公开(公告)号：US20120083123A1

公开(公告)日：2012-04-05

申请号：US13012836

申请日：2011-01-25

申请人： Josephine B. Chang ,  Leslie Charns ,  Jason E. Cummings ,  Michael A. Guillorn ,  Lukasz J. Hupka ,  Dinesh R. Koli ,  Tomohisa Konno ,  Mahadevaiyer Krishnan ,  Michael F. Lofaro ,  Jakub W. Nalaskowski ,  Masahiro Noda ,  Dinesh K. Penigalapati ,  Tatsuya Yamanaka

发明人： Josephine B. Chang ,  Leslie Charns ,  Jason E. Cummings ,  Michael A. Guillorn ,  Lukasz J. Hupka ,  Dinesh R. Koli ,  Tomohisa Konno ,  Mahadevaiyer Krishnan ,  Michael F. Lofaro ,  Jakub W. Nalaskowski ,  Masahiro Noda ,  Dinesh K. Penigalapati ,  Tatsuya Yamanaka

IPC分类号： H01L21/306

CPC分类号： H01L21/31053 ,  H01L29/517 ,  H01L29/6653 ,  H01L29/66545

摘要： A planarization method includes planarizing a semiconductor wafer in a first chemical mechanical polish step to remove overburden and planarize a top layer leaving a thickness of top layer material over underlying layers. The top layer material is planarized in a second chemical mechanical polish step to further remove the top layer and expose underlying layers of a second material and a third material such that a selectivity of the top layer material to the second material to the third material is between about 1:1:1 to about 2:1:1 to provide a planar topography.

摘要翻译： 平面化方法包括在第一化学机械抛光步骤中平坦化半导体晶片以去除覆盖层并平坦化顶层，从而在顶层之上留下厚度的顶层材料。 顶层材料在第二化学机械抛光步骤中被平坦化，以进一步去除顶层并暴露第二材料和第三材料的下层，使得顶层材料对第二材料对第三材料的选择性在 约1：1至约2：1：1，以提供平面形貌。

公开(公告)号：US20120083122A1

公开(公告)日：2012-04-05

申请号：US13012142

申请日：2011-01-24

申请人： Leslie Charns ,  Jason E. Cummings ,  Lukasz J. Hupka ,  Dinesh R. Koli ,  Tomohisa Konno ,  Mahadevaiyer Krishnan ,  Michael F. Lofaro ,  Jakub W. Nalaskowski ,  Masahiro Noda ,  Dinesh K. Penigalapati ,  Tatsuya Yamanaka

发明人： Leslie Charns ,  Jason E. Cummings ,  Lukasz J. Hupka ,  Dinesh R. Koli ,  Tomohisa Konno ,  Mahadevaiyer Krishnan ,  Michael F. Lofaro ,  Jakub W. Nalaskowski ,  Masahiro Noda ,  Dinesh K. Penigalapati ,  Tatsuya Yamanaka

IPC分类号： H01L21/306

CPC分类号： H01L21/31053 ,  H01L29/517 ,  H01L29/6653 ,  H01L29/66545

摘要： A polishing method includes polishing, in a first polish, a wafer to remove overburden and planarize a top layer leaving a portion remaining on an underlying layer. A second polishing step includes two phases. In a first phase, the top layer is removed and the underlying layer is exposed, with a top layer to underlying layer selectivity of between about 1:1 to about 2:1 to provide a planar topography. In a second phase, residual portions of the top layer are removed from a top of the underlying layer to ensure complete exposure of an underlying layer surface.

