公开(公告)号：US10561210B1

公开(公告)日：2020-02-18

申请号：US16534978

申请日：2019-08-07

申请人： mCube, Inc.

发明人： Kevin Huang ,  Bruence Zhang

IPC分类号： A45B3/04 ,  H05B37/02 ,  H05B33/08 ,  F21V23/04 ,  F21L4/00

摘要： A peripheral for an umbrella having a shaft, a handle and a canopy includes a power source, a sensor for determining when the canopy is open or closed, a light emitting diode (LED) on the top of the umbrella for outputting light, a MEMS accelerometer for determining physical orientations of the umbrella, and a processor for determining whether the umbrella is upright when the physical orientations of the umbrella are within a range of angles wherein the processor is for determining whether the umbrella is in a down configuration when the physical orientations of the umbrella are outside the range of angles, wherein the processor is for coupling the LED to the power source in response to the umbrella being upright and open, and wherein the processor is for decoupling the LED from the power source in response to the umbrella being in a down configuration and closed.

公开(公告)号：US10317333B2

公开(公告)日：2019-06-11

申请号：US14289494

申请日：2014-05-28

申请人： MCube Inc.

发明人： Raymond Merrill, Jr.

IPC分类号： G01N19/02 ,  G01M99/00 ,  B81C99/00

摘要： A system for testing a device under a high gravitational force including a centrifuge with a rotating member and method of operation thereof. An operating power can be applied to a device, which can be coupled to the rotating member. The system can include a rotational control that can be coupled to the centrifuge. This rotational control can be configured to rotate the rotating member in response to a controlled number of revolutions per time period. The system can also include an analysis device for monitoring one or more signals from the device with respect to the controlled number of revolutions per time period. The analysis device can be configured to determine a stiction force associated with the DUT (Device Under Test) in response to the time-varying gravitational forces and to the one or more signals from the DUTs.

公开(公告)号：US10078112B2

公开(公告)日：2018-09-18

申请号：US15236182

申请日：2016-08-12

申请人： mCube Inc.

发明人： Sanjay Bhandari ,  Tony Maraldo

IPC分类号： G06F21/00 ,  G01R31/317 ,  G01R31/3177 ,  G06F21/73

CPC分类号： G01R31/31719 ,  G01R31/31701 ,  G01R31/3177 ,  G06F21/73 ,  G06F2221/2149

摘要： A method is provided for implementing a security mechanism in an integrated MEMS (Micro-Electro-Mechanical-System) device having a MEMS sensor with an output register associated with a sensing operation, the integrated MEMS device being electrically coupled to a computing system programmed to perform the method. The method includes, in normal operation, reading from the output register an output of the sensing operation, and in a test mode, determining, by a processor disposed within the computing system, a random value. Determining the random value can include reading from the output register, which in the test mode or provides a value from an internal pattern generator. The method also includes determining, by the processor, a validation value, reading, by the processor, the random value stored in the output register; and determining, by the processor, whether the integrated device is valid using the validation value and the random value stored in the output register.

公开(公告)号：US10046964B2

公开(公告)日：2018-08-14

申请号：US14302385

申请日：2014-06-11

申请人： mCube Inc.

发明人： Te-Hsi “Terrence” Lee ,  Sudheer S. Sridharamurthy ,  Shingo Yoneoka ,  Wenhua Zhang

IPC分类号： B81B7/00 ,  B81C1/00 ,  B81B3/00

摘要： A method for fabricating an integrated MEMS-CMOS device. The method can include providing a substrate member having a surface region and forming a CMOS IC layer having at least one CMOS device overlying the surface region. A bottom isolation layer can be formed overlying the CMOS IC layer and a shielding layer and a top isolation layer can be formed overlying a portion of bottom isolation layer. The bottom isolation layer can include an isolation region between the top isolation layer and the shielding layer. A MEMS layer overlying the top isolation layer, the shielding layer, and the bottom isolation layer, and can be etched to form at least one MEMS structure having at least one movable structure and at least one anchored structure.

公开(公告)号：US09950924B2

公开(公告)日：2018-04-24

申请号：US14985388

申请日：2015-12-30

申请人： mCube, Inc.

