公开(公告)号：US20080024960A1

公开(公告)日：2008-01-31

申请号：US11597880

申请日：2005-06-03

Applicant: Akio Hidaka ,  Shouichi Ikebe ,  Yuuichi Murano ,  Hirozumi Kazitani ,  Mika Ikeda ,  Yoshitaka Mizoguchi

Inventor： Akio Hidaka ,  Shouichi Ikebe ,  Yuuichi Murano ,  Hirozumi Kazitani ,  Mika Ikeda ,  Yoshitaka Mizoguchi

IPC: B29C45/14 ,  H05K7/00

CPC classification number: H05K3/3426 ,  H01G2/065 ,  H05K5/0095 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2201/10651 ,  H05K2201/10772 ,  H05K2201/10909 ,  H05K2201/2009 ,  Y02P70/613

Abstract: The present invention aims to supply an electronic component which is manufactured in a manufacturing process at low cost, and realize improvement of shock resistance, endurance, flexure resistance, mounting reliability etc. at the same time, without requiring fine adjustment etc. The invention is an electronic component 1 which has an element 2, a pair of terminal portions 4 which were disposed on the element 2, and an external covering material 5 which covers the a part of the terminal portions 4 and the element 2, and configured in such a manner that inclined portions 10 are disposed on corner portions of a bottom surface 9 and side surfaces of the external covering material 5, and the terminal portions 4 are protruded from corner portions where the inclined portions 10 and the bottom surface 9 of the external covering material intersect.

Abstract translation: 本发明的目的是提供一种以低成本制造工艺制造的电子部件，同时实现耐冲击性，耐久性，抗弯曲性，安装可靠性等的改善，而不需要微调等。本发明是 具有元件2的电子部件1，设置在元件2上的一对端子部4和覆盖端子部4的一部分和元件2的外部覆盖材料5， 倾斜部分10设置在底面9的角部和外部覆盖材料5的侧面的方式，端子部4从外部覆盖材料的倾斜部10和底面9的角部突出 相交。

公开(公告)号：US07284882B2

公开(公告)日：2007-10-23

申请号：US11354674

申请日：2006-02-15

Applicant: Greg Eugene Burkholder

Inventor： Greg Eugene Burkholder

IPC: F21V29/00

CPC classification number: H05K1/0206 ,  F21K9/00 ,  F21K9/20 ,  F21S43/14 ,  F21S43/19 ,  F21S45/47 ,  F21S45/49 ,  F21S48/328 ,  F21V29/74 ,  F21V29/75 ,  F21V29/763 ,  F21Y2115/10 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/42 ,  H05K2201/10106 ,  H05K2201/10651 ,  Y10S362/80

Abstract: An LED light module assembly for use with high power, high light output LED's includes a thin flexible circuit board with surface mounted LED's and other electronic components which is attached to a metal heat sink using a layer of a thermally conductive adhesive, such as a thermally conductive epoxy adhesive. A conduction path is provided from the LED carrier through the flexible circuit board by the incorporation of one or more thermally conductive vias in the region of the attachment pad used to bond the LED to the flexible circuit board. These vias provide a conduction path from the back side of the LED carrier through the circuit board to the thermally conductive adhesive and heat sink. The LED light module assembly has the capacity to dissipate between about 10-14 W of power without exceeding a maximum LED junction temperature of about 125° C.

Abstract translation: 一种用于大功率高亮度LED输出LED的LED灯组件包括具有表面安装的LED和其他电子元件的薄柔性电路板，该电子元件使用导热粘合剂层（例如热）连接到金属散热器 导电环氧胶粘剂。 通过在用于将LED结合到柔性电路板的附接垫的区域中结合一个或多个导热通孔，通过柔性电路板从LED载体提供导电路径。 这些通孔提供从LED载体的背面通过电路板到导热粘合剂和散热器的导电路径。 LED灯模块组件具有在大约10-14W的功率之间消散的能力，而不超过约125℃的最大LED结温。

公开(公告)号：US20070242441A1

公开(公告)日：2007-10-18

申请号：US11403840

申请日：2006-04-14

Applicant: Matthew Aldrich ,  Jack Rains

Inventor： Matthew Aldrich ,  Jack Rains

IPC: H05K7/00

CPC classification number: H05K1/111 ,  H05K1/0295 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10651 ,  Y02P70/611

Abstract: Disclosed examples of printed circuit boards for lighting systems have identical LED landing zones printed on the board. Each zone includes at least two sets of LED contact pads. One pad set is configured to mate with contacts of an LED of a first structural type, e.g. from a first product line or manufacturer. The other pad set is configured to mate with contacts of an LED of a second type, e.g. from a different product line or manufacturer. The layout may enable an easy system re-design, e.g. to shift from one type of LED to another. Alternatively, the layout may enable one system to use LEDs of the two different types in a single LED set or array. Exemplary systems disclosed herein include an element for mixing light produced by LEDs mounted to the landing zones, such as an optical integrating cavity.