摘要翻译： 抛光方法包括在第一抛光剂中抛光晶片以去除覆盖层并平坦化顶层，留下保留在下层上的部分。 第二抛光步骤包括两个阶段。 在第一阶段中，去除顶层并暴露下层，其顶层至基层选择性为约1:1至约2:1，以提供平面形貌。 在第二阶段中，顶层的残余部分从下层的顶部去除，以确保下层的表面完全曝光。

公开(公告)号：US20090305616A1

公开(公告)日：2009-12-10

申请号：US12135315

申请日：2008-06-09

申请人： Michael A. Cobb ,  Dinesh R. Koli ,  Michael F. Lofaro ,  Dennis G. Manzer ,  Praneetha Poloju ,  James A. Tornello

发明人： Michael A. Cobb ,  Dinesh R. Koli ,  Michael F. Lofaro ,  Dennis G. Manzer ,  Praneetha Poloju ,  James A. Tornello

IPC分类号： B24B7/10

CPC分类号： B24B37/042 ,  B24B37/11

摘要： A glass mold polishing structure and method. The method includes providing a polishing tool comprising mounting plate, a chuck plate over and mechanically attached to the mounting plate, and a pad structure over and mechanically attached to the chuck plate. A retaining structure is attached the chuck plate. A glass mold comprising a plurality of cavities is placed on the pad structure and within a perimeter formed by the retaining structure. A vacuum device is attached to the chuck plate. The vacuum device is activated such that a vacuum is formed and mechanically attaches the glass mold to the pad structure. The polishing tool comprising the glass mold mechanically attached to the pad structure is placed over and in contact with the polishing pad. The polishing tool comprising the glass mold is rotated. The glass mold is polished as a result of the rotation.

摘要翻译： 玻璃模具抛光结构及方法。 该方法包括提供一种抛光工具，该抛光工具包括安装板，卡盘板，并且机械地连接到安装板上，以及衬垫结构，并且在机械上附接到卡盘板上。 保持结构安装在卡盘板上。 包括多个空腔的玻璃模具被放置在垫结构上并且在由保持结构形成的周边内。 真空装置安装在卡板上。 激活真空装置，使得形成真空并将玻璃模具机械地附接到衬垫结构。 包括机械地附接到垫结构的玻璃模具的抛光工具放置在抛光垫上并与抛光垫接触。 包括玻璃模具的抛光工具旋转。 玻璃模具由于旋转而被抛光。

公开(公告)号：US07064064B2

公开(公告)日：2006-06-20

申请号：US11058783

申请日：2005-02-16

申请人： Shyng-Tsong Chen ,  Timothy J. Dalton ,  Kenneth M. Davis ,  Chao-Kun Hu ,  Fen F. Jamin ,  Steffen K. Kaldor ,  Mahadevaiyer Krishnan ,  Kaushik Kumar ,  Michael F. Lofaro ,  Sandra G. Malhotra ,  Chandrasekhar Narayan ,  David L. Rath ,  Judith M. Rubino ,  Katherine L. Saenger ,  Andrew H. Simon ,  Sean P. E. Smith ,  Wei-tsu Tseng

发明人： Shyng-Tsong Chen ,  Timothy J. Dalton ,  Kenneth M. Davis ,  Chao-Kun Hu ,  Fen F. Jamin ,  Steffen K. Kaldor ,  Mahadevaiyer Krishnan ,  Kaushik Kumar ,  Michael F. Lofaro ,  Sandra G. Malhotra ,  Chandrasekhar Narayan ,  David L. Rath ,  Judith M. Rubino ,  Katherine L. Saenger ,  Andrew H. Simon ,  Sean P. E. Smith ,  Wei-tsu Tseng

IPC分类号： H01L21/44

CPC分类号： H01L21/76849 ,  H01L21/76834 ,  H01L21/76847 ,  H01L21/76883 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated circuit structure is disclosed that has a layer of logical and functional devices and an interconnection layer above the layer of logical and functional devices. The interconnection layer has a substrate, conductive features within the substrate and caps positioned only above the conductive features.