发明人： Sudheer S. Sridharamurthy ,  Te-Hse Terrence Lee ,  Ali J. Rastegar ,  Mugurel Stancu ,  Xiao Charles Yang

IPC分类号： B81C1/00 ,  B81B7/00 ,  H01L27/06 ,  B81B3/00

CPC分类号： B81C1/00801 ,  B81B3/0013 ,  B81B3/0086 ,  B81B7/0022 ,  B81B7/0064 ,  B81B2203/0163 ,  B81B2207/094 ,  B81C1/00238 ,  B81C2201/0132 ,  B81C2201/05 ,  B81C2203/0735 ,  H01L27/0688

摘要： A method for fabricating an integrated MEMS-CMOS device uses a micro-fabrication process that realizes moving mechanical structures (MEMS) on top of a conventional CMOS structure by bonding a mechanical structural wafer on top of the CMOS and etching the mechanical layer using plasma etching processes, such as Deep Reactive Ion Etching (DRIE). During etching of the mechanical layer, CMOS devices that are directly connected to the mechanical layer are exposed to plasma. This sometimes causes permanent damage to CMOS circuits and is termed Plasma Induced Damage (PID). Embodiments of the present invention presents methods and structures to prevent or reduce this PID and protect the underlying CMOS circuits by grounding and providing an alternate path for the CMOS circuits until the MEMS layer is completely etched.

公开(公告)号：US09758374B2

公开(公告)日：2017-09-12

申请号：US14267864

申请日：2014-05-01

申请人： mCube Inc.

发明人： Raymond Merrill, Jr. ,  Dave Paul Jensen ,  Yuan-Chun Liu

IPC分类号： B81C99/00

CPC分类号： B81C99/004 ,  B81C99/0035 ,  B81C99/005

摘要： A centrifuge screening system and method of testing MEMS devices using the system. The wafer level centrifuge screening system can include a base centrifuge system and a cassette mounting hub coupled to the base centrifuge system. The method can include applying a smooth and continuous acceleration profile to one or more MEMS components via the base centrifuge system. Each of the one or more MEMS components can have one or more MEMS devices formed thereon. The one or more MEMS components can be provided in one or more cassettes configured on the cassette mounting hub. The method can also include identifying one or more target MEMS components, which can include identifying stiction in one or more MEMS devices on the one or more MEMS components.

公开(公告)号：US09696337B2

公开(公告)日：2017-07-04

申请号：US14194468

申请日：2014-02-28

申请人： mCube Inc.

发明人： Kevin Huang ,  Chenglong Fu ,  Tan Liang

IPC分类号： G06F3/0346 ,  G01P15/00 ,  G06F3/01 ,  H04M1/725 ,  G01P15/18

CPC分类号： G01P15/00 ,  G01P15/18 ,  G06F3/017 ,  G06F3/0346 ,  H04M1/72569 ,  H04M2250/22

摘要： A portable proximity device and method of operation thereof. The method for proximity detection implemented on a portable device can include determining an initial perturbation data, a tracking point data, and a stable position data with a physical sensor of the portable device. The initial perturbation data can include previous state data and current state data. The tracking point data can include one or more track data. An action to be performed can be determined, by a processor within the portable device, based on the initial perturbation data, the tracking point data, and the stable position data. The portable proximity device can include a physical sensor and a processor configured to perform these steps.

公开(公告)号：US09595479B2

公开(公告)日：2017-03-14

申请号：US14218633

申请日：2014-03-18

申请人： MCube, Inc.

发明人： Xiao (Charles) Yang

IPC分类号： H01L31/036 ,  H01L21/8238 ,  G01L9/00 ,  H01L21/762 ,  H01L27/06 ,  H03H3/007 ,  G01P15/125 ,  G01P15/08 ,  H01L21/822 ,  B81C1/00 ,  H01L29/04 ,  H01L25/065 ,  A61B5/145

CPC分类号： H01L21/823878 ,  A61B5/14514 ,  B81B2201/025 ,  B81B2201/055 ,  B81C1/00246 ,  G01L9/0042 ,  G01L9/0054 ,  G01P15/0802 ,  G01P15/125 ,  H01L21/76254 ,  H01L21/8221 ,  H01L25/0657 ,  H01L27/0688 ,  H01L29/045 ,  H01L2924/0002 ,  H03H3/0073 ,  H01L2924/00

摘要： A method for fabricating a three-dimensional integrated circuit device includes providing a first substrate having a first crystal orientation, forming at least one or more PMOS devices overlying the first substrate, and forming a first dielectric layer overlying the one or more PMOS devices. The method also includes providing a second substrate having a second crystal orientation, forming at least one or more NMOS devices overlying the second substrate, and forming a second dielectric layer overlying the one or more NMOS devices. The method further includes coupling the first dielectric layer to the second dielectric layer to form a hybrid structure including the first substrate overlying the second substrate.

