公开(公告)号：US10181453B2

公开(公告)日：2019-01-15

申请号：US15406589

申请日：2017-01-13

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jian Zhou

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/31

Abstract: A package packaged with a cap. The package features trenches, through holes, and a non-conductive coupling element forming a locking mechanism integrated embedded or integrated within a substrate. The package has a cap coupled to the non-conductive coupling element through ultrasonic plastic welding. The package protects the dice from an outside environment or external stresses or both. A method is desired to form package to reduce glue overflow defects in the package. Fabrication of the package comprises drilling holes in a substrate; forming trenches in the substrate; forming a non-conductive coupling element in the through holes and the trenches to form a locking mechanism; allowing the non-conductive coupling element to harden and cure; coupling a die or dice to the substrate; and coupling a cap to the non-conductive coupling element to protect the die or dice from an outside environment or external stresses or both.

公开(公告)号：US10126462B2

公开(公告)日：2018-11-13

申请号：US14982518

申请日：2015-12-29

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: G01V8/12 ,  G01V13/00

Abstract: The embodiments of the present disclosure provide a proximity sensor, an electronic apparatus and a method for manufacturing a proximity sensor. The proximity sensor comprises a sensor chip, a light-emitting device, a transparent molding material and a non-transparent molding material, wherein the sensor chip comprises a sensor region; the light-emitting device is located on the sensor chip and is electrically coupled to the sensor chip; the transparent molding material at least covers a light-emitting surface of the light-emitting device; and the non-transparent molding material isolates the transparent molding material from the sensor region.

公开(公告)号：US10094797B2

公开(公告)日：2018-10-09

申请号：US15605825

申请日：2017-05-25

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier Le Neel ,  Ravi Shankar ,  Suman Cherian ,  Calvin Leung ,  Tien-Choy Loh ,  Shian-Yeu Kam

IPC: H01L29/84 ,  G01N27/22 ,  H01L25/065 ,  H01L29/78 ,  G01L9/12 ,  G01K7/18 ,  G01K7/20 ,  G01L19/00 ,  G01K7/16 ,  H01L25/00 ,  H01L27/02 ,  G01K7/01 ,  G01D21/02

Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.

公开(公告)号：US10038108B2

公开(公告)日：2018-07-31

申请号：US15340216

申请日：2016-11-01

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan ,  Laurent Herard ,  Yong Jiang Lei

IPC: H01L31/12 ,  G06M7/00 ,  H01L31/0203 ,  H01L31/18 ,  G01S7/481 ,  H01L31/153 ,  H01L25/00

CPC classification number: H01L31/0203 ,  G01S7/481 ,  G01S7/4813 ,  G01S17/026 ,  G01S17/46 ,  H01L25/50 ,  H01L31/125 ,  H01L31/153 ,  H01L31/173 ,  H01L31/18

Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, such as proximity sensing or optical ranging devices. One embodiment is directed to an optical sensor package that includes a substrate, a sensor die coupled to the substrate, a light-emitting device coupled to the substrate, and a cap. The cap is positioned around side surfaces of the sensor die and covers at least a portion of the substrate. The cap includes first and second sidewalls, an inner wall having first and second side surfaces and a mounting surface, and a cover in contact with the first and second sidewalls and the inner wall. The first and second side surfaces are transverse to the mounting surface, and the inner wall includes an opening extending into the inner wall from the mounting surface. A first adhesive material is provided on the sensor die and at least partially within the opening, and secures the inner wall to the sensor die.

公开(公告)号：US09768216B2

公开(公告)日：2017-09-19

申请号：US14535423

申请日：2014-11-07

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Dave Alexis Delacruz ,  David Gani

IPC: H01L27/146 ,  G03B17/02 ,  G03B29/00 ,  G03B3/10

CPC classification number: H01L27/14625 ,  G03B3/10 ,  G03B17/02 ,  G03B29/00 ,  H01L27/14618 ,  H01L27/14685

Abstract: An image sensor device may include an interconnect layer, an image sensor IC on the interconnect layer, and a barrel adjacent the interconnect layer and having first electrically conductive traces. The image sensor device may include a liquid crystal focus cell carried by the barrel and having cell layers, and second electrically conductive contacts. A pair of adjacent cell layers may have different widths. The image sensor device may include an electrically conductive adhesive body coupling at least one of the second electrically conductive contacts to a corresponding one of the first electrically conductive traces.

