公开(公告)号：US12223218B2

公开(公告)日：2025-02-11

申请号：US18063028

申请日：2022-12-07

Applicant: STMICROELECTRONICS, INC. ,  STMICROELECTRONICS INTERNATIONAL N.V.

Inventor： Benedetto Vigna ,  Mahesh Chowdhary ,  Matteo Dameno

IPC: G06F3/14 ,  G01P1/07 ,  G06F3/12

Abstract: A method includes receiving, at a master agent, announcements from candidate consumer agents indicating the presence of the candidate consumer agents. Each announcement includes display parameters for a display of the corresponding candidate consumer agent. The method further includes receiving at the master agent content parameters from a producer agent, the content parameters defining characteristics of content to be provided by the consumer agent. A mosaic screen is configured based on the received announcements and the content parameters. This configuring of the mosaic screen includes selecting ones of the consumer agents for which an announcement was received and generating content distribution parameters based on the content parameters and the display parameters of the selected ones of the consumer agents. The generated content distribution parameters are provided to the consumer agent.

公开(公告)号：US12211774B2

公开(公告)日：2025-01-28

申请号：US16848635

申请日：2020-04-14

Applicant: STMICROELECTRONICS, INC.

Inventor： Ela Mia Cadag ,  Frederick Ray Gomez ,  Aaron Cadag

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00

Abstract: Generally described, one or more embodiments are directed to semiconductor packages comprising a plurality of leads and methods of forming same. The plurality of leads include active leads that are electrically coupled to bond pads of a semiconductor die and thereby coupled to active components of the semiconductor die, and inactive leads that are not electrically coupled to bond pads of the semiconductor die. The active leads have surfaces that are exposed at a lower surface of the semiconductor package and forms lands, while the inactive leads are not exposed at the lower surface of the package.

公开(公告)号：US12211772B2

公开(公告)日：2025-01-28

申请号：US17688013

申请日：2022-03-07

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics, Inc.

Inventor： Fulvio Vittorio Fontana ,  Davide Maria Benelli ,  Jefferson Sismundo Talledo

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/16 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor device, such as a Quad-Flat No-lead (QFN) package, includes a semiconductor chip arranged on a die pad of a leadframe. The leadframe has an array of electrically-conductive leads around the die pad. The leads in the array have distal ends facing away from the die pad as well as recessed portions at an upper surface of the leads. Resilient material, such as low elasticity modulus material, is present at the upper surface of the leads and filling the recessed portions. An insulating encapsulation is molded onto the semiconductor chip. The resilient material is sandwiched between the insulating encapsulation and the distal ends of the leads. This resilient material facilitates flexibility of the leads, making them suited for reliable soldering to an insulated metal substrate.

公开(公告)号：US12170240B2

公开(公告)日：2024-12-17

申请号：US18303471

申请日：2023-04-19

Applicant: STMicroelectronics, Inc.

Inventor： Rennier Rodriguez ,  Maiden Grace Maming ,  Jefferson Sismundo Talledo

IPC: H01L23/49 ,  H01L21/48 ,  H01L23/00 ,  H01L23/495

Abstract: The present disclosure is directed to a lead frame including a die pad with cavities, and methods for attaching a semiconductor die to the lead frame. The cavities allow for additional adhesive to be formed on the die pad at the corners of the semiconductor die, and prevent the additional adhesive from overflowing on to active areas of the semiconductor die.

公开(公告)号：US12111158B2

公开(公告)日：2024-10-08

申请号：US18136088

申请日：2023-04-18

Applicant: STMicroelectronics, Inc.

Inventor： Deyou Fang ,  Chao-Ming Tsai ,  Milad Alwardi ,  Yamu Hu ,  David McClure

IPC: G01C19/5726 ,  G01C19/5733 ,  G01C25/00

CPC classification number: G01C19/5726 ,  G01C19/5733 ,  G01C25/005

Abstract: A microelectromechanical system (MEMS) gyroscope includes a driving mass and a driving circuit that operates to drive the driving mass in a mechanical oscillation at a resonant drive frequency. An oscillator generates a system clock that is independent of and asynchronous to the resonant drive frequency. A clock generator circuit outputs a first clock and a second clock that are derived from the system clock. The drive loop of the driving circuit including an analog-to-digital converter (ADC) circuit that is clocked by the first clock and a digital signal processing (DSP) circuit that is clocked by the second clock.

公开(公告)号：US12092653B2

公开(公告)日：2024-09-17

申请号：US17472126

申请日：2021-09-10

Applicant: STMicroelectronics, Inc.

