公开(公告)号：US09748117B2

公开(公告)日：2017-08-29

申请号：US13665169

申请日：2012-10-31

Applicant: Semes Co., Ltd.

Inventor： Unkyu Kang ,  Sungun Kim

IPC: F27D7/00 ,  H01L21/67

CPC classification number: H01L21/67017 ,  Y10T137/8593

Abstract: Provided is a substrate treating apparatus. The substrate treating apparatus includes a chamber, a support member disposed within the chamber to support a substrate, and an exhaust member for exhausting a gas within an inner space of the chamber to the outside of the chamber. A trap space for collecting fumes contained in the gas is defined in the exhaust member.

公开(公告)号：US20170151588A1

公开(公告)日：2017-06-01

申请号：US15363276

申请日：2016-11-29

Applicant: SEMES CO., LTD.

Inventor： Daesung KIM

IPC: B08B3/10 ,  G03F7/20 ,  G03F7/16

CPC classification number: G03F7/20 ,  B08B3/02 ,  G03F7/162 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/68735

Abstract: The present disclosure relates to an apparatus for treating a substrate. The apparatus for treating a substrate includes a cup having an inner space whose top is open, a supporting unit for supporting a substrate in the inner space, a guide plate provided to surround the supporting unit, a treatment solution supplying unit for supplying a treatment solution to an upper surface of the substrate supported by the supporting unit, and a cleaning solution supplying unit for supplying a cleaning solution to an upper surface of the guide plate.

公开(公告)号：US20170114456A1

公开(公告)日：2017-04-27

申请号：US15296474

申请日：2016-10-18

Applicant: SEMES CO., LTD.

Inventor： EUNTARK LEE ,  Jong Seok SEO

IPC: C23C16/44 ,  H01L21/027 ,  C23C16/455

CPC classification number: C23C16/4412 ,  C23C16/455 ,  H01L21/0274 ,  H01L21/67017

Abstract: An apparatus and a method for treating a substrate are disclosed. The apparatus may include a process chamber including an upper chamber and a lower chamber that are coupled to each other to define a treatment space, a supporting unit provided within the treatment space to support a substrate, and an exhausting element configured to exhaust an air from the treatment space or a neighboring region of the treatment space. The exhausting element may include an outer exhausting line connected to an outer exhausting hole, and the outer exhausting hole may be formed in or through the upper or lower chamber and may be connected to a contact surface, at which the upper and lower chambers are in contact with each other.

公开(公告)号：US09627236B2

公开(公告)日：2017-04-18

申请号：US14681506

申请日：2015-04-08

Applicant: SEMES CO., LTD.

Inventor： Sang Jin Lee ,  Ji Hoon Choi ,  Doo Jin Kim

IPC: H01L21/67

CPC classification number: H01L21/6719 ,  H01L21/67051 ,  H01L21/67126

Abstract: A substrate treating apparatus is provided which includes housing and a door assembly. The housing provides a process space for treating a substrate therein and has an opening formed at a sidewall thereof. The door assembly opens and closes the opening. The door assembly includes a shutter, a driving member, and a gap maintaining unit. The driving member transfers the shutter to an open position where the shutter faces to the opening and to a blocking position where the shutter gets out of the open position. The gap maintaining unit maintains a constant gap between the shutter and the sidewall.

公开(公告)号：US09620476B2

公开(公告)日：2017-04-11

申请号：US14532190

申请日：2014-11-04

Applicant: SEMES CO., LTD. ,  SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hang Lim Lee ,  Jong Jin Weon ,  Soon Hyun Kim ,  Seung Dae Seok

IPC: B32B37/00 ,  H01L23/00 ,  H01L21/683

CPC classification number: H01L24/75 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2224/75252 ,  H01L2224/75253 ,  H01L2224/75301 ,  H01L2224/75305 ,  H01L2224/75312 ,  H01L2224/75502 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/759 ,  H01L2224/81048 ,  H01L2224/81203 ,  H01L2224/83048 ,  H01L2224/83203 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/00014

Abstract: A bonding head and a die bonding apparatus having the same are disclosed. The bonding head includes a body connected to a driving section for transferring the die, a plate heater mounted to a lower surface of the body and a collet mounted to a lower surface of the plate heater and configured to hold the die using a vacuum pressure. A cooling channel is formed at the lower surface of the body, and cooling passages are formed through the body and connected with the cooling channel to supply a cooling fluid into the cooling channel and to recover the cooling fluid from the cooling channel thereby cooling the plate heater.

公开(公告)号：US09597704B2

公开(公告)日：2017-03-21

申请号：US13779992

申请日：2013-02-28

Applicant: Semes Co., Ltd.

Inventor： Il Gyo Koo ,  Hyun Jong Shim

IPC: H01J37/32 ,  H01L21/67 ,  B05C11/00

CPC classification number: B05C11/00 ,  H01J37/32623 ,  H01J37/32633 ,  H01J37/32651 ,  H01L21/67126

Abstract: Provided is an apparatus for treating a substrate. The apparatus comprises a plasma boundary limiter unit disposed within a process chamber to surround a discharge space defined above a support unit. The plasma boundary limiter unit comprises a plurality of plates disposed along a circumference of the discharge space, and the plurality of plates are spaced apart from each other along the circumference of the discharge space so that a gas within the discharge space flows to the outside of the discharge space through passages provided between the adjacent plates.

公开(公告)号：US20170001221A1

公开(公告)日：2017-01-05

申请号：US15195262

申请日：2016-06-28

Applicant: Semes Co., Ltd.

