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    METHOD OF MANUFACTURING NON-SHRINKAGE CERAMIC SUBSTRATE AND NON-SHRINKAGE CERAMIC SUBSTRATE USING THE SAME
    31.
    发明申请
    METHOD OF MANUFACTURING NON-SHRINKAGE CERAMIC SUBSTRATE AND NON-SHRINKAGE CERAMIC SUBSTRATE USING THE SAME 审中-公开
    使用该方法制造非收缩陶瓷基板和非收缩陶瓷基板

    公开(公告)号：US20090114434A1

    公开(公告)日：2009-05-07

    申请号：US12264883

    申请日：2008-11-04

    Applicant: Min Ji Ko ,  Jong Myeon Lee ,  Eun Tae Park

    Inventor： Min Ji Ko ,  Jong Myeon Lee ,  Eun Tae Park

    IPC: H05K3/10 ,  H05K1/00

    CPC classification number: H05K3/4667 ,  H05K1/0306 ,  H05K3/1291 ,  H05K3/38 ,  H05K3/4611 ,  H05K2201/017 ,  H05K2203/025 ,  H05K2203/1126 ,  H05K2203/1476 ,  H05K2203/308

    Abstract: There is provided a method of manufacturing a non-shrinkage ceramic substrate, and a non-shrinkage ceramic substrate using the same. A method of manufacturing a non-shrinkage ceramic substrate by firing a ceramic laminate including an internal electrode circuit pattern according to an aspect of the invention may include: laminating at least one constraining ceramic sheet on each of the upper and lower surfaces of the ceramic laminate to form constraining layers; performing a primary firing process on the ceramic laminate having the constraining layers thereon; polishing the surface of the ceramic laminate from which the constraining layers are removed; forming ceramic paste on the polished surface of the ceramic laminate while exposing connection terminals of the internal electrode circuit pattern to the outside environment through openings in the ceramic paste; forming a surface electrode on the surface of the ceramic paste by patterning so that the surface electrode is electrically connected to the connection terminals; and performing a secondary firing process so that the surface electrode adheres to the ceramic paste.

    Abstract translation: 提供了一种制造非收缩陶瓷基板的方法和使用其的非收缩陶瓷基板。 通过烧结根据本发明的一个方面的内部电极电路图案的陶瓷层压体制造非收缩陶瓷基板的方法可以包括：在陶瓷层压体的上表面和下表面的每一个上层叠至少一个约束陶瓷片 形成约束层; 在其上具有约束层的陶瓷层压板上进行初步烧制工艺; 抛光除去约束层的陶瓷层压体的表面; 在陶瓷层压板的抛光表面上形成陶瓷浆料，同时通过陶瓷膏中的开口将内部电极电路图案的连接端子暴露于外部环境; 通过图案化在陶瓷浆料的表面上形成表面电极，使得表面电极电连接到连接端子; 并进行二次烧成工序，使表面电极粘附在陶瓷糊上。

    CONSTRAINING GREEN SHEET AND METHOD OF MANUFACTURING MULTI-LAYER CERAMIC SUBSTRATE USING THE SAME
    32.
    发明申请
    CONSTRAINING GREEN SHEET AND METHOD OF MANUFACTURING MULTI-LAYER CERAMIC SUBSTRATE USING THE SAME 失效
    约束绿色板材及使用其制造多层陶瓷基板的方法

    公开(公告)号：US20090110893A1

    公开(公告)日：2009-04-30

    申请号：US12260042

    申请日：2008-10-28

    Applicant: Beom Joon Cho ,  Jong Myeon Lee ,  Ho Sung Choo

    Inventor： Beom Joon Cho ,  Jong Myeon Lee ,  Ho Sung Choo

    IPC: B32B7/02 ,  B32B9/04 ,  B32B37/06

    CPC classification number: H05K3/4611 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2201/0266 ,  H05K2203/308 ,  Y10T428/24992

    Abstract: Provided are a constraining green sheet and a method of manufacturing a multi-layer ceramic substrate using the same. The constraining green sheet includes a first constraining layer and a second constraining layer. The first constraining layer has a side to be disposed on a multi-layer ceramic laminated structure and is formed of a first inorganic powder having a first particle diameter. The second constraining layer is disposed on the top of the first constraining layer and is formed of a second inorganic powder having a second particle diameter larger than the first particle diameter. Thus, a shrinkage suppression rate can be increased and a de-binder passage can be secured in a firing process of the ceramic laminated structure by using the constraining green sheet formed of inorganic powders that are different in terms of density and particle diameter.

    Abstract translation: 本发明提供约束生片和使用其的多层陶瓷基片的制造方法。 约束生片包括第一约束层和第二约束层。 第一约束层具有设置在多层陶瓷层叠结构上的一侧，并且由具有第一粒径的第一无机粉末形成。 第二约束层设置在第一约束层的顶部，并由具有大于第一粒径的第二粒径的第二无机粉末形成。 因此，通过使用由密度和粒径不同的无机粉末形成的约束生片，可以在陶瓷层叠结构的烧成工序中确保收缩抑制率，并且可以确保脱粘合剂通道。

    Process for fabricating a field emitter electrode with carbon nanotubes
    33.
    发明授权
    Process for fabricating a field emitter electrode with carbon nanotubes 失效
    用碳纳米管制造场发射极的方法

    公开(公告)号：US07473153B2

    公开(公告)日：2009-01-06

    申请号：US11064966

    申请日：2005-02-25

    Applicant: Hyoung Dong Kang ,  Hyun Chul Jung ,  Sang Moon Lee ,  Jong Myeon Lee

    Inventor： Hyoung Dong Kang ,  Hyun Chul Jung ,  Sang Moon Lee ,  Jong Myeon Lee

    IPC: H01J9/24

    CPC classification number: H01J9/025 ,  B82Y10/00 ,  B82Y30/00 ,  H01J2201/30469

    Abstract: A process for fabricating a field emitter electrode includes: impregnating a cathode and anode in an electrolyte containing carbon nanotubes dispersed therein and applying a predetermined voltage to the cathode and anode so as to deposit carbon nanotubes on a substrate provided on the anode; recovering the substrate and applying a conductive polymer onto the surface of the substrate having carbon nanotubes deposited thereon; and heat treating the conductive polymer having carbon nanotubes deposited thereon, so as to completely cure it.

