公开(公告)号：US5502137A

公开(公告)日：1996-03-26

申请号：US344905

申请日：1994-11-25

Applicant: James C. Matayabas, Jr. ,  Peter B. MacKenzie ,  John A. Hyatt

Inventor： James C. Matayabas, Jr. ,  Peter B. MacKenzie ,  John A. Hyatt

IPC: C08G65/14 ,  C08G65/20 ,  C08G65/28 ,  C08G65/322 ,  C08G65/08

CPC classification number: C08G65/14 ,  C08G65/20 ,  C08G65/322

Abstract: Disclosed are novel polyether compounds obtained by the reaction or polymerization of 3,4-epoxy-1-butene in the presence of tetrahydrofuran, an acidic catalyst and a nucleophilic initiator compound. The polyether compounds comprise m units of residue (1), n units of residue (2), and p units of residue (3) wherein (i) residues (1), (2) and (3) have the structures: ##STR1## (ii) the total value of m+n+p is 5 to 70; (iii) the value of n/(m+n+p) is in the range of 0.2 to 0.4, i.e., residue (2) constitutes from 20 to 40 mole percent of the total moles of residues (1), (2) and (3); and (iv) at least 98 percent of the terminal groups have the structure: ##STR2##

Abstract translation: 公开了在四氢呋喃，酸性催化剂和亲核引发剂化合物的存在下通过3,4-环氧-1-丁烯的反应或聚合获得的新型聚醚化合物。 聚醚化合物包括m个残基（1），n个残基（2）单元和p个残基（3）单元，其中（i）残基（1），（2）和（3）具有以下结构：

公开(公告)号：US09101931B2

公开(公告)日：2015-08-11

申请号：US11966560

申请日：2007-12-28

Applicant: Lakshmi Supriya ,  James C. Matayabas, Jr. ,  Nirupama Chakrapani

Inventor： Lakshmi Supriya ,  James C. Matayabas, Jr. ,  Nirupama Chakrapani

IPC: B01J19/00 ,  B01L3/00 ,  B29C65/00

CPC classification number: B01L3/502707 ,  B01J2219/00527 ,  B01J2219/00605 ,  B01J2219/00619 ,  B01L3/502715 ,  B01L2200/025 ,  B01L2200/027 ,  B01L2200/0605 ,  B01L2200/10 ,  B01L2300/046 ,  B01L2300/0627 ,  B01L2300/0816 ,  B01L2300/0819 ,  B01L2300/0822 ,  B01L2300/0867 ,  B01L2300/089 ,  B01L2300/16 ,  B01L2300/161 ,  B01L2300/165 ,  B01L2400/0406 ,  B01L2400/0688 ,  B05D3/12 ,  B05D5/00

Abstract: A microelectronic package includes a die which may include MEMS and CMOS circuitry for analyzing a fluid. A defined path is provided for channeling fluid to the die. Rather than patterning depressions or physical channels in the package substrate, the defined paths comprise coatings that may channel the flow of liquids to the die for biological sensor type applications. The defined paths may comprise a wetting coating that has an affinity to fluids. Similarly, the defined paths may comprise a dewetting coating the tend to repel fluid surrounding the paths.

Abstract translation: 微电子封装包括可以包括用于分析流体的MEMS和CMOS电路的管芯。 提供了将流体引导到管芯的限定的路径。 定义的路径不是在封装衬底中图案化凹陷或物理通道，而是包括可以将液体流引导到用于生物传感器类型应用的管芯的涂层。 所定义的路径可以包括对流体具有亲和性的润湿涂层。 类似地，所定义的路径可以包括去潮涂层，其倾向于排斥路径周围的流体。

公开(公告)号：US08901716B2

公开(公告)日：2014-12-02

申请号：US12774681

申请日：2010-05-05

Applicant: James C. Matayabas, Jr.

Inventor： James C. Matayabas, Jr.

IPC: H01L23/58 ,  H05B6/00 ,  H01L23/532 ,  H01L21/768 ,  H05K3/46 ,  B29C47/00 ,  B29C45/14 ,  B29D7/00 ,  H01L21/56

CPC classification number: H01L23/53295 ,  H01L21/563 ,  H01L21/76828 ,  H01L23/5329 ,  H01L2924/0002 ,  H05K3/4626 ,  H05K2201/0141 ,  H05K2201/068 ,  H05K2203/104 ,  Y10T428/25 ,  H01L2924/00

Abstract: An embodiment of the present invention is a technique to provide a dielectric film material with controllable coefficient of thermal expansion (CTE). A first compound containing a first liquid crystalline component is formed. The first compound is cast into a first film. The first film is oriented in an magnetic or electromagnetic field in a first direction. The first film is cured at a first temperature.

