公开(公告)号：US20090236637A1

公开(公告)日：2009-09-24

申请号：US12052735

申请日：2008-03-21

Applicant: Ching-Chung Ko ,  Tao Cheng ,  Tien-Yueh Liu ,  Dar-Shii Chou ,  Peng-Cheng Kao

Inventor： Ching-Chung Ko ,  Tao Cheng ,  Tien-Yueh Liu ,  Dar-Shii Chou ,  Peng-Cheng Kao

IPC: H01L27/10

CPC classification number: H01L23/5286 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated circuit chip with reduced IR drop and improved chip performance is disclosed. The integrated circuit chip includes a semiconductor substrate having thereon a plurality of inter-metal dielectric (IMD) layers and a plurality of copper metal layers embedded in respective the plurality of IMD layers; a first passivation layer overlying the plurality of IMD layers and the plurality of copper metal layers; a first power/ground ring of a circuit block of the integrated circuit chip formed in a topmost layer of the plurality of copper metal layers; a second power/ground ring of the circuit block of the integrated circuit chip formed in an aluminum layer over the first passivation layer; and a second passivation layer covering the second power/ground ring and the first passivation layer.

Abstract translation: 公开了具有降低的IR降低和芯片性能改善的集成电路芯片。 集成电路芯片包括其上具有多个金属间电介质（IMD）层和嵌入在多个IMD层中的多个铜金属层的半导体衬底; 覆盖所述多个IMD层和所述多个铜金属层的第一钝化层; 所述集成电路芯片的电路块的第一电源/接地环形成在所述多个铜金属层的最上层中; 所述集成电路芯片的电路块的第二电源/接地环形成在所述第一钝化层上的铝层中; 以及覆盖所述第二电源/接地环和所述第一钝化层的第二钝化层。

公开(公告)号：US20090137590A1

公开(公告)日：2009-05-28

申请号：US12171209

申请日：2008-07-10

Applicant: Jingyuan Ma ,  Christopher J. Rabbat ,  Jiangao Song ,  Xin Chen ,  Imad Nashashibi ,  Zuchun Zhao ,  Aaron Novack ,  Dong Fang Shi ,  Peng Cheng ,  Yan Zhu ,  Alison Murphy

Inventor： Jingyuan Ma ,  Christopher J. Rabbat ,  Jiangao Song ,  Xin Chen ,  Imad Nashashibi ,  Zuchun Zhao ,  Aaron Novack ,  Dong Fang Shi ,  Peng Cheng ,  Yan Zhu ,  Alison Murphy

IPC: A61K31/5377 ,  C07D401/04 ,  A61K31/454 ,  A61K31/506 ,  C12N5/06 ,  C07D401/14 ,  C07D413/14

CPC classification number: C07D401/04 ,  C07D401/14 ,  C07D413/14 ,  C07D417/14

Abstract: Compounds and methods are provided for the treatment of, inter alia, Type II diabetes and other diseases associated with poor glycemic control.

Abstract translation: 提供了化合物和方法用于治疗特别是II型糖尿病和与血糖控制不良相关的其它疾病。

公开(公告)号：US20080108630A1

公开(公告)日：2008-05-08

申请号：US11932755

申请日：2007-10-31

Applicant: Yan Zhu ,  Jingyuan Ma ,  Peng Cheng ,  Zuchun Zhao ,  Francine Gregoire ,  Vera Rakhmanova

Inventor： Yan Zhu ,  Jingyuan Ma ,  Peng Cheng ,  Zuchun Zhao ,  Francine Gregoire ,  Vera Rakhmanova

IPC: A61K31/497 ,  A61P3/06 ,  A61P3/10 ,  A61K31/4192 ,  C07D403/06 ,  C07D249/04

CPC classification number: C07D249/06 ,  C07D409/10

Abstract: The present invention is directed to certain novel triazole compounds represented by Formula I and pharmaceutically acceptable salts, solvates, hydrates, and prodrugs thereof. The present invention is also directed to methods of making and using such compounds and pharmaceutical compositions containing such compounds to treat or control a number of diseases mediated by PPAR such as glucose metabolism, lipid metabolism and insulin secretion, specifically Type 2 diabetes, hyperinsulemia, hyperlipidemia, hyperuricemia, hypercholesteremia, atherosclerosis, one or more risk factors for cardiovascular disease, Syndrome X, hypertriglyceridemia, hyperglycemia, obesity, and eating disorders.

Abstract translation: 本发明涉及由式I表示的某些新颖的三唑化合物及其药学上可接受的盐，溶剂合物，水合物和前药。 本发明还涉及制备和使用这些化合物和含有这些化合物的药物组合物的方法，以治疗或控制PPAR介导的许多疾病，例如葡萄糖代谢，脂质代谢和胰岛素分泌，特别是2型糖尿病，高胰岛素血症，高脂血症 高尿酸血症，高胆固醇血症，动脉粥样硬化，心血管疾病的一个或多个危险因素，X综合征，高甘油三酯血症，高血糖症，肥胖症和进食障碍。

公开(公告)号：US07358580B2

公开(公告)日：2008-04-15

申请号：US11241024

申请日：2005-09-30

Applicant: Qing Ma ,  Peng Cheng

Inventor： Qing Ma ,  Peng Cheng

IPC: H01L27/14 ,  H01L29/82 ,  H01L29/84 ,  B81B3/00

CPC classification number: B81C1/00126 ,  B81C2201/0109 ,  H03H3/0072

Abstract: A method comprising over an area of a substrate, forming a plurality of three dimensional first structures; following forming the first structures, conformally introducing a sacrificial material over the area of the substrate; introducing a second structural material over the sacrificial material; and removing the sacrificial material. An apparatus comprising a first structure on a substrate; and a second structure on the substrate and separated from the first structure by an unfilled gap defined by the thickness of a removed film.

