公开(公告)号：US10107488B2

公开(公告)日：2018-10-23

申请号：US15179557

申请日：2016-06-10

申请人： Chang Hwan Song

发明人： Chang Hwan Song ,  Sung Hwan Ryu

IPC分类号： F21V29/83 ,  F21V19/00 ,  F21V29/87 ,  F21V5/00 ,  F21V21/14 ,  F21S2/00 ,  G03B15/05 ,  F21V25/12 ,  F21V14/00 ,  F21V23/00 ,  H01K5/00 ,  F21V29/89 ,  F21V11/16 ,  F21V15/00 ,  F21V23/02 ,  G03B15/06 ,  B82Y30/00 ,  F21W131/406 ,  F21Y113/00 ,  F21Y115/10 ,  F21Y105/00 ,  H05K1/02 ,  F21Y105/16

摘要： Provided is a flexible LED light source panel including: a flexible LED module in which a plurality of LEDs is disposed in an array form on a flexible circuit board; a protective sheet stacked on the flexible LED module and diffusing light from the LEDs; a heat conduction sheet disposed under the flexible LED module; a heat radiation sheet disposed under the heat conduction sheet, made of fireproof fiber, and coated with a carbon nano tube molecule having a grid or vertical structure; and a light source guide having a quadrilateral shape.

公开(公告)号：US09951938B2

公开(公告)日：2018-04-24

申请号：US14062317

申请日：2013-10-24

申请人： David C. Dudik ,  Joshua I. Rintamaki ,  Gary R. Allen ,  Glenn H. Kuenzler

发明人： David C. Dudik ,  Joshua I. Rintamaki ,  Gary R. Allen ,  Glenn H. Kuenzler

IPC分类号： F21V29/00 ,  F21V29/74 ,  F21V29/506 ,  F21V29/75 ,  F21V29/76 ,  F21V29/77 ,  F21V29/80 ,  F21K9/232 ,  F21V29/85 ,  F21V29/87 ,  F21Y115/10

CPC分类号： F21V29/74 ,  F21K9/135 ,  F21K9/232 ,  F21V29/506 ,  F21V29/75 ,  F21V29/76 ,  F21V29/77 ,  F21V29/80 ,  F21V29/86 ,  F21V29/87 ,  F21Y2115/10

摘要： A light emitting apparatus comprising an at least substantially omnidirectional light assembly including an LED-based light source within a light-transmissive envelope. Electronics configured to drive the LED-based light source, the electronics being disposed within a base having a blocking angle no larger than 45°. A plurality of heat dissipation elements (such as fins) in thermal communication with the base and extending adjacent the envelope.

公开(公告)号：US09885469B2

公开(公告)日：2018-02-06

申请号：US15153166

申请日：2016-05-12

申请人： BJB GmbH & Co. KG

发明人： Olaf Baumeister ,  Detlef Scholz

IPC分类号： F24C15/00 ,  A21B3/10 ,  H05B6/64 ,  F21V29/503 ,  F21V29/77 ,  F21V29/85 ,  F21V29/87 ,  F21V33/00 ,  F21V29/15 ,  F21Y115/10 ,  F21W131/307

CPC分类号： F21V29/503 ,  A21B3/10 ,  F21V29/15 ,  F21V29/773 ,  F21V29/85 ,  F21V29/87 ,  F21V33/0044 ,  F21W2131/307 ,  F21Y2115/10 ,  F24C15/008 ,  H05B6/6444

摘要： An oven light including an attachment sleeve which is attachable in a recess of a cooking cavity wall; a light permeable cover which closes the recess of the cooking cavity wall; an illuminant which is arranged behind the light permeable cover and whose emitted light is used for illuminating the cooking cavity, wherein the illuminant is formed by at least one LED which emits light in a light cone (K), wherein the LED is arranged on a cooling element which dissipates operating heat of the LED, wherein a heat barrier is arranged between the cover and the LED and protects the LED from a cooking temperature, wherein the light cone penetrates an arrangement plane of the heat barrier, characterized in that the heat barrier includes at least one in particular light permeable heat shield with an opening through which light of the LED propagates in a direction towards the cover.

公开(公告)号：US09791140B2

公开(公告)日：2017-10-17

申请号：US14547644

申请日：2014-11-19

申请人： Molex, LLC

发明人： Victor Zaderej ,  Daniel B. McGowan ,  Michael C. Picini

IPC分类号： F21V29/00 ,  F21V29/71 ,  F21V29/77 ,  F21K9/00 ,  F21V29/505 ,  F21V29/70 ,  F21V29/80 ,  F21V29/83 ,  F21V29/85 ,  F21V29/87 ,  F21V29/89 ,  F21K9/23 ,  F21V29/74 ,  F21V13/04 ,  F21V17/00 ,  F21Y115/10

CPC分类号： F21V29/71 ,  F21K9/00 ,  F21K9/23 ,  F21V13/04 ,  F21V17/005 ,  F21V29/505 ,  F21V29/70 ,  F21V29/713 ,  F21V29/717 ,  F21V29/74 ,  F21V29/77 ,  F21V29/773 ,  F21V29/80 ,  F21V29/83 ,  F21V29/85 ,  F21V29/87 ,  F21V29/89 ,  F21Y2101/02 ,  F21Y2115/10 ,  Y10S362/80

摘要： An LED array is mounted on a base that is thermally coupled to a heat spreader. At least one aperture is provided between the support area and an edge of the heat spreader. The heat spreader may be coupled to a thermal pad which has sufficient thermal conductivity and is sufficiently thin to allow the thermal resistivity between the heat spreader and a corresponding heat sink to be below a predetermined value.

