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    Circuit board manufacturing method and circuit board
    21.
    发明授权
    Circuit board manufacturing method and circuit board 有权
    电路板制造方法和电路板

    公开(公告)号：US07679004B2

    公开(公告)日：2010-03-16

    申请号：US10598524

    申请日：2005-03-02

    申请人： Katsuya Fukase ,  Toyoaki Sakai ,  Munetoshi Irisawa ,  Toyokazu Komuro ,  Yasuo Kaneda ,  Masanori Natsuka ,  Wakana Aizawa

    发明人： Katsuya Fukase ,  Toyoaki Sakai ,  Munetoshi Irisawa ,  Toyokazu Komuro ,  Yasuo Kaneda ,  Masanori Natsuka ,  Wakana Aizawa

    IPC分类号： H01R12/04 ,  H05K1/00

    CPC分类号： H05K3/064 ,  H05K1/116 ,  H05K3/0094 ,  H05K3/061 ,  H05K3/065 ,  H05K3/108 ,  H05K3/421 ,  H05K3/427 ,  H05K2201/09381 ,  H05K2201/09563 ,  H05K2201/09581 ,  H05K2201/098 ,  H05K2203/0517 ,  H05K2203/0577 ,  H05K2203/0582 ,  H05K2203/1184 ,  H05K2203/1394

    摘要： As means for solving a problem of a positional shift of a land and a hole which is caused by an alignment in the formation of an etching resist layer and a plated resist layer in a method of manufacturing a circuit board, there are provided a method of manufacturing a circuit board including the steps of forming a first resin layer on a surface of an insulating substrate having a conductive layer on the surface and an internal wall of a through hole or/and a non-through hole, forming a second resin layer which is insoluble or slightly soluble in a developing solution for the first resin layer on the first resin layer provided on the surface conductive layer, and removing the first resin layer provided over the hole with the developing solution for the first resin layer, and a method of manufacturing a circuit board including the step of uniformly charging a surface of the first resin layer to induce a potential difference to the first resin layer provided over the hole and the first resin layer provided on the surface conductive layer before forming the second resin layer. Moreover, there is provided a circuit board having a hole with a small positional shift and high precision.

    摘要翻译： 作为在电路基板的制造方法中解决在形成抗蚀剂层和电镀抗蚀剂层时的取向引起的焊盘和孔的位置偏移的问题的方法，提供了一种方法， 制造电路板，包括以下步骤：在表面上具有导电层的绝缘基板的表面上形成第一树脂层和通孔或/或非通孔的内壁，形成第二树脂层，所述第二树脂层 在设置在表面导电层上的第一树脂层上的第一树脂层的显影液中不溶或微溶，用第一树脂层的显影液除去设在孔上的第一树脂层， 制造电路板，包括对第一树脂层的表面均匀充电以对设置在孔上的第一树脂层引起电位差的步骤， 在形成第二树脂层之前，在表面导电层上设置阴极层。 此外，提供一种电路板，其具有位置偏移小且精度高的孔。

    Magnetically patterning conductors
    22.
    发明授权
    Magnetically patterning conductors 失效
    磁性图形导体

    公开(公告)号：US06676843B2

    公开(公告)日：2004-01-13

    申请号：US09843484

    申请日：2001-04-26

    申请人： Richard H Henze

    发明人： Richard H Henze

    IPC分类号： B44C122

    CPC分类号： C23F4/00 ,  C23F1/02 ,  H01L2224/11 ,  H05K3/065

    摘要： A method for magnetic patterning of conductors includes imparting a pattern of magnetization into a magnetic material and depositing a substance onto the magnetic material that preferentially gathers according to the pattern in the magnetic material. A set of conductors are then formed such that the substance controls a pattern for the conductors.

    摘要翻译： 导体的磁图案化方法包括将磁化图案赋予磁性材料，并将物质沉积到根据磁性材料中的图案优先收集的磁性材料上。 然后形成一组导体，使得物质控制导体的图案。

    Process for producing printed wiring board
    23.
    发明授权
    Process for producing printed wiring board 失效
    印刷线路板生产工艺

    公开(公告)号：US06645685B2

    公开(公告)日：2003-11-11

    申请号：US09945807

    申请日：2001-09-05

    申请人： Masakazu Takata ,  Hidetoshi Miura ,  Tamotsu Horiuchi ,  Munetoshi Irisawa ,  Masanori Natsuka ,  Kenji Tsuda ,  Kazuchiyo Takaoka ,  Kenji Hyodo

    发明人： Masakazu Takata ,  Hidetoshi Miura ,  Tamotsu Horiuchi ,  Munetoshi Irisawa ,  Masanori Natsuka ,  Kenji Tsuda ,  Kazuchiyo Takaoka ,  Kenji Hyodo

    IPC分类号： G03G1305

    CPC分类号： H05K3/065 ,  G03G13/26 ,  G03G13/28 ,  G03G13/283 ,  G03G13/286

    摘要： Disclosed is disclosed a process for producing a printed wiring board which comprises the steps of: a) exposing a wiring board having at least one photoconductive layer in which its chargeability is changed by light exposure on at least one surface of a conductive support which comprises an insulating substrate and at least one metal conductive layer provided at least one surface thereof through a resist pattern; b) charging the photoconductive layer to form an electrostatic latent image; c) forming a toner image on the photoconductive layer by toner developing treatment; d) removing a portion of the photoconductive layer to which no toner is attached by dissolution to form a resist image; and e) removing a portion of the metal conductive layer other than a portion where the resist image is formed by etching.