摘要翻译： 一种制造三维集成电路器件的方法包括提供具有第一晶体取向的第一衬底，形成覆盖在第一衬底上的至少一个或多个PMOS器件，以及形成覆盖该一个或多个PMOS器件的第一介电层。 该方法还包括提供具有第二晶体取向的第二衬底，形成覆盖第二衬底的至少一个或多个NMOS器件，以及形成覆盖该一个或多个NMOS器件的第二电介质层。 该方法还包括将第一电介质层耦合到第二电介质层以形成包括覆盖在第二衬底上的第一衬底的混合结构。

公开(公告)号：US09541396B2

公开(公告)日：2017-01-10

申请号：US14160549

申请日：2014-01-21

申请人： mCube Inc.

发明人： Sanjay Bhandari

IPC分类号： G01C19/00 ,  G01P3/44 ,  G01P9/00 ,  G01P15/08 ,  G01C19/5776 ,  G01C19/5783 ,  G01P15/18

CPC分类号： G01C19/5776 ,  G01C19/5783 ,  G01P15/18

摘要： A system comprising an integrated multi-axis MEMS inertial sensor architecture. The system can include a MEMS gyroscope having a MEMS resonator and a MEMS accelerometer overlying a CMOS IC substrate. The CMOS IC substrate can include low noise Charge Sense amplifiers to process the sensed signals, programmable gain amplifiers, a demodulator, mixer, an AGC loop circuit coupled to the MEMS gyroscope to drive MEMS resonator. The CMOS IC also includes programmable Quadrature cancellation, Analog and digital phase shifters are implemented in the architecture to ensure quadrature cancellation and demodulation to achieve optimal performance. The AGC loop acts in a way such that generated desired signal amplitude out of the drive signal maintains MEMS resonator velocity at a desired frequency and amplitude while consuming low power. The MEMS gyroscope and accelerometer can be coupled to an input multiplexer configured to operate in a time-multiplexed manner.

摘要翻译： 包括集成的多轴MEMS惯性传感器架构的系统。 该系统可以包括具有MEMS谐振器的MEMS陀螺仪和覆盖在CMOS IC衬底上的MEMS加速度计。 CMOS IC衬底可以包括用于处理感测信号的低噪声Charge Sense放大器，可编程增益放大器，解调器，混频器，耦合到MEMS陀螺仪的AGC环路以驱动MEMS谐振器。 CMOS IC还包括可编程正交取消，模拟和数字移相器在架构中实现，以确保正交消除和解调以实现最佳性能。 AGC环路的作用方式使得驱动信号中产生的期望信号幅度在消耗低功率的同时将MEMS谐振器速度保持在期望的频率和幅度。 MEMS陀螺仪和加速度计可以耦合到配置为以时间复用方式操作的输入多路复用器。

公开(公告)号：US09440846B2

公开(公告)日：2016-09-13

申请号：US14445012

申请日：2014-07-28

申请人： mCube Inc.

发明人： Xiao “Charles” Yang

IPC分类号： H01L31/02 ,  H01L27/146 ,  B81C1/00

CPC分类号： B81C1/00246 ,  B81B2207/015 ,  B81C1/00396 ,  B81C1/00626 ,  B81C2201/0198 ,  B81C2203/0136

摘要： An integrated MEMS system in which CMOS and MEMS devices are provided to form an integrated CMOS-MEMS system. The system can include a silicon substrate layer, a CMOS layer, MEMS and CMOS devices, and a wafer level packaging (WLP) layer. The CMOS layer can form an interface region, one which any number of CMOS MEMS devices can be configured.

摘要翻译： 提供CMOS和MEMS器件以形成集成的CMOS-MEMS系统的集成MEMS系统。 该系统可以包括硅衬底层，CMOS层，MEMS和CMOS器件以及晶片级封装（WLP）层。 CMOS层可以形成接口区域，可以配置任何数量的CMOS MEMS器件。