Abstract translation: 本发明的一个实施方案是提供具有可控制的热膨胀系数（CTE）的电介质膜材料的技术。 形成含有第一液晶成分的第一化合物。 第一种化合物被铸成第一片。 第一膜在第一方向上的磁场或电磁场中取向。 第一个膜在第一个温度下固化。

公开(公告)号：US20140264957A1

公开(公告)日：2014-09-18

申请号：US13801059

申请日：2013-03-13

Applicant: Randall D. Lowe, JR. ,  Suriyakala Suriya Ramalingam ,  Nisha Ananthakrishnan ,  James C. Matayabas, JR. ,  Arjun Krishnan ,  Hitesh Arora

Inventor： Randall D. Lowe, JR. ,  Suriyakala Suriya Ramalingam ,  Nisha Ananthakrishnan ,  James C. Matayabas, JR. ,  Arjun Krishnan ,  Hitesh Arora

IPC: C09D11/10 ,  H01L23/28

CPC classification number: H01L21/56 ,  C09D11/101 ,  C09D11/20 ,  H01L23/296 ,  H01L23/544 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Methods for covalently and indelibly anchoring a polyacrylate polymer using a UV-induced polymerization process in the presence of a photoinitiator to an oxide surface are disclosed herein. The methods and compositions prepared by the methods can be used as indelible marking materials for use on microelectronic packages and as solder and sealant barriers to prevent overspreading of liquids on the oxide surfaces of microelectronic packages.The polyacrylate polymers are covalently linked to the oxide surface by use during the printing and UV-curing process of an adhesion promoter having as a first domain an oxide-reactive silyl group, bonded via a linker to an acrylate-reactive group.

Abstract translation: 本文公开了在光引发剂存在下使用UV诱导的聚合方法将聚丙烯酸酯聚合物共价且不可分割地锚定到氧化物表面的方法。 通过该方法制备的方法和组合物可用作用于微电子封装的不可擦除的标记材料，以及用作焊料和密封剂屏障以防止液体在微电子封装的氧化物表面上的过度扩散。 在通过连接剂与丙烯酸酯反应性基团键合的作为第一结构域的氧化物反应性甲硅烷基的粘合促进剂的印刷和UV固化过程中，聚丙烯酸酯聚合物共价连接到氧化物表面。

公开(公告)号：US07816171B2

公开(公告)日：2010-10-19

申请号：US11866795

申请日：2007-10-03

Applicant: Paul A. Koning ,  James C. Matayabas, Jr.

Inventor： Paul A. Koning ,  James C. Matayabas, Jr.

IPC: H01L21/00

CPC classification number: H05K3/005 ,  H01L2224/16225 ,  H01L2924/1461 ,  H01L2924/15311 ,  H05K1/0373 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/4664 ,  H05K2201/09036 ,  H05K2203/0108 ,  H05K2203/1189 ,  H05K2203/122 ,  H01L2924/00

Abstract: Dielectric materials comprising release agents are described. Also described are a process for improving the processability of dielectric materials during hot embossing, substrates prepared by hot embossing, and integrated-circuit packages comprising the improved substrate.

Abstract translation: 描述了包含脱模剂的介电材料。 还描述了一种改善热压花期间介电材料的加工性能的方法，通过热压花制备的基材和包含改进的基材的集成电路封装。

公开(公告)号：US07671120B2

公开(公告)日：2010-03-02

申请号：US11326954

申请日：2006-01-06

Applicant: James C. Matayabas, Jr.

Inventor： James C. Matayabas, Jr.

IPC: C08K5/24

CPC classification number: H01L23/3737 ,  C08G77/12 ,  C08G77/20 ,  C08K3/013 ,  C08K3/08 ,  C08K3/22 ,  C08K3/28 ,  C08K9/02 ,  C08K2201/001 ,  C08L83/00 ,  C08L83/04 ,  H01L23/36 ,  H01L23/42 ,  H01L23/49833 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/3011 ,  H01L2224/0401

Abstract: A curable material useful as thermal material comprises at least one vinyl-terminated silicone oil, at least one conductive filler, and at least one hydrogen terminated silicone oil. The hydrogen terminated silicone oil is used to reduce a shear modulus G′ of the cured thermal interface material.