Inventor： Taekyoub Lee

IPC: B08B3/02 ,  H01L21/02 ,  H01L21/67 ,  B08B3/08

CPC classification number: B08B3/024 ,  B08B2203/0229 ,  H01L21/02041 ,  H01L21/67051 ,  H01L21/6715

Abstract: A method for treating a substrate with a treatment liquid is disclosed, wherein the substrate is treated while a location at which the treatment liquid is supplied onto the substrate that is rotated is moved in an outward direction from a central area of the substrate towards a peripheral area of the substrate and in an inward direction from a peripheral area of the substrate towards a central area of the substrate a plurality of times, and wherein the movement distances of some of the plurality of movements are different from each other.

Abstract translation: 公开了一种用处理液处理基板的方法，其中处理液体的处理液体被供给到旋转的基板上的位置从基板的中心区域向外侧向周向移动 并且从衬底的周边区域到衬底的中心区域的向内方向多次，并且其中多个运动中的一些运动的移动距离彼此不同。

公开(公告)号：US20160334162A1

公开(公告)日：2016-11-17

申请号：US15152979

申请日：2016-05-12

Applicant: Semes Co., Ltd.

Inventor： Boong KIM ,  Min Sung HAN ,  Joo Jib PARK ,  Woo Young KIM

IPC: F26B21/14 ,  F26B3/04 ,  H01L21/02 ,  F26B21/12 ,  H01L21/67 ,  F26B9/06 ,  F26B21/10

CPC classification number: F26B21/145 ,  F26B3/04 ,  F26B9/06 ,  F26B21/10 ,  F26B21/12 ,  F26B21/14 ,  H01L21/02101 ,  H01L21/67034 ,  H01L21/67051 ,  H01L21/67109 ,  H01L21/6719 ,  H01L21/67248 ,  H01L21/67253

Abstract: Disclosed is a substrate drying apparatus of substrate processing apparatus including a chamber that provides a space for processing a substrate, and a fluid supply unit that supplies a process fluid to the chamber, wherein the liquid supply unit includes a supply tank in which the fluid is stored, a supply line that connects the supply tank and the chamber, a branch line branched from a first point of the supply line and connected to a second point of the supply line, and a temperature control unit that adjusts the temperature of the fluid such that the temperatures of the fluids flowing through the supply line and the branch line between the first point and the second point are different.

Abstract translation: 本发明公开了一种基板处理装置的基板干燥装置，其包括：提供用于处理基板的空间的室;以及向该室供给处理流体的流体供给单元，其中，所述液体供给单元包括： 存储有连接供应罐和室的供应管线，从供应管线的第一点分支并连接到供应管线的第二点的分支管线以及调节流体温度的温度控制单元 流经供应管线的流体和第一点与第二点之间的分支管线的温度不同。

公开(公告)号：US09406501B2

公开(公告)日：2016-08-02

申请号：US13905634

申请日：2013-05-30

Applicant: Semes Co., Ltd.

Inventor： Yong Hee Lee ,  Bok Kyu Lee ,  Jongsu Choi

IPC: B08B3/00 ,  H01L21/02 ,  H01L21/67

CPC classification number: H01L21/02041 ,  H01L21/02052 ,  H01L21/67051

Abstract: Provided are an apparatus and a method of cleaning a substrate. The apparatus includes a substrate supporting unit supporting a substrate, a container surrounding the substrate supporting unit and collecting an organic solvent scattered from the substrate, and a fluid supplying unit provided on one side of the container and spraying a liquid organic solvent with bubbles to the substrate. The fluid supplying unit includes a nozzle head ejecting the organic solvent to the substrate, an organic solvent supplying line supplying the organic solvent from an organic solvent storage tank to the nozzle head, and a bubble providing element provided on the organic solvent supplying line and providing bubbles to the liquid organic solvent.

Abstract translation: 提供一种清洗基板的装置和方法。 该装置包括支撑基板的基板支撑单元，围绕基板支撑单元并收集从基板散射的有机溶剂的容器以及设置在容器的一侧上的流体供给单元，并且向液体有机溶剂喷射气泡 基质。 流体供给单元包括将有机溶剂喷射到基板的喷嘴头，将有机溶剂从有机溶剂容器供给到喷嘴头的有机溶剂供给管线和设置在有机溶剂供给管线上的气泡供给元件， 气泡到液体有机溶剂。

公开(公告)号：US20160181137A1

公开(公告)日：2016-06-23

申请号：US14974023

申请日：2015-12-18

Applicant: Semes Co., Ltd.

Inventor： Wonhaeng LEE ,  Kang Rae HA

IPC: H01L21/683 ,  H02N13/00 ,  B23K1/00 ,  H01J37/32 ,  B23K35/28 ,  C22C29/02 ,  C22C29/12 ,  H01L21/67 ,  B23K35/32

CPC classification number: C22C29/12 ,  B23K35/286 ,  B23K35/325 ,  B32B15/00 ,  C22C29/02 ,  C22C49/06 ,  C22C49/14 ,  H01J37/32568 ,  H01J37/32715 ,  H01J37/32724 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/68757 ,  H01L21/68785 ,  H02N13/00

Abstract: A fabrication method of a supporting unit supporting a substrate is provided. The fabrication method includes providing a supporting plate that is made of a non-conductive material and configured to support the substrate, providing a base plate that is disposed under the supporting plate and made of a material containing a conductive material, and forming a first metal film on a top surface of the base plate and bonding the supporting plate with the base plate through a brazing process.

Abstract translation: 提供支撑基板的支撑单元的制造方法。 该制造方法包括提供由非导电材料制成并构造成支撑基板的支撑板，提供设置在支撑板下方并由含有导电材料的材料制成的基板，并形成第一金属 膜，并且通过钎焊工艺将支撑板与基板接合。