摘要翻译： 公开了一种集成电路结构，其具有逻辑和功能器件层以及逻辑和功能器件层之上的互连层。 互连层具有衬底，衬底内的导电特征和仅位于导电特征之上的盖。

公开(公告)号：US06267659B1

公开(公告)日：2001-07-31

申请号：US09564785

申请日：2000-05-04

申请人： Shyng-Tsong Chen ,  Michael F. Lofaro ,  Woody Ray Smith

发明人： Shyng-Tsong Chen ,  Michael F. Lofaro ,  Woody Ray Smith

IPC分类号： B24D1100

CPC分类号： B24B37/22 ,  B24B37/24 ,  B24B49/08 ,  B24D13/20

摘要： A polishing pad assembly is described for use in a chemical-mechanical polishing apparatus having a polishing platen. The polishing pad assembly includes a first pad disposed on the platen. The first pad comprises a sealable enclosure with a flexible outer skin and partially filled with a porous material. A control is adapted to inject fluid into and to remove fluid from the enclosure. The first pad has a hardness which is variable according to an amount of fluid in the enclosure. A second pad is disposed on the first pad.

摘要翻译： 描述了一种用于具有研磨台板的化学机械抛光装置中的抛光垫组件。 抛光垫组件包括设置在台板上的第一垫。 第一垫包括具有柔性外表皮并部分填充有多孔材料的可密封外壳。 控制器适于将流体注入并从外壳中移除流体。 第一垫具有根据外壳中的流体量可变的硬度。 第二垫设置在第一垫上。

公开(公告)号：US5609517A

公开(公告)日：1997-03-11

申请号：US560721

申请日：1995-11-20

申请人： Michael F. Lofaro

发明人： Michael F. Lofaro

IPC分类号： B24B37/22 ,  B24B37/26 ,  B24D13/14 ,  B24D11/00

CPC分类号： B24B37/22 ,  B24B37/26

摘要： A composite polishing pad is provided, with a supporting layer, nodes attached to the supporting layer, and an upper layer attached to the supporting layer which surrounds but does not cover the nodes. The support layer, nodes, and upper layer may all be of different hardnesses.

摘要翻译： 提供了复合抛光垫，其具有支撑层，附着到支撑层的节点，以及附着到支撑层的上层，其围绕但不覆盖节点。 支撑层，节点和上层都可以具有不同的硬度。

公开(公告)号：US08591289B2

公开(公告)日：2013-11-26

申请号：US13605363

申请日：2012-09-06

申请人： Michael A. Cobb ,  Mahadevaiyer Krishnan ,  Michael F. Lofaro ,  Dennis G. Manzer

发明人： Michael A. Cobb ,  Mahadevaiyer Krishnan ,  Michael F. Lofaro ,  Dennis G. Manzer

IPC分类号： B24B1/00

CPC分类号： B24B37/30 ,  B24B27/0069 ,  B24B27/0076 ,  B24B37/105 ,  B24B37/245 ,  B24B37/345 ,  B24B41/047

摘要： An apparatus for chemical mechanical planarization includes a spindle assembly structure and at least one substrate carrier, which make a linear lateral movement relative to each other while abrasive surfaces of a plurality of cylindrical spindles in the spindle assembly structure contact, and rotate against, at least one substrate mounted on the at least one substrate carrier. The direction of the linear lateral movement is within the plane that tangentially contacts the plurality of cylindrical spindles, and can be orthogonal to the axes of rotation of the plurality of cylindrical spindles.

公开(公告)号：US20130068592A1

公开(公告)日：2013-03-21

申请号：US13605359

申请日：2012-09-06

申请人： Michael F. Lofaro

发明人： Michael F. Lofaro

IPC分类号： H01L21/683 ,  B23Q7/00 ,  H01L21/677

CPC分类号： H01L21/67706 ,  B23Q3/088 ,  H01L21/67173 ,  H01L21/6776 ,  H01L21/68764 ,  H01L21/68771 ,  H01L21/68785

摘要： A multi-generational carrier platform is configured to carry substrate carriers of different sizes depending on processing needs. Multiple carrier adaptors are provided on one side of a support plate, and substrate carriers can be distributed among the carrier adaptors to mount a maximum number of substrates under the constraint of non-overlap of the substrates and the substrate carriers. The multi-generational carrier platform can be configured to provide rotation to each substrate carrier mounted thereupon, and is compatible with chemical mechanical planarization processes that require rotation of substrates against an abrasive surface. The multi-generational carrier platform facilitates maximum utilization of a processing area provided by a tool configured to process substrates of different sizes.

