公开(公告)号：US07425256B2

公开(公告)日：2008-09-16

申请号：US11855507

申请日：2007-09-14

申请人： Ralph A. Barrese ,  Gary Gajdorus ,  Allen H. Hopkins ,  John J. Konrad ,  Robert C. Schaffer ,  Timothy L. Wells

发明人： Ralph A. Barrese ,  Gary Gajdorus ,  Allen H. Hopkins ,  John J. Konrad ,  Robert C. Schaffer ,  Timothy L. Wells

IPC分类号： C25D5/08

CPC分类号： C25D17/008 ,  C25D5/00 ,  C25D5/003 ,  C25D17/12 ,  C25D21/12 ,  Y10S204/07

摘要： An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system. At least one selective shield material flow mechanism is used in a selective shield material flow assembly.

摘要翻译： 一种用于电镀工件的装置和方法。 该装置通常包括阳极，阴极和选择性阳极屏蔽/材料流组件。 在使用中，将阳极和阴极两者浸入溶液中，阴极用于支撑工件。 在电镀过程中，阳极和阴极产生从阳极向阴极发出的电场，以产生相应的电流，以将电镀材料沉积在工件上。 选择性屏蔽/材料流动组件位于阳极和阴极之间，并形成多个可调开口。 这些开口具有在电镀过程中可调节的尺寸，用于选择性地和可控地调节通过选择性屏蔽/材料流组件的电流量以及电镀材料在工件上的分布。 选择性屏蔽/材料流动组件也可以与无电镀系统一起使用。 在选择性屏蔽材料流动组件中使用至少一种选择性屏蔽材料流动机构。

公开(公告)号：US07288177B2

公开(公告)日：2007-10-30

申请号：US10813351

申请日：2004-03-30

申请人： Ralph A. Barrese ,  Gary Gajdorus ,  Allen H. Hopkins ,  John J. Konrad ,  Robert C. Schaffer ,  Timothy L. Wells

发明人： Ralph A. Barrese ,  Gary Gajdorus ,  Allen H. Hopkins ,  John J. Konrad ,  Robert C. Schaffer ,  Timothy L. Wells

IPC分类号： C25D5/00 ,  C25D5/08 ,  C25D7/12 ,  C25D17/00

CPC分类号： C25D17/008 ,  C25D5/00 ,  C25D5/003 ,  C25D17/12 ,  C25D21/12 ,  Y10S204/07

摘要： An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system. At least one selective shield material flow mechanism is used in a selective shield material flow assembly.

摘要翻译： 一种用于电镀工件的装置和方法。 该装置通常包括阳极，阴极和选择性阳极屏蔽/材料流组件。 在使用中，将阳极和阴极两者浸入溶液中，阴极用于支撑工件。 在电镀过程中，阳极和阴极产生从阳极向阴极发出的电场，以产生相应的电流，以将电镀材料沉积在工件上。 选择性屏蔽/材料流动组件位于阳极和阴极之间，并形成多个可调开口。 这些开口具有在电镀过程中可调节的尺寸，用于选择性地和可控地调节通过选择性屏蔽/材料流组件的电流量以及电镀材料在工件上的分布。 选择性屏蔽/材料流动组件也可以与无电镀系统一起使用。 在选择性屏蔽材料流动组件中使用至少一种选择性屏蔽材料流动机构。

公开(公告)号：US06746578B2

公开(公告)日：2004-06-08

申请号：US09871557

申请日：2001-05-31

申请人： Ralph A. Barrese ,  Gary Gajdorus ,  Allen H. Hopkins ,  John J. Konrad ,  Robert C. Schaffer ,  Timothy L. Wells

发明人： Ralph A. Barrese ,  Gary Gajdorus ,  Allen H. Hopkins ,  John J. Konrad ,  Robert C. Schaffer ,  Timothy L. Wells

IPC分类号： C25D1700

CPC分类号： C25D17/008 ,  C25D5/00 ,  C25D5/003 ,  C25D17/12 ,  C25D21/12 ,  Y10S204/07

摘要： An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system. At least one selective shield material flow mechanism is used in a selective shield material flow assembly.