Abstract translation: 可用作热材料的可固化材料包括至少一种乙烯基封端的硅油，至少一种导电填料和至少一种氢封端的硅油。 氢封端的硅油用于降低固化的热界面材料的剪切模量G'。

公开(公告)号：US07666768B2

公开(公告)日：2010-02-23

申请号：US11541112

申请日：2006-09-29

Applicant: Nachiket R. Raravikar ,  Daewoong Suh ,  Leonel Arana ,  James C. Matayabas, Jr.

Inventor： Nachiket R. Raravikar ,  Daewoong Suh ,  Leonel Arana ,  James C. Matayabas, Jr.

IPC: H01L21/20

CPC classification number: H01L21/76898 ,  H01L23/53276 ,  H01L2221/1094 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method, apparatus and various material-architectures in an electrically conductive through die via formed of a composite material with a continuous phase of matrix metal and a dispersed phase of graphitic structures of carbon, wherein bulk material properties of the composite material differ from similar bulk material properties of the matrix metal.

Abstract translation: 导电通孔模具中的方法，装置和各种材料结构，其由具有基体金属的连续相的复合材料和碳的石墨结构的分散相形成，其中复合材料的散装材料性质与类似体积不同 基体金属的材料性质。

公开(公告)号：US07465605B2

公开(公告)日：2008-12-16

申请号：US11304403

申请日：2005-12-14

Applicant: Nachiket R. Raravikar ,  James C. Matayabas, Jr.

Inventor： Nachiket R. Raravikar ,  James C. Matayabas, Jr.

IPC: H01L51/40

CPC classification number: B81C1/00206 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/16 ,  C01B32/174 ,  C01B2202/02 ,  C01B2202/06 ,  C01B2202/08 ,  H01L23/373 ,  H01L23/433 ,  H01L24/28 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/16152 ,  Y10S977/742 ,  Y10S977/745 ,  Y10S977/746 ,  Y10T428/25 ,  H01L2924/00

Abstract: An embodiment of the present invention is a technique to functionalize carbon nanotubes in situ. A carbon nanotube (NT) array is grown or deposited on a substrate. The NT array is functionalized in situ with a polymer by partial thermal degradation of the polymer to form a NT structure. The functionalization of the NT structure is characterized. The functionalized NT structure is processed according to the characterized functionalization.

Abstract translation: 本发明的一个实施方案是用于原位官能化碳纳米管的技术。 碳纳米管（NT）阵列生长或沉积在基底上。 NT阵列与聚合物原位官能化，聚合物通过部分热降解形成NT结构。 特征是NT结构的功能化。 功能化的NT结构根据表征的功能化进行处理。

公开(公告)号：US07365414B2

公开(公告)日：2008-04-29

申请号：US10750459

申请日：2003-12-31

Applicant: Paul A. Koning ,  James C Matayabas, Jr.

Inventor： Paul A. Koning ,  James C Matayabas, Jr.

IPC: H01L23/58

CPC classification number: H05K3/005 ,  H01L2224/16225 ,  H01L2924/1461 ,  H01L2924/15311 ,  H05K1/0373 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/4664 ,  H05K2201/09036 ,  H05K2203/0108 ,  H05K2203/1189 ,  H05K2203/122 ,  H01L2924/00

Abstract: Dielectric materials comprising release agents are described. Also described are a process for improving the proccessability of dielectric materials during hot embossing, substrates prepared by hot embossing, and integrated-circuit packages comprising the improved substrate.

Abstract translation: 描述了包含脱模剂的介电材料。 还描述了一种用于改善热压花期间的电介质材料的可操作性，通过热压花制备的衬底以及包含改进的衬底的集成电路封装的方法。

公开(公告)号：US07179689B2

公开(公告)日：2007-02-20

申请号：US11282255

申请日：2005-11-18

Applicant: James C. Matayabas, Jr. ,  Gudbjorg H. Oskarsdottir ,  Mitesh C. Patel

Inventor： James C. Matayabas, Jr. ,  Gudbjorg H. Oskarsdottir ,  Mitesh C. Patel

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L23/3128 ,  H01L23/3135 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/82 ,  H01L2224/85 ,  H01L2224/86 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Numerous embodiments of an apparatus and method to stress and warpage of semiconductor packages are described. In one embodiment, a semiconductor die is disposed above a substrate. An encapsulating material is disposed above the substrate and semiconductor die, in which the encapsulating material has a combination of a low coefficient of thermal expansion material and a high coefficient of thermal expansion material.