    Abstract translation: 制造场致发射电极的方法包括：在分散在其中的含有碳纳米管的电解质中浸渍阴极和阳极，并向阴极和阳极施加预定电压，以将碳纳米管沉积在设置在阳极上的衬底上; 回收衬底并将导电聚合物施加到其上沉积有碳纳米管的衬底的表面上; 并对其上沉积有碳纳米管的导电聚合物进行热处理，以使其完全固化。

    Light emitting diode package
    34.
    发明申请
    Light emitting diode package 有权
    发光二极管封装

    公开(公告)号：US20070194338A1

    公开(公告)日：2007-08-23

    申请号：US11708459

    申请日：2007-02-21

    Applicant: Ho Sung Choo ,  Youn Gon Park ,  Jong Myeon Lee

    Inventor： Ho Sung Choo ,  Youn Gon Park ,  Jong Myeon Lee

    IPC: H01L33/00

    CPC classification number: H01L33/56 ,  H01L33/54

    Abstract: A light emitting diode package with reduced light loss includes a package substrate, a light emitting diode chip mounted on the package substrate and an encapsulant formed on the package substrate to encapsulate the light emitting diode chip. The encapsulant has a refractive index gradient with refractive indices continuously increasing from a peripheral surface thereof to a central axis thereof.

    Abstract translation: 具有降低的光损耗的发光二极管封装包括封装衬底，安装在封装衬底上的发光二极管芯片和形成在封装衬底上以封装发光二极管芯片的密封剂。 密封剂具有从其外周表面到其中心轴线的折射率连续增加的折射率梯度。

    PATCH ANTENNA AND WIRELESS COMMUNICATIONS MODULE
    38.
    发明申请
    PATCH ANTENNA AND WIRELESS COMMUNICATIONS MODULE 审中-公开
    天线和无线通信模块

    公开(公告)号：US20110063174A1

    公开(公告)日：2011-03-17

    申请号：US12647610

    申请日：2009-12-28

    Applicant: Yun Hee CHO ,  Jong Myeon LEE ,  Je Hong SUNG

    Inventor： Yun Hee CHO ,  Jong Myeon LEE ,  Je Hong SUNG

    IPC: H01Q1/38 ,  H01Q1/24

    CPC classification number: H01Q9/0457

    Abstract: There is provided a patch antenna. The patch antenna includes a high dielectric constant substrate having a cavity, a radiator disposed on a portion of one surface of the high dielectric constant substrate corresponding to the cavity, a feeder line disposed on the high dielectric constant substrate and supplying a signal to the radiator, and a ground part disposed on the high dielectric constant substrate.

    Abstract translation: 提供贴片天线。 贴片天线包括具有空腔的高介电常数衬底，布置在对应于空腔的高介电常数衬底的一个表面的一部分上的散热器，设置在高介电常数衬底上并将信号提供给散热器的馈电线 和设置在高介电常数衬底上的接地部分。

    METHOD OF FORMING PHOSPHOR FILM AND METHOD OF MANUFACTURING LIGHT EMITTING DIODE PACKAGE INCORPORATING THE SAME
    39.
    发明申请
    METHOD OF FORMING PHOSPHOR FILM AND METHOD OF MANUFACTURING LIGHT EMITTING DIODE PACKAGE INCORPORATING THE SAME 有权
    形成磷光体膜的方法及其制造发光二极管包装的方法

    公开(公告)号：US20110043100A1

    公开(公告)日：2011-02-24

    申请号：US12914042

    申请日：2010-10-28

    Applicant: Hai Sung LEE ,  Jong Myeon Lee ,  Ho Sung Choo ,  Myung Whun Chang ,  Youn Gon Park

    Inventor： Hai Sung LEE ,  Jong Myeon Lee ,  Ho Sung Choo ,  Myung Whun Chang ,  Youn Gon Park

    IPC: H01J1/63 ,  C09K11/06 ,  B82Y30/00

    CPC classification number: C09K11/7749 ,  C09K11/025 ,  H01L33/502 ,  H01L2933/0041

    Abstract: The invention relates to a method of forming a phosphor film and a method of manufacturing an LED package incorporating the same. The method of forming a phosphor film includes mixing phosphor and light-transmitting beads in an aqueous solvent such that the nano-sized light-transmitting beads having a first charge are adsorbed onto surfaces of phosphor particles having a second charge. The method also includes coating a phosphor mixture obtained from the mixing step on an area where the phosphor film is to be formed, and drying the coated phosphor mixture to form the phosphor film. The invention further provides a method of manufacturing an LED package incorporating the method of forming the phosphor film.

    Abstract translation: 本发明涉及一种形成荧光膜的方法及其制造方法。 形成荧光体膜的方法包括在水性溶剂中混合荧光体和透光珠，使得具有第一电荷的纳米尺寸的透光珠吸附在具有第二电荷的荧光体颗粒的表面上。 该方法还包括将从混合步骤获得的荧光体混合物涂覆在要形成荧光膜的区域上，并干燥涂覆的荧光体混合物以形成荧光膜。 本发明还提供一种制造包含形成荧光膜的方法的LED封装的方法。

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