Abstract translation: 用于照明系统的印刷电路板的公开示例具有印刷在板上的相同的LED着陆区。 每个区域包括至少两组LED接触焊盘。 一个焊盘组被配置为与第一结构类型的LED的触点（例如， 从第一个产品线或制造商。 另一个焊盘组被配置为与第二类型的LED的触点配合，例如， 来自不同的产品线或制造商。 该布局可以实现简单的系统重新设计，例如。 从一种类型的LED转移到另一种类型的LED。 或者，布局可以使得一个系统能够在单个LED组或阵列中使用两种不同类型的LED。 本文公开的示例性系统包括用于混合由安装到着陆区域的LED产生的光的元件，例如光学积分腔。

公开(公告)号：US20070051535A1

公开(公告)日：2007-03-08

申请号：US11308935

申请日：2006-05-29

Applicant: CHIH-CHAN GER ,  YU-HSIANG LIAO

Inventor： CHIH-CHAN GER ,  YU-HSIANG LIAO

IPC: H05K1/16

CPC classification number: H05K1/141 ,  H01L2224/48091 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/181 ,  H05K3/328 ,  H05K3/3426 ,  H05K3/3442 ,  H05K2201/09772 ,  H05K2201/1003 ,  H05K2201/10189 ,  H05K2201/10469 ,  H05K2201/10651 ,  H05K2201/10659 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic device includes an electronic component (40), a first printed circuit board (PCB) (100) and a second printed circuit board (200). The electronic component includes a first pin (A1) and a second pin (A2). The first PCB and a second PCB, respectively including first conductor trace lines (102) and second conductor trace lines (108) for electrically connecting the first pin and the second pin. The first PCB is disposed above the second PCB, and is parallel with the second PCB. The first PCB is electrically connected to the second PCB via at least one of the first conductor trace lines and the second conductor trace lines. A surface area of the first PCB is smaller than that of the second PCB.

Abstract translation: 电子设备包括电子部件（40），第一印刷电路板（PCB）（100）和第二印刷电路板（200）。 电子部件包括第一销（A 1）和第二销（A 2）。 第一PCB和第二PCB分别包括用于电连接第一引脚和第二引脚的第一导体迹线（102）和第二导体迹线（108）。 第一PCB设置在第二PCB上方，并与第二PCB平行。 第一PCB经由第一导体迹线和第二导体迹线中的至少一个电连接到第二PCB。 第一PCB的表面积小于第二PCB的表面积。

公开(公告)号：US20070025103A1

公开(公告)日：2007-02-01

申请号：US11541314

申请日：2006-09-29

Applicant: Timothy Chan

Inventor： Timothy Chan

IPC: F21V1/00

CPC classification number: H01R33/09 ,  F21K9/00 ,  F21V19/0025 ,  F21V19/042 ,  F21Y2105/10 ,  F21Y2107/00 ,  F21Y2107/30 ,  F21Y2115/10 ,  H05K3/107 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/09472 ,  H05K2201/09981 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10765 ,  Y10S362/80

Abstract: A method and system for attaching LEDs to circuitry which would protect the LEDs from heat damage and allows for individual LEDs to be removed.

Abstract translation: 一种用于将LED附接到电路的方法和系统，其将保护LED免受热损伤并且允许去除各个LED。

公开(公告)号：US07102212B2

公开(公告)日：2006-09-05

申请号：US11215763

申请日：2005-08-30

Applicant: Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

Inventor： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

IPC: H01L23/495 ,  H01L31/203

CPC classification number: H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

Abstract: In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

公开(公告)号：US20060082315A1

公开(公告)日：2006-04-20

申请号：US10969686

申请日：2004-10-20

Applicant: Timothy Chan

Inventor： Timothy Chan

IPC: H01R33/00 ,  H01J13/46

CPC classification number: H01R33/09 ,  F21V19/0025 ,  F21V19/04 ,  F21Y2115/10 ,  H05K3/107 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/09472 ,  H05K2201/09981 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10765

Abstract: A method and system for attaching LEDs to circuitry which would protect the LEDs from heat damage and allows for individual LEDs to be replace when a LED fails, without a significant increase in manufacturing cost.