公开(公告)号：US07084014B2

公开(公告)日：2006-08-01

申请号：US10679302

申请日：2003-10-07

申请人： Timothy Antesberger ,  James W. Fuller, Jr. ,  John J. Konrad ,  John Kresge ,  Stephen Krasniak ,  Timothy L. Wells

发明人： Timothy Antesberger ,  James W. Fuller, Jr. ,  John J. Konrad ,  John Kresge ,  Stephen Krasniak ,  Timothy L. Wells

IPC分类号： H01L21/82

CPC分类号： H01L21/4846 ,  H01L23/49838 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/242 ,  H05K3/28 ,  H05K2203/107 ,  H05K2203/175 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of making a circuitized substrate in which the substrate's commoning bar, used during the plating of the circuitry on the substrate, is terminated from the various conductors using a laser. In a preferred embodiment, the laser acts through a dielectric layer (soldermask) which is applied over the circuitry, including the commoning bar and connected parts. The laser may also be used to expose selected ones of the circuit's other parts, including various pads used to accommodate a wirebond (from a chip) and also solder balls for eventual placement of the substrate on a larger circuit board.

摘要翻译： 制造电路化基板的方法，其中在基板上的电路的电镀期间使用的基板的共用条，使用激光从各种导体终止。 在优选实施例中，激光器通过介电层（焊接掩模）进行作用，该电介质层被施加在电路上，包括共用条和连接部分。 激光器还可以用于暴露电路的其他部分中的选定的部分，包括用于容纳引线键（来自芯片）的各种焊盘以及用于最终将衬底放置在较大电路板上的焊球。

公开(公告)号：US07169313B2

公开(公告)日：2007-01-30

申请号：US11128272

申请日：2005-05-13

申请人： Norman A. Card ,  Robert D. Edwards ,  John J. Konrad ,  Roy H. Magnuson ,  Timothy L. Wells ,  Michael Wozniak

发明人： Norman A. Card ,  Robert D. Edwards ,  John J. Konrad ,  Roy H. Magnuson ,  Timothy L. Wells ,  Michael Wozniak

IPC分类号： H01B13/00 ,  H01K3/10

CPC分类号： H05K3/427 ,  H05K3/108 ,  H05K3/382 ,  H05K3/429 ,  H05K2203/0353 ,  H05K2203/1476 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A method of plating a circuit pattern on a substrate to produce a circuitized substrate (e.g., a printed circuit board) in which a dual step metallurgy application process is used in combination with a dual step photo-resist removal process. Thru-holes are also possible, albeit not required.

摘要翻译： 将电路图案电镀在基板上以制造其中双步骤冶金施加工艺与双步骤光刻胶去除工艺结合使用的电路化基板（例如印刷电路板）的方法。 通孔也是可以的，尽管不是必需的。

公开(公告)号：US07091066B2

公开(公告)日：2006-08-15

申请号：US11259043

申请日：2005-10-27

申请人： Timothy Antesberger ,  James W. Fuller, Jr. ,  John J. Konrad ,  John Kresge ,  Stephen Krasniak ,  Timothy L. Wells

发明人： Timothy Antesberger ,  James W. Fuller, Jr. ,  John J. Konrad ,  John Kresge ,  Stephen Krasniak ,  Timothy L. Wells

IPC分类号： H01L21/82

CPC分类号： H01L21/4846 ,  H01L23/49838 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/242 ,  H05K3/28 ,  H05K2203/107 ,  H05K2203/175 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of making a circuitized substrate in which a commoning bar, used during the plating of the circuitry on the substrate and coupled to a second set of conductors which in turn are coupled to a first set of conductors, is terminated from the second set of conductors.

摘要翻译： 一种制造电路化基板的方法，其中在基板上的电路的电镀过程中使用并耦合到第二组导体的公共条被连接到第一组导体，该第二组导体被连接到第二组导体 导体

公开(公告)号：US06931722B2

公开(公告)日：2005-08-23

申请号：US10395944

申请日：2003-03-24

申请人： Edward L. Arrington ,  Anilkumar C. Bhatt ,  Edmond O. Fey ,  Kevin T. Knadle ,  John J. Konrad ,  Joseph A Kotylo ,  Jeffrey McKeveny ,  Jose A. Rios ,  Amit K. Sarkhel ,  Andrew M. Seman ,  Timothy L. Wells

发明人： Edward L. Arrington ,  Anilkumar C. Bhatt ,  Edmond O. Fey ,  Kevin T. Knadle ,  John J. Konrad ,  Joseph A Kotylo ,  Jeffrey McKeveny ,  Jose A. Rios ,  Amit K. Sarkhel ,  Andrew M. Seman ,  Timothy L. Wells

IPC分类号： H05K3/24 ,  H05K3/28 ,  H05K3/34 ,  H05K3/42 ,  H05K3/02

CPC分类号： H05K3/243 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/3473 ,  H05K3/42 ,  H05K2201/0391 ,  H05K2203/0315 ,  H05K2203/0574 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A method of fabricating a printed circuit device including an electrically insulating substrate, and first, second, and third sets of conductors formed on a top surface of the substrate is disclosed. The method includes forming an oxide layer on the set of second conductors; forming a solder mask on the oxide layer; forming a composite layer on the first set of conductors; and forming a solder layer on at least a portion of the third set of conductors.