公开(公告)号：US09698105B2

公开(公告)日：2017-07-04

申请号：US15251209

申请日：2016-08-30

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: H01L23/34 ,  H01L23/00 ,  H01L23/373 ,  H01L23/498 ,  H01L23/367 ,  H01L23/31 ,  H01L21/48 ,  H01L23/538 ,  H01L21/56 ,  H01L21/78 ,  H01L23/18

CPC classification number: H01L23/562 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/4871 ,  H01L21/4882 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/78 ,  H01L23/18 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/373 ,  H01L23/3737 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16235 ,  H01L2224/18 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/3511

Abstract: A method includes forming a molded panel that includes a number of integrated circuits, fan-out components and stiffeners embedded in an encapsulation material. A redistribution layer is formed over the integrated circuits and the fan-out components. The redistribution layer is electrically coupled to contacts of the integrated circuits. The molded panel is singulated to form electronic devices. Each electronic device each an integrated circuit that is separated from a fan-out component by a portion of the encapsulation material and a stiffener separated from the fan-out component by a second portion of the encapsulation material.

公开(公告)号：US09689824B2

公开(公告)日：2017-06-27

申请号：US14887145

申请日：2015-10-19

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier Le Neel ,  Ravi Shankar ,  Suman Cherian ,  Calvin Leung ,  Tien-Choy Loh ,  Shian-Yeu Kam

IPC: G01P15/08 ,  H01L29/84 ,  G01N27/22 ,  H01L25/065 ,  H01L25/00 ,  G01L9/12 ,  G01K7/01 ,  H01L27/02 ,  H01L29/78 ,  G01K7/18 ,  G01K7/20 ,  G01L19/00 ,  G01K7/16 ,  G01D21/02

CPC classification number: G01N27/223 ,  G01D21/02 ,  G01K7/01 ,  G01K7/16 ,  G01K7/186 ,  G01K7/20 ,  G01L9/12 ,  G01L19/0092 ,  H01L25/0652 ,  H01L25/50 ,  H01L27/0248 ,  H01L29/7804 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.

公开(公告)号：US09651627B2

公开(公告)日：2017-05-16

申请号：US13853666

申请日：2013-03-29

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier Le Neel ,  Calvin Leung

IPC: H02J7/00 ,  H02J7/14 ,  G01R31/36

CPC classification number: G01R31/3679 ,  G01R31/3662 ,  H02J7/0006 ,  H02J7/0016 ,  H02J7/0021 ,  H02J7/0036

Abstract: A device is provided for monitoring the total current discharged from a battery. The device includes a bridge circuit of resistors in which one of the resistors has a resistance which varies according to the current which has passed through it. Whenever the battery passes a current to a load, a small portion of the current is passed through the bridge circuit.

公开(公告)号：US09640574B2

公开(公告)日：2017-05-02

申请号：US13029665

申请日：2011-02-17

Applicant: Jing-En Luan ,  Junyong Chen

Inventor： Jing-En Luan ,  Junyong Chen

IPC: H01L27/146 ,  H04N5/225

CPC classification number: H01L27/14618 ,  H01L2224/48091 ,  H01L2224/73265 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2924/00014

Abstract: A process of forming optical sensors includes sealing an imaging portion of each of a plurality of optical sensors on a sensor wafer with a transparent material. The operation of sealing leaves a bonding portion of each of the optical sensors exposed. The process further includes cutting the wafer into a plurality of image sensor dies after sealing the optical sensors such that each image sensor die includes one of the optical sensors sealed with a corresponding portion of the transparent material.

公开(公告)号：US09638884B2

公开(公告)日：2017-05-02

申请号：US14322054

申请日：2014-07-02

Applicant: STMicroelectronics Pte Ltd.

Inventor： Tin Tun

IPC: G02B7/02

CPC classification number: G02B7/025 ,  G02B7/02

Abstract: A method of selectively bonding a component to a substrate prevents glue displacement onto neighboring components. The method entails shortening a section of the perimeter of a mount wall so that the foot of the mount wall contacts the glue without causing substantial displacement. A cure step hardens and holds the shortened foot of the mount wall in a stationary position, while providing a partial bond. Meanwhile the rest of the mount wall that is not located near contact pads on the substrate has a tall foot that extends to the surface of the substrate and is bonded in the usual way. By modifying the component, it is not necessary to modify either the chemistry of the epoxy or the epoxy dispense operation.