allen H. Hopkins ,  John J. Konrad ,  Robert C. Schaffer ,  Timothy L. Wells

    Inventor： Ralph A. Barrese ,  Gary Gajdorus ,  Allen H. Hopkins ,  John J. Konrad ,  Robert C. Schaffer ,  Timothy L. Wells

    IPC: C25D5/08

    CPC classification number: C25D17/008 ,  C25D5/00 ,  C25D5/003 ,  C25D17/12 ,  C25D21/12 ,  Y10S204/07

    Abstract: An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system. At least one selective shield material flow mechanism is used in a selective shield material flow assembly.

    Abstract translation: 一种用于电镀工件的装置和方法。 该装置通常包括阳极，阴极和选择性阳极屏蔽/材料流组件。 在使用中，将阳极和阴极两者浸入溶液中，阴极用于支撑工件。 在电镀过程中，阳极和阴极产生从阳极向阴极发出的电场，以产生相应的电流，以将电镀材料沉积在工件上。 选择性屏蔽/材料流动组件位于阳极和阴极之间，并形成多个可调开口。 这些开口具有在电镀过程中可调节的尺寸，用于选择性地和可控地调节通过选择性屏蔽/材料流组件的电流量以及电镀材料在工件上的分布。 选择性屏蔽/材料流动组件也可以与无电镀系统一起使用。 在选择性屏蔽材料流动组件中使用至少一种选择性屏蔽材料流动机构。

    Method to make superior soft (low Hk), high moment magnetic film and its application in writer heads
    30.
    发明申请
    Method to make superior soft (low Hk), high moment magnetic film and its application in writer heads 审中-公开
    制造优质软（低Hk），高力矩磁膜及其在写入头中的应用的方法

    公开(公告)号：US20080197021A1

    公开(公告)日：2008-08-21

    申请号：US11707826

    申请日：2007-02-16

    Applicant: Xiaomin Liu ,  Cherng-Chyi Han ,  Feiyue Li

    Inventor： Xiaomin Liu ,  Cherng-Chyi Han ,  Feiyue Li

    IPC: C25D5/50

    CPC classification number: C25D3/562 ,  C25D5/00 ,  C25D5/006 ,  G11B5/3163 ,  H01F41/26

    Abstract: A process sequence for forming a soft magnetic layer having Hce and Hch of ≦2 Oe, Hk≦5 Oe, and Bs of ≧24 kG is disclosed. A CoFe or CoFe alloy is electroplated in a 10O C to 25O C. bath (pH 2 to 3) containing Co+2 and Fe+2 ions in addition to boric acid and one or more aryl sulfinate salts to promote magnetic softness in the deposited layer. Peak current density is 30 to 60 mA/cm2. A two step magnetic anneal process is performed to further improve softness. An easy axis anneal is followed by a hard axis anneal or vice versa. In an embodiment where the magnetic layer is a pole layer in a write head, the temperature is maintained in a 180O C to 250O C range and the applied magnetic field is kept a 300 Oe or below to prevent degradation of an adjacent read head.

    Abstract translation: 公开了用于形成具有<= 2Oe，Hk <= 5Oe，Bs> = 24kG的Hce和Hch的软磁性层的工艺顺序。 CoFe或CoFe合金电镀在10欧姆至25微米的范围内。 除了硼酸和一种或多种芳基亚磺酸盐之外，还含有Co 2+，Fe 2+和Fe 2+ 2+的浴（pH 2至3）以促进沉积层中的磁性 。 峰值电流密度为30〜60mA / cm 2。 进行两步磁退火处理以进一步提高柔软度。 易轴退火之后是硬轴退火，反之亦然。 在磁性层是写入头中的极层的实施例中，温度保持在180℃至250℃范围内，施加的磁场为 保持300 Oe或以下，以防止相邻读头的退化。

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