摘要翻译： 公开了一种制造印刷电路器件的方法，该印刷电路器件包括电绝缘衬底以及形成在衬底顶表面上的第一组，第二组和第三组导体。 该方法包括在第二导体组上形成氧化物层; 在氧化物层上形成焊料掩模; 在第一组导体上形成复合层; 以及在所述第三组导体的至少一部分上形成焊料层。

公开(公告)号：US06586683B2

公开(公告)日：2003-07-01

申请号：US09844814

申请日：2001-04-27

申请人： Edward L. Arrington ,  Anilkumar C. Bhatt ,  Edmond O. Fey ,  Kevin T. Knadle ,  John J. Konrad ,  Joseph A. Kotylo ,  Jeffrey McKeveny ,  Jose A. Rios ,  Amit K. Sarkhel ,  Andrew M. Seman ,  Timothy L. Wells

发明人： Edward L. Arrington ,  Anilkumar C. Bhatt ,  Edmond O. Fey ,  Kevin T. Knadle ,  John J. Konrad ,  Joseph A. Kotylo ,  Jeffrey McKeveny ,  Jose A. Rios ,  Amit K. Sarkhel ,  Andrew M. Seman ,  Timothy L. Wells

IPC分类号： H05K103

CPC分类号： H05K3/243 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/3473 ,  H05K3/42 ,  H05K2201/0391 ,  H05K2203/0315 ,  H05K2203/0574 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A method of fabricating a printed circuit device including an electrically insulating substrate, and first, second, and third sets of conductors formed on a top surface of the substrate is disclosed. The method includes forming an oxide layer on the set of second conductors; forming a solder mask on the oxide layer; forming a composite layer on the first set of conductors; and forming a solder layer on at least a portion of the third set of conductors.

公开(公告)号：US07163847B2

公开(公告)日：2007-01-16

申请号：US11258092

申请日：2005-10-26

申请人： Timothy Antesberger ,  James W. Fuller, Jr. ,  John J. Konrad ,  John Kresge ,  Stephen Krasniak ,  Timothy L. Wells

发明人： Timothy Antesberger ,  James W. Fuller, Jr. ,  John J. Konrad ,  John Kresge ,  Stephen Krasniak ,  Timothy L. Wells

IPC分类号： H01L21/82

CPC分类号： H01L21/4846 ,  H01L23/49838 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/242 ,  H05K3/28 ,  H05K2203/107 ,  H05K2203/175 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of making a circuitized substrate in which the substrate's commoning bar, used during the plating of the circuitry on the substrate, is terminated from the various conductors using a laser. In a preferred embodiment, the laser acts through a dielectric layer (soldermask) which is applied over the circuitry, including the commoning bar and connected parts. The laser may also be used to expose selected ones of the circuit's other parts, including various pads used to accommodate a wirebond (from a chip) and also solder balls for eventual placement of the substrate on a larger circuit board.

摘要翻译： 制造电路化基板的方法，其中在基板上的电路的电镀期间使用的基板的共用条，使用激光从各种导体终止。 在优选实施例中，激光器通过介电层（焊接掩模）进行作用，该电介质层被施加在电路上，包括共用条和连接部分。 激光器还可以用于暴露电路的其他部分中的选定的部分，包括用于容纳引线键（来自芯片）的各种焊盘以及用于最终将衬底放置在较大电路板上的焊球。

公开(公告)号：US07007378B2

公开(公告)日：2006-03-07

申请号：US10317329

申请日：2002-12-12

申请人： John G. Gaudiello ,  James D. Herard ,  John J. Konrad ,  Jeffrey McKeveny ,  Timothy L. Wells

发明人： John G. Gaudiello ,  James D. Herard ,  John J. Konrad ,  Jeffrey McKeveny ,  Timothy L. Wells

IPC分类号： H01R9/00

CPC分类号： H05K3/244 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

摘要： A process for manufacturing a land grid array connector for a printed wiring board is disclosed. The process does not require electroplating precious metal overlays. Therefore, no commoning bar is required. Another benefit of the invention includes a connector design using only a flash, soft gold application in the outer surface of the connector. Physical hardness and durability are derived from a thin palladium layer lying beneath the flash gold layer.

摘要翻译： 公开了一种制造用于印刷电路板的焊盘格栅阵列连接器的方法。 该过程不需要电镀贵金属覆盖层。 因此，不需要通用条。 本发明的另一个优点包括仅在连接器的外表面中使用闪光灯，软金应用的连接器设计。 物理硬度和耐久性源自位于闪金属层下面的薄钯层。