公开(公告)号：US20170275445A1

公开(公告)日：2017-09-28

申请号：US15467164

申请日：2017-03-23

申请人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

发明人： Daigo YAMASHINA ,  Shuhei UCHIYAMA ,  Satoru YAMAUCHI

IPC分类号： C08L33/00 ,  C09D133/00 ,  F21V29/87 ,  G02B5/02 ,  G02B1/04 ,  H01L33/58 ,  C09D7/12

CPC分类号： C08L33/00 ,  C08K5/54 ,  C08L33/10 ,  C08L33/12 ,  C08L2203/20 ,  C08L2205/025 ,  C08L2205/14 ,  C08L2205/22 ,  C09D7/69 ,  C09D7/70 ,  C09D133/00 ,  F21V3/0625 ,  F21V3/10 ,  F21V9/00 ,  F21V9/02 ,  F21V9/04 ,  F21V9/06 ,  F21V29/87 ,  F21Y2115/10 ,  G02B1/04 ,  G02B5/0242 ,  G02B5/0278 ,  H01L25/0753 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L2933/0091 ,  C08L33/08

摘要： A light diffuser includes: a thermoplastic resin base which has a thermal expansion coefficient of at least 4×10−5/K and at most 8×10−5/K; and a light diffusion layer which is disposed on a surface of the thermoplastic resin base and includes an acrylic resin film and an acrylic resin particle, the acrylic resin film including one or more acrylic resins having a glass transition temperature of at least 30° C. and at most 50° C., the acrylic resin particle being included in the acrylic resin film and having an average particle size of at least 1 μm and at most 15 μm.

公开(公告)号：US09622382B2

公开(公告)日：2017-04-11

申请号：US13877752

申请日：2011-09-27

申请人： Adrien Gasse ,  Pascal Revirand

发明人： Adrien Gasse ,  Pascal Revirand

IPC分类号： H05K7/20 ,  H01L23/36 ,  H01L21/48 ,  H01L23/367 ,  H01L23/373 ,  H05K3/30 ,  F21V29/87 ,  F21V29/71 ,  F21Y115/10

CPC分类号： H05K7/2039 ,  F21V29/717 ,  F21V29/87 ,  F21Y2115/10 ,  H01L21/4882 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K3/30 ,  Y10T29/4913 ,  H01L2924/00

摘要： A heat-sink device intended for at least one electronic component (12), includes: a heat-sink; a substrate (11) for the at least one electronic component (12), said substrate covering the heat-sink; and thermal coupling provided between the substrate and the heat-sink and made from a material different from that of the heat-sink. The heat-sink comprises of a set of independent fins (10), and the thermal-coupling (13) is made from a heat-conductive polymer material and also serve as mechanical coupling between the substrate (11) and the fins (10).

公开(公告)号：US20160178186A1

公开(公告)日：2016-06-23

申请号：US14893146

申请日：2014-05-26

申请人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

发明人： Tomokazu KUSUNOKI ,  Hiroyoshi YODEN ,  Yuki KOTANI ,  Ryusuke KOTERA

IPC分类号： F21V29/87 ,  F21V29/89 ,  H01L33/64 ,  H01L33/48 ,  H01L33/56 ,  F21K99/00 ,  F21V29/70

CPC分类号： F21V29/87 ,  F21K9/00 ,  F21K9/20 ,  F21V19/0055 ,  F21V23/06 ,  F21V29/70 ,  F21V29/85 ,  F21V29/89 ,  F21Y2115/10 ,  H01L33/483 ,  H01L33/56 ,  H01L33/644

摘要： An LED unit (100) includes a base unit (1). The LED unit further includes a light emitting device (3) including: a package substrate (3b); and a light emitting portion (3a) provided in the package substrate and having LED chips, the light emitting device being placed on a front surface of the base unit. The base unit is formed of a molding in which a metal member (11) is covered with thermally conductive resin having an electrical insulation property, and the thermally conductive resin is interposed between the light emitting device and the metal member. The LED unit can thus efficiently radiate heat generated in the light emitting device through the base unit toward a fixture to which the LED unit is attached.