    摘要翻译： 公开了一种制造印刷电路板的方法，该方法包括以下步骤：a）将具有至少一个光电导层的布线板暴露在导电载体的至少一个表面上，其中其电荷变化被改变，其中包括 绝缘基板和至少一个金属导电层通过抗蚀剂图案提供至少一个表面; b）对光电导层充电以形成静电潜像; c）通过调色剂显影处理在光电导层上形成调色剂图像; d） 通过溶解去除不附着调色剂的光电导层的一部分以形成抗蚀剂图像; 并且除去除了通过蚀刻形成抗蚀剂图像的部分之外的金属导电层的一部分。

    Method for patterning a substrate
    26.
    发明授权
    Method for patterning a substrate 失效
    图案化基板的方法

    公开(公告)号：US5196286A

    公开(公告)日：1993-03-23

    申请号：US387941

    申请日：1989-07-31

    申请人： Roger D. Watkins

    发明人： Roger D. Watkins

    IPC分类号： G03G13/22 ,  H05K3/06

    CPC分类号： G03G13/22 ,  H05K3/065 ,  H05K2203/0517 ,  Y10S430/102

    摘要： Disclosed is a method for patterning a substrate. A laminate of an electrically non-conductive material, an electrically conductive material, and an additional electrically non-conductive material is xerographically processed so as to leave a toner image formed upon the surface of one of the non-conductives. The non-conducive and conductive are successively removed chemically in those areas not coated by the toner, leaving a conductive pattern replica of the original toner image. Subsequent processing yields an exposed conductive pattern overlaying a non-conductive supporting substrate. Xerographic processes includes photocopying and xerographic laser imaging from a low power laser printer. The laminate may be formed in a single step or may be the product of a commercial two layer laminate coated by a standard painting or sealing process.

    摘要翻译： 公开了一种用于图案化衬底的方法。 非导电材料，导电材料和附加的非导电材料的层压体被印刷加工，以便留下形成在非导电体之一的表面上的调色剂图像。 在没有被调色剂涂覆的那些区域中，非导电和导电性被连续地去除，留下原始调色剂图像的导电图案复制品。 随后的处理产生覆盖非导电支撑衬底的暴露的导电图案。 静电复印过程包括来自低功率激光打印机的复印和静电激光成像。 层压体可以在单个步骤中形成，或者可以是通过标准涂覆或密封工艺涂覆的商业二层层压体的产物。

    Transfer roller
    28.
    发明授权
    Transfer roller 失效
    转印辊

    公开(公告)号：US4763157A

    公开(公告)日：1988-08-09

    申请号：US091617

    申请日：1987-08-31

    申请人： David P. Bujese

    发明人： David P. Bujese

    IPC分类号： G03G15/16 ,  H05K3/00 ,  H05K3/06

    CPC分类号： G03G15/1625 ,  G03G15/163 ,  H05K3/0079 ,  H05K3/065

    摘要： Apparatus for the electrostatic transfer of a developed latent image from a master to a conductive receiving surface is provided and utilizes a transfer roller that traverses the carrier web to bring the master that is attached to the web adjacent to, but not in contact with, the conductive receiving surface.

    摘要翻译： 提供了用于将显影的潜像从母版静电转印到导电接收表面的装置，并且使用穿过载体网的转印辊，以使附接到幅材的母版与所述幅材相邻但不与其接触 导电接收面。

    Method of imaging resist patterns of high resolution on the surface of a conductor
    29.
    发明授权
    Method of imaging resist patterns of high resolution on the surface of a conductor 失效
    在导体表面上成像高分辨率抗蚀剂图案的方法

    公开(公告)号：US4661431A

    公开(公告)日：1987-04-28

    申请号：US848669

    申请日：1986-04-04

    申请人： David P. Bujese ,  Peter J. Calabrese ,  Gary W. Schmidt ,  Abelardo M. Santos

    发明人： David P. Bujese ,  Peter J. Calabrese ,  Gary W. Schmidt ,  Abelardo M. Santos

    IPC分类号： G03G9/12 ,  G03G13/26 ,  G03G15/16 ,  G03G15/22 ,  H01L21/027 ,  H01L21/30 ,  H05K3/06 ,  G03G13/16 ,  G03G13/22

    CPC分类号： H05K3/065 ,  G03G15/10 ,  G03G15/1625 ,  G03G15/225 ,  G03G15/6585 ,  H05K2203/0517 ,  H05K2203/0537 ,  H05K3/1266

    摘要： An electrostatic latent image in a desired pattern is formed on an electrostatically imageable surface and toned with a liquid toner to form a toner image on the surface. The toner image is then transferred while still wet to a transfer sheet and then to the surface of a conductor, or the toner image may be transferred directly to the surface of a conductor without a transfer sheet, such direct transfer being preferred. The toner image is then fused to the conductor surface to provide an etch resist pattern of high resolution on the conductor surface. The conductor may then be etched to form a high density printed circuit. In the direct transfer method a nonpolar insulating solvent-carrier is applied to the surface of the conductor and the electrostatically imageable surface.

    摘要翻译： 将所需图案的静电潜像形成在可静电成像的表面上并用液体调色剂调色以在表面上形成调色剂图像。 然后将调色剂图像仍然湿润地转印到转印纸上，然后转印到导体的表面，或者调色剂图像可以直接转印到没有转印纸的导体的表面上，这样的直接转印是优选的。 然后将调色剂图像熔合到导体表面，以在导体表面上提供高分辨率的蚀刻抗蚀剂图案。 然后可以对导体进行蚀刻以形成高密度印刷电路。 在直接转印方法中，将非极性绝缘溶剂载体施加到导体表面和静电成像表面。