摘要:
Optical connectors can be easily attached to and detached from a housing.An optical connector device 11 adapted to be connected to a mating optical connector device 81 includes a first housing 31 for receiving and holding optical connectors 61, a second housing 41 for holding the first housing 31 in a floating manner, and a fixing member 51 for fixedly attaching the second housing 41 to an attachment object 201. To-be-locked portions 35, 37 of the first housing 31 and locking portions 43, 44 of the second housing 41 detachably engage with each other and cause the first housing 31 to engage with the second housing 41 in a floating manner. The to-be-locked portions 35, 37 and the locking portions 43, 44 engage with each other in a direction perpendicular to a direction A1 of connection to the mating optical connector device 81.
摘要:
In an optical connector adapter for use in connecting a first and a second optical connector plug to each other, a second adapter half is butted against a first adapter half in a predetermined direction. The first and second adapter halves have engaging means for maintaining the first and second adapter halves in a butted state in the predetermined direction. The engaging means is configured to be disposed inside the optical connector adapter and to be prevented from releasing engagement thereof by at least one of the first and second optical connector plugs.
摘要:
An optical connector 1 is for connecting a connection object 10 to an optical module 21. A slider 3 is slidably held by a housing 2 adapted for positioning the connection object and the optical module. The housing has a first positioning portion for receiving the connection object. The slider has a first pressing portion 3a for elastically pressing the connection object in a first direction toward the first positioning portion and a second pressing portion 3e that elastically acts in a second direction perpendicular to the first direction.
摘要:
Provided herein is a light-emitting apparatus which is capable of causing the light emitted at the entire face of a fluorescent material to be exteriorly emitted with no interference and with enhanced light emission efficiency, thereby attaining an exteriorly radiated high brightness light. A cathode electrode 10 is mounted on a periphery of a transmission member 30, the anode electrode 15 is also mounted on a domain opposite to a light transmission member 30, and the surface 16a of the fluorescent material 16 to be mounted on a top layer of the anode electrode 15 is formed with a concave face. In accordance therewith, even when the cathode electrode 10 is offset mounted on a periphery of the light transmission member 30 it can be caused to precisely face the surface 16a of the fluorescent material 16 and the excitation light from the entire face of the surface 16a of the fluorescent material 16 can made incident onto the light transmission member 30 without interference from the cathode electrode 10 or the like.
摘要:
Provided herein is a light-emitting apparatus capable of achieving both improved durability and higher brightness with an inexpensive and simple construction. A heat resistant glass substrate 51 is mounted in a vacuum chamber 5, and while an anode electrode 8 (and a light emitter 20) is mounted on the glass substrate, the glass substrate 51 is separated from a glass substrate 11. This precisely protects the vacuum chamber 5 from thermal damage due to light emission upon excitation, even when the current density between the cathode electrode 6 and the anode electrode 8 is controlled at a high level to cause the light emitter 20 to emit light at high brightness. Accordingly, this eliminates the need to make the entire vacuum chamber 5 excessively heat-resistant, permitting construction from an inexpensive material such as soda-lime glass; consequently both improvements in the durability of the light-emitting apparatus 1 and enhancement in brightness thereof can be accomplished with an inexpensive and easy construction.
摘要:
A light-emitting apparatus of the present invention maintains an anode electrode 5 at a higher positive electric potential than a cathode electrode 15, applies an electric field to a cold-cathode electron emission source 16 by controlling a gate voltage applied to the cathode electrode 15 with a gate electrode 10, and emits excitation light from a phosphor 6 irradiated by an electron beam released from the cold-cathode electron emission source 16. The light-emitting apparatus of this invention emits the excitation light not only from the opposite side of the electron beam-irradiated surface of the phosphor 6 through a glass substrate 2, but also from the electron bean-irradiated surface of the phosphor 6 by reflecting the excitation light with a gate reflection surface 12 on the gate electrode 10 and emitting it through an unobstructed area Ro of the glass substrate 2. This eliminates the wasted excitation light emitted and absorbed within the apparatus as in the conventional light-emitting apparatuses to thereby improve the luminous efficiency and substantially increase the amount of light emitted outside from the entire illumination surface.
摘要:
Submount substrates are connected to both sides of a laser diode via hard solders. The lower submount substrate and a heat sink are connected together by a soft solder. The heat sink and a presser electrode are fixed with a predetermined gap therebetween via an insulating spacer. A coil electrode is fitted in a V-shaped groove of the presser electrode. As the coil electrode is deformed slightly elastically, the coil electrode is pressed against the upper submount substrate.
摘要:
An LSI package having an optical interface is mounted on a surface of a photoelectric wiring board. The photoelectric wiring board and the optical interface are optically connected with sufficient precision. A wiring board side guide member including socket pins and guide pins is soldered and fixed onto the photoelectric wiring board including an optical transmission line, a guide pin, and a mirror. An optical interface side guide member having a fitting hole is glued to the optical interface. The optical interface is mounted on an interposer of the LSI package. The guide pin of the photoelectric wiring board is fitted into the fitting hole formed through the interposer. The guide pin of the guide member is fitted into the fitting hole of the guide member. As a result, position alignment between the optical interface and the photoelectric wiring board is conducted with high precision.
摘要:
The present invention provides a substrate structure comprising: a plurality of electrodes provided on a substrate, each of the electrodes comprising an electrode pad on the substrate and a bump on the electrode pad; and a solder resist layer provided over the substrate, so that the solder resist layer extends in gaps between the electrodes and covers the electrode pads and the bumps except for at least top portions of the bumps, whereby top portions of the bumps are positioned higher than a surface of the solder resist layer to have the solder resist layer isolate adjacent two of the electrodes.