Abstract translation: 一种用于将LED附接到电路的方法和系统，其将保护LED免受热损伤，并且当LED失效时允许单独的LED被替换，而不会显着增加制造成本。

公开(公告)号：US20060021792A1

公开(公告)日：2006-02-02

申请号：US10900668

申请日：2004-07-28

Applicant: Bruce Myers ,  Thomas Degenkolb

Inventor： Bruce Myers ,  Thomas Degenkolb

IPC: H05K1/18

CPC classification number: H05K3/3426 ,  H01G9/012 ,  H05K2201/10651 ,  H05K2201/10757 ,  Y02P70/613

Abstract: A surface mountable axial leaded component including a component body, a first component lead and a second component lead. The first component lead extends from a first end of the component body and a second component lead extends from a second end of the component body that is opposite the first end. A portion of the first and second component leads is formed in a loop and a diameter of the loop is at least equal to the diameter of the component body. The loop may be formed as a circular loop, an elliptical loop, a polygon loop, a square loop or rectangular loop, among other loop configurations. When formed as a circular loop, the loop may include a flat segment.

Abstract translation: 一种表面安装的轴向引线元件，包括元件主体，第一元件引线和第二元件引线。 第一部件引线从部件主体的第一端延伸，并且第二部件引线从与第一端相对的部件主体的第二端延伸。 第一和第二部件引线的一部分以环形成，并且环的直径至少等于部件主体的直径。 环可以形成为圆环，椭圆环，多边形环，矩形环或矩形环，以及其他环路配置。 当形成为圆形回路时，环路可以包括平坦段。

公开(公告)号：US20050219829A1

公开(公告)日：2005-10-06

申请号：US11094284

申请日：2005-03-31

Applicant: Kuo-Chun Lee

Inventor： Kuo-Chun Lee

IPC: H05K1/03 ,  H05K1/11 ,  H05K3/30

CPC classification number: H05K1/119 ,  H05K3/306 ,  H05K2201/09418 ,  H05K2201/09854 ,  H05K2201/10651 ,  H05K2201/10863

Abstract: A printed circuit board and an electronic apparatus utilizing the same. The electronic apparatus includes the printed circuit board and a dual-inline-package (DIP) device. The printed circuit board includes a pair of holes. The pair of holes has a geometrical center, and is substantially symmetrical with respect to the geometric center so that each hole is arc-shaped. The DIP device includes a pair of pins, and is disposed on the printed circuit board by inserting the pins into the holes.

Abstract translation: 印刷电路板和利用该印刷电路板的电子设备。 电子设备包括印刷电路板和双列直插封装（DIP）装置。 印刷电路板包括一对孔。 一对孔具有几何中心，并且相对于几何中心基本对称，使得每个孔是弧形的。 DIP器件包括一对引脚，并且通过将引脚插入孔中而设置在印刷电路板上。

公开(公告)号：US20040011556A1

公开(公告)日：2004-01-22

申请号：US10618593

申请日：2003-07-15

Inventor： Satoshi Torii

IPC: H05K001/03 ,  H05K003/42

CPC classification number: H05K3/306 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10651 ,  H05K2201/2036 ,  H05K2203/1178

Abstract: Disclosed is a printed circuit board which is guaranteed to be free of defective soldering in mounting and connecting electric or electronic parts or devices to the printed circuit. The circuit board has a circuit pattern printed on its substrate, and an anti-soldering layer is laid on the circuit pattern to prevent soldering material from sticking to the circuit pattern and silk-screen printing areas are laid on the anti-soldering layer to indicate where selected electric or electronic parts or devices are to be mounted. Each silk-screen printing area has terminal holes made therein. The board has a substrate-exposed zone traversing the silk-screen printing area to leave its opposite extensions open to the surrounding atmosphere, thereby allowing heated air and gases to escape from the interspace between the bottom of the electric or electronic part or device and the exposed substrate.

Abstract translation: 公开了一种印刷电路板，其被保证在将电子或电子部件或装置安装和连接到印刷电路上时没有焊接不良。 电路板具有印刷在其基板上的电路图案，并且在电路图案上放置防焊层，以防止焊接材料粘附到电路图案上，并且丝网印刷区域铺设在防焊层上以指示 在哪里安装选择的电气或电子部件或设备。 每个丝网印刷区域都具有端子孔。 该板具有穿过丝网印刷区域的基板暴露区域，以使其相对的延伸部向周围的大气开放，从而允许加热的空气和气体从电气或电子部件或装置的底部与 曝光底物。