摘要翻译： LED单元（100）包括基座单元（1）。 LED单元还包括发光器件（3），包括：封装衬底（3b）; 以及设置在所述封装基板中并且具有LED芯片的发光部分（3a），所述发光器件被放置在所述基座单元的前表面上。 基体单元由金属构件（11）被具有电绝缘性的导热性树脂覆盖的成型体形成，并且导热性树脂介于发光元件与金属构件之间。 因此，LED单元可以有效地将发光装置中产生的热量通过基座单元朝向与LED单元相连的固定装置发射。

公开(公告)号：US09322540B2

公开(公告)日：2016-04-26

申请号：US14365107

申请日：2012-11-20

申请人： OSRAM GmbH

发明人： YingJun Cheng

IPC分类号： F21V29/00 ,  F21V19/00 ,  F28F21/08 ,  F21V29/77 ,  F21V29/87 ,  F28F3/02 ,  F28F13/18 ,  F28F21/06 ,  F21Y101/02 ,  F28F13/00

CPC分类号： F21V29/87 ,  F21V19/005 ,  F21V29/777 ,  F21Y2115/10 ,  F28F3/02 ,  F28F13/18 ,  F28F21/06 ,  F28F21/067 ,  F28F21/089 ,  F28F2013/006

摘要： Various embodiments relate to a heat radiation device for a heat source. The heat radiation device includes a body and a coating layer, wherein the body has a first section and at least one second section projecting from the first section, the first section has a mounting surface for mounting and thermally contacting with the heat source and the coating layer is applied on the surface other than the mounting surface of the first section and a surface of the at least one second section, wherein the coating layer has higher thermal dissipation performance than the body. In addition, various embodiments further relate to an illuminating device having the above type of heat radiation device.

摘要翻译： 各种实施例涉及用于热源的热辐射装置。 散热装置包括主体和涂层，其中主体具有第一部分和从第一部分突出的至少一个第二部分，第一部分具有用于安装和热接触热源和涂层的安装表面 层施加在除了第一部分的安装表面以及至少一个第二部分的表面之外的表面上，其中涂层具有比主体更高的散热性能。 此外，各种实施例还涉及具有上述类型的散热装置的照明装置。

公开(公告)号：US20160084483A1

公开(公告)日：2016-03-24

申请号：US14752992

申请日：2015-06-28

申请人： GE LIGHTING SOLUTIONS, LLC

发明人： Eden DUBUC ,  Luigi TAVERNESE ,  Nam NS NGUYEN

IPC分类号： F21V19/00 ,  F21V17/10 ,  F21V23/00 ,  F21V29/89 ,  F21V29/70 ,  F21V29/71 ,  F21V23/02 ,  F21V29/87

摘要： An electrically isolated light-emitting display (LED) module efficiently transfers heat away from electronic components by thermally conducting the heat to the outside walls of an enclosure. An embodiment includes a plastic enclosure having thin plastic walls that define an opening, a plastic cover having a lens and configured to cover the opening, a power supply unit (PSU), a light-emitting diode (LED) operably connected to the PSU, and a thermally conducting potting material. The potting material is deposited into an interior volume of the plastic enclosure to cover the PSU, contact a back portion of the LED, and to thermally connect the PSU and the LED to the thin plastic walls of the plastic enclosure without covering a front portion of the LED.

摘要翻译： 电隔离的发光显示器（LED）模块通过将热量传导到外壳的外壁而有效地将热量从电子部件传送出去。 一个实施例包括具有限定开口的薄塑料壁的塑料外壳，具有透镜并构造成覆盖开口的塑料盖，电源单元（PSU），可操作地连接到PSU的发光二极管（LED） 和导热灌封材料。 灌封材料沉积到塑料外壳的内部容积中以覆盖PSU，接触LED的后部，并将PSU和LED热连接到塑料外壳的薄塑料壁上，而不会覆盖塑料外壳的前部 LED。

公开(公告)号：US09261243B2

公开(公告)日：2016-02-16

申请号：US14524750

申请日：2014-10-27

申请人： LG INNOTEK CO., LTD.

发明人： Won Jin Son

IPC分类号： H05B37/02 ,  F21K99/00 ,  F21S4/00 ,  F21V3/02 ,  F21V17/10 ,  F21V17/16 ,  F21V29/00 ,  H05B33/08 ,  F21V29/76 ,  F21V29/87 ,  F21Y101/02 ,  F21Y103/00 ,  F21Y105/00

CPC分类号： H05B33/0803 ,  F21K9/27 ,  F21K9/66 ,  F21S4/20 ,  F21V3/02 ,  F21V17/104 ,  F21V17/164 ,  F21V19/008 ,  F21V29/004 ,  F21V29/507 ,  F21V29/763 ,  F21V29/80 ,  F21V29/87 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2115/10 ,  Y02B20/383 ,  Y02B20/386

摘要： A fluorescent lamp type light emitting apparatus is provided. The light emitting apparatus comprises a cover, a light emitting module, radiation pads, and cap parts. The cover comprises a first cover and a transmissive second cover coupled to the first cover. The light emitting module comprises a plurality of light emitting diodes in the cover. The radiation pads are disposed on the light emitting module. The cap parts comprise electrode terminals at both ends of the cover.

摘要翻译： 提供了一种荧光灯型发光装置。 发光装置包括盖，发光模块，辐射垫和帽部。 所述盖包括联接到所述第一盖的第一盖和透射的第二盖。 发光模块包括盖中的多个发光二极管。 辐射垫设置在发光模块上。 帽部分包括在盖的两端的电极端子。