Inventor： Davy Choi ,  Yamu Hu ,  Deyou Fang

IPC: G01P21/00 ,  G01P15/125 ,  G01R19/10 ,  G01R31/28

CPC classification number: G01P21/00 ,  G01P15/125 ,  G01R19/10 ,  G01R31/2829

Abstract: In one embodiment, a method for detecting functional state of a microelectromechanical (MEMS) sensor is described. The method includes monitoring an input common-mode feedback (ICMFB) voltage generated by an ICMFB circuit coupled to the MEMS sensor through a plurality of nodes. The method also includes determining, using the monitored ICMFB voltage, whether all of the plurality of nodes of the MEMS sensor are electrically connected to the ICMFB circuit.

公开(公告)号：US20240188837A1

公开(公告)日：2024-06-13

申请号：US18063021

申请日：2022-12-07

Applicant: STMICROELECTRONICS, INC. ,  STMicroelectronics International N.V.

Inventor： Mahesh CHOWDHARY ,  Vijay KUMAR ,  Goldy ,  Kolin PAUL

IPC: A61B5/021 ,  A61B5/00 ,  A61B5/026 ,  A61B5/11

CPC classification number: A61B5/021 ,  A61B5/026 ,  A61B5/1102 ,  A61B5/6833 ,  A61B5/7267 ,  A61B5/7278 ,  A61B2562/0219 ,  A61B2562/043

Abstract: A blood pressure monitoring device includes a patch including two inertial measurement units placed adjacent to the skin of a user. The blood pressure monitoring device includes a control unit coupled to the patch and configured to receive sensor data from the inertial measurement units. The control unit includes an analysis model trained with multiple machine learning processes to generate blood pressure estimations based on the sensor data. A first general machine learning process trains the analysis model with a training set gathered from plurality of other individuals. The second general machine learning process retrains a portion of the analysis model with a second machine learning process utilizing individualized training set gathered from the user.

公开(公告)号：US12009954B2

公开(公告)日：2024-06-11

申请号：US17538803

申请日：2021-11-30

Applicant: STMICROELECTRONICS, INC.

Inventor： Andrea Lorenzo Vitali

IPC: H04L27/06

CPC classification number: H04L27/06

Abstract: An electronic device receives wireless signals encoded with data in an amplitude-shift keying format. The electronic device passes the wireless signals through a low-pass filter. The low-pass filter has a cutoff frequency between a first frequency associated with data values of a first type and a second frequency associated with data values of a second type. The low-pass filter has the effect of changing the wireless signal from the amplitude-shift keying format to an on-off keying format without losing the data. The electronic device decodes the data from the wireless signal in the on-off keying format.

公开(公告)号：US20240178006A1

公开(公告)日：2024-05-30

申请号：US18435915

申请日：2024-02-07

Applicant: STMICROELECTRONICS, INC.

Inventor： Ian Harvey ARELLANO ,  Aaron CADAG ,  Ela Mia CADAG

IPC: H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L21/4821 ,  H01L23/3121 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L21/561 ,  H01L21/565 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48245 ,  H01L2224/73265 ,  H01L2224/92247

Abstract: The present disclosure is directed to leadless semiconductor packages with improved wettable flanks that encourage the formation of solder fillets when the leadless semiconductor package is mounted to a substrate. The solder fillets are consistently formed and are easily detectable by inspection systems, such as automated optical inspection (AOI) systems.

公开(公告)号：US11991276B2

公开(公告)日：2024-05-21

申请号：US17939385

申请日：2022-09-07

Applicant: STMicroelectronics, Inc.

Inventor： Giuseppe Pilozzi

IPC: H04L9/08 ,  G06F8/61 ,  G06F11/14 ,  H04L9/14 ,  H04L9/30 ,  H04L9/32

CPC classification number: H04L9/0866 ,  G06F8/61 ,  G06F11/1451 ,  H04L9/0894 ,  H04L9/14 ,  H04L9/30 ,  H04L9/3226 ,  G06F2201/84

Abstract: A secure element device that is configured to be cryptographically bound to a host device includes a secure element host key slot configured to store host key information that allows only the host device to control the secure element, a secure memory storing binding information, and limited functionality allowing the binding information to be read from the secure memory by the host device during a binding process. The binding information is cryptographically correlated with the host key information. The host key information is generated by the host device using the binding information read from the secure element and a secret key. The secure element device further includes general functionality only accessible to the host device using the host key information that is generated by the host device. The secure memory includes prevention measures impeding unauthorized entities from obtaining information from the secure memory.