Abstract:
The present invention provides a semiconductor memory device and a method of preventing the contact between a dielectric layer of a capacitor and a diffusion barrier. The plug to be contacted to an electrode of a capacitor, comprises a diffusion barrier layer and a conducting layer. The conducting layer is formed with a material capable of flowing current when the conducting layer is oxidized. Accordingly, it is possible to prevent the dielectric layer being contacted with the diffusion barrier, there by the leakage current may be reduced, and the capacitance of the capacitor may be increased.
Abstract:
A circuit for controlling a liquid crystal rear-vision mirror is disclosed. The liquid crystal rear-vision mirror is equipped in an automobile to sense the amount of lights incident upon the mirror itself from a headlight of another automobile following behind. When the level of incident lights goes higher than a pre-determined level, the circuit generates a pulse signal of a fixed period to make the liquid crystal shutter properly function so that the amount of said incident light reflecting from the mirror to the driver will be decreased to a level adequate to secure driving safety.
Abstract:
A floating offshore structure is disclosed. The floating offshore structure, which is for drilling or production, includes a semi-submerged platform body in the shape of a cylinder that is extended vertically above and below the sea level. The platform body is formed with a concave part that reduces its cross-sectional area. The concave part is discontinuously formed along an external circumferential surface of the platform body. The depth of submergence of the platform body is adjusted so that the water line is located at the concave part in an extreme marine condition.
Abstract:
A nonvolatile memory device includes a pipe gate having a pipe channel hole; a plurality of interlayer insulation layers and a plurality of gate electrodes alternately stacked over the pipe gate; a pair of columnar cell channels passing through the interlayer insulation layers and the gate electrodes and coupling a pipe channel formed in the pile channel hole; a first blocking layer and a charge trapping and charge storage layer formed on sidewalls of the columnar cell channels; and a second blocking layer formed between the first blocking layer and the plurality of gate electrodes.
Abstract:
A semiconductor device including a conductive layer, a diffusion barrier layer formed over the conductive layer, including a refractory metal compound, and acquired after a surface treatment, and a metal silicide layer formed over the diffusion barrier layer. The adhesion between a diffusion barrier layer and a metal silicide layer may be improved by increasing the surface energy of the diffusion barrier layer through a surface treatment. Therefore, although the metal silicide layer is fused in a high-temperature process, it is possible to prevent a void from being caused at the interface between the diffusion barrier layer and the metal silicide layer. Moreover, it is possible to increase the adhesion between a conductive layer and the diffusion barrier layer by increasing the surface energy of the conductive layer through the surface treatment.
Abstract:
A non-volatile memory device includes a plurality of memory cells stacked along a channel protruded from a substrate, a first select transistor connected to one end of the plurality of memory cells, a first interlayer dielectric layer for being coupled between a source line and the first select transistor, and a second interlayer dielectric layer disposed between the first select transistor and the one end of the plurality of memory cells, and configured to include a first recess region.
Abstract:
A nonvolatile memory device includes a channel protruding in a vertical direction from a substrate, a plurality of interlayer dielectric layers and gate electrode layers which are alternately stacked over the substrate along the channel, and a memory layer formed between the channel and a stacked structure of the interlayer dielectric layers and gate electrode layers. Two or more gate electrode layers of the plurality of gate electrode layers are coupled to an interconnection line to form a selection transistor.
Abstract:
The present invention relates to a method and apparatus for processing a HARQ ACK/NACK signal. The method for processing a HARQ ACK/NACK signal according to the present invention comprises the following steps: bundling predetermined HARQ ACK/NACK signals from among a plurality of HARQ ACK/NACK signals; ordering transmission-object HARQ ACK/NACK signal including the bundled HARQ ACK/NACK signals; segmenting the ordered transmission-object HARQ ACK/NACK signals; and channel-coding the segmented transmission object HARQ ACK/NACK signals according to the ordered sequence. The method for processing a HARQ ACK/NACK signals according to the present invention may be performed in a terminal which transmits a HARQ ACK/NACK signal through a PUCCH format 3 in a TDD (Time Division Duplex) environment.
Abstract:
Provided are a nonvolatile memory device and a method for fabricating the same, which can secure the structural stability of a three-dimensional nonvolatile memory device. The nonvolatile memory device includes one or more columnar channel plugs, a plurality of word lines and a plurality of dielectric layers stacked alternately to surround the columnar channel plug, a memory layer disposed between the word line and the columnar channel plug, a plurality of word line connection portions, each of the word line connection portions connecting ends of word lines of a common layer from among the plurality of word lines, and a plurality of word line extension portions extending from the word line connection portions.
Abstract:
A non-volatile memory device includes a pair of columnar cell channels vertically extending from a substrate, a doped pipe channel arranged to couple lower ends of the pair of columnar cell channels, insulation layers over the substrate in which the doped pipe channel is buried, memory layers arranged to surround side surfaces of the columnar cell channels, and control gate electrodes arranged to surround the memory layers.