摘要翻译： 多代载体平台被配置为根据加工需要携带不同尺寸的衬底载体。 多个载体适配器设置在支撑板的一侧上，并且衬底载体可以分布在载体适配器之间以在衬底和衬底载体的不重叠的约束下安装最大数量的衬底。 多代载体平台可以被配置为向安装在其上的每个基板载体提供旋转，并且与要求将基板旋转抵靠研磨表面的化学机械平面化工艺兼容。 多代载体平台有助于最大限度地利用由配置成处理不同尺寸的基板的工具提供的处理区域。

公开(公告)号：US20130068588A1

公开(公告)日：2013-03-21

申请号：US13237328

申请日：2011-09-20

申请人： Michael F. Lofaro

发明人： Michael F. Lofaro

IPC分类号： B65G35/06 ,  B23Q7/00 ,  B25B11/00 ,  B65G49/00 ,  B23Q3/00

CPC分类号： H01L21/67706 ,  B23Q3/088 ,  H01L21/67173 ,  H01L21/6776 ,  H01L21/68764 ,  H01L21/68771 ,  H01L21/68785

摘要： A multi-generational carrier platform is configured to carry substrate carriers of different sizes depending on processing needs. Multiple carrier adaptors are provided on one side of a support plate, and substrate carriers can be distributed among the carrier adaptors to mount a maximum number of substrates under the constraint of non-overlap of the substrates and the substrate carriers. The multi-generational carrier platform can be configured to provide rotation to each substrate carrier mounted thereupon, and is compatible with chemical mechanical planarization processes that require rotation of substrates against an abrasive surface. The multi-generational carrier platform facilitates maximum utilization of a processing area provided by a tool configured to process substrates of different sizes.

公开(公告)号：US20120276688A1

公开(公告)日：2012-11-01

申请号：US13546684

申请日：2012-07-11

申请人： Matthew J. Breitwisch ,  Chieh-Fang Chen ,  Shih-Hung Chen ,  Eric A. Joseph ,  Chung Hon Lam ,  Michael F. Lofaro ,  Hsiang-Lan Lung ,  Alejandro G. Schrott ,  Min Yang

发明人： Matthew J. Breitwisch ,  Chieh-Fang Chen ,  Shih-Hung Chen ,  Eric A. Joseph ,  Chung Hon Lam ,  Michael F. Lofaro ,  Hsiang-Lan Lung ,  Alejandro G. Schrott ,  Min Yang

IPC分类号： H01L21/06

CPC分类号： H01L45/06 ,  H01L45/144 ,  H01L45/1608 ,  H01L45/1683

摘要： A method of forming bit line aligned to a phase change material that includes forming a pedestal of a sacrificial material on a portion of a lower electrode and forming at least one dielectric material adjacent to the sacrificial material, wherein the at least one dielectric material has an upper surface substantially coplanar with an upper surface of the pedestal of the sacrificial material. The pedestal of the sacrificial material is removed selective to the at least one dielectric material and the lower electrode to provide an opening to an exposed surface of the lower electrode. A phase change material is formed on the exposed surface of the lower electrode, and the opening is filled with a conductive fill material. A self-aligned etch back process is also provided.

摘要翻译： 一种形成与相变材料对准的位线的方法，包括在下电极的一部分上形成牺牲材料的基座并且形成与所述牺牲材料相邻的至少一个电介质材料，其中所述至少一种电介质材料具有 上表面与牺牲材料的基座的上表面基本共面。 牺牲材料的基座被选择性地移除到至少一个电介质材料和下电极以提供到下电极的暴露表面的开口。 在下电极的暴露表面上形成相变材料，并且用导电填充材料填充开口。 还提供了自对准的回蚀工艺。