Sealing materials for electrical/electronic appliance
    22.
    发明申请
    Sealing materials for electrical/electronic appliance 审中-公开
    电气/电子设备密封材料

    公开(公告)号:US20050031858A1

    公开(公告)日:2005-02-10

    申请号:US10474246

    申请日:2002-02-20

    Abstract: A shaped sealing material for electrical/electronic appliances which is free from dust particle adhesion thereto and is easy to handle although it is a sealing material obtained by forming a pressure-sensitive adhesive layer on a foam. A layer comprising a pressure-sensitive adhesive composition having a storage modulus of 20 N/cm2 or higher is formed on a surface of a finely cellular foam to constitute a sealing material having an adhesive force of 5.0 N/20 mm width or higher.

    Abstract translation: 一种用于电气/电子设备的成形密封材料,其没有灰尘颗粒附着在其上并且易于处理,尽管它是通过在泡沫上形成压敏粘合剂层而获得的密封材料。 包含具有20N / cm 2或更高的储能模量的压敏粘合剂组合物的层形成在细微泡沫的表面上,以构成粘合力为5.0N / 20mm宽的密封材料或 更高。

    Anisotropic conductive adhesive compositions
    28.
    发明授权
    Anisotropic conductive adhesive compositions 失效
    各向异性导电粘合剂组合物

    公开(公告)号:US5840215A

    公开(公告)日:1998-11-24

    申请号:US768055

    申请日:1996-12-16

    Abstract: A novel thermally reworkable anisotropic conductive adhesive composition for attaching a semiconductor device to a substrate is provided. The composition comprises (a) a thermally reworkable crosslinked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and (b) at least one electrically conductive material present in an effective amount to provide a conducting medium in only one direction.

    Abstract translation: 提供了一种用于将半导体器件附接到衬底的新颖的可热再加工的各向异性导电粘合剂组合物。 组合物包含(a)通过使至少一种官能度大于1的亲二烯体和至少一种2,5-二烷基取代的含呋喃的聚合物反应制备的热可再加工交联树脂,和(b)至少一种导电材料 有效量,仅在一个方向上提供导电介质。

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