Abstract translation: 一种方法，包括在衬底的一个区域上，形成多个三维第一结构; 在形成第一结构之后，在衬底的区域上保形地引入牺牲材料; 在牺牲材料上引入第二结构材料; 并去除牺牲材料。 一种装置，包括在基板上的第一结构; 以及第二结构，并且通过由去除膜的厚度限定的未填充间隙与第一结构分离。

公开(公告)号：US07291561B2

公开(公告)日：2007-11-06

申请号：US10623965

申请日：2003-07-21

Applicant: Qing Ma ,  Peng Cheng ,  Valluri Rao

Inventor： Qing Ma ,  Peng Cheng ,  Valluri Rao

IPC: H01L21/461 ,  H01L21/311 ,  H01L29/00 ,  H01L27/108

CPC classification number: B81C1/00333 ,  H01G5/16 ,  H01G5/40 ,  H01L2224/48091 ,  Y10T428/24248 ,  H01L2924/00014

Abstract: The present invention relates to a chip package that includes a semiconductor device and at least one micro electromechanical structure (MEMS) such that the semiconductor device and the MEMS form an integrated package. One embodiment of the present invention includes a semiconductor device, a first MEMS device disposed in a conveyance such as a film, and a second MEMS device disposed upon the semiconductor device through a via in the conveyance.The present invention also relates to a process of forming a chip package that includes providing a conveyance such as a tape automated bonding (TAB) structure, that may hold at least one MEMS device. The method is further carried out by disposing the conveyance over the active surface of the device in a manner that causes the at least one MEMS to communicate electrically to the active surface. Where appropriate, a sealing structure such as a solder ring may be used to protect the MEMS.

Abstract translation: 本发明涉及包括半导体器件和至少一个微机电结构（MEMS）的芯片封装，使得半导体器件和MEMS形成集成封装。 本发明的一个实施例包括半导体器件，设置在诸如膜的输送器中的第一MEMS器件，以及通过输送中的通孔设置在半导体器件上的第二MEMS器件。 本发明还涉及一种形成芯片封装的方法，其包括提供诸如胶带自动键合（TAB）结构的输送，其可以保持至少一个MEMS器件。 该方法进一步通过以使得至少一个MEMS与活性表面电连通的方式布置在器件的有效表面上的输送来进行。 在适当的情况下，可以使用诸如焊环的密封结构来保护MEMS。

公开(公告)号：US20070171299A1

公开(公告)日：2007-07-26

申请号：US11339448

申请日：2006-01-26

Applicant: Peng-Cheng Lai

Inventor： Peng-Cheng Lai

IPC: H04N5/225

CPC classification number: H04N5/232 ,  H04N1/00249 ,  H04N1/00827 ,  H04N1/19594 ,  H04N5/2251 ,  H04N2201/0432 ,  H04N2201/0448

Abstract: The present invention discloses an automatic linear-motion and tilt-angle control apparatus for an image-capture device inside a photography light box, which includes: a photography light box, a linear-motion module, a rotation module, and a fixing seat. The linear-motion module further includes: servo motors, ball screws, linear sliding rails and a sliding table to implement the horizontal and vertical motions of an image-capture device inside the photography light box. The rotation module includes: stepping motors, worm gears, and worm wheels to rotate the image-capture device when the linear-motion module moves the image-capture device horizontally, and tilts the image-capture device when the linear-motion module moves the image-capture device vertically to an appropriate height so that the image-capture device can be aimed at the object. The fixing seat is used to fix the image-capture device and disposed on a rotation table in an emptied hole.

Abstract translation: 本发明公开了一种用于摄影灯箱内部的图像捕获装置的自动线性运动和倾斜角度控制装置，其包括：摄影灯箱，直线运动模块，旋转模块和固定座。 线性运动模块还包括：伺服电机，滚珠丝杠，线性滑轨和滑动台，用于实现摄影灯箱内的图像捕获装置的水平和垂直运动。 旋转模块包括：当直线运动模块水平移动图像捕获装置时，步进电机，蜗轮和蜗轮旋转图像捕获装置，并且当线性运动模块移动时倾斜图像捕获装置 图像捕获设备垂直到适当的高度，使得图像捕获设备可以瞄准对象。 固定座用于固定图像捕获装置，并设置在空的孔中的旋转台上。

公开(公告)号：US20060061665A1

公开(公告)日：2006-03-23

申请号：US11200080

申请日：2005-08-10

Applicant: Peng-Cheng Lai

Inventor： Peng-Cheng Lai

IPC: H04N5/225

CPC classification number: H04N1/00204 ,  G03B15/00 ,  H04N1/00413 ,  H04N1/00482 ,  H04N5/23203 ,  H04N2101/00 ,  H04N2201/0075 ,  H04N2201/0084

Abstract: A method of remote capture with user interface providing separate inside- and outside-light-box modes is provided, wherein when the user selects the inside-light-box mode together with an automatic mode to take a photograph, it is the photographic parameters, which are obtained experimentally for various cameras under given light sources, but not the photographic parameters, which are automatically generated by the light sensor of the camera, that are utilized to control the camera. Via the inside-light-box mode together with the automatic mode, an image in good qualities is acquired.

Abstract translation: 提供了一种利用用户界面进行远程捕获的方法，提供单独的内部和外部光盒模式，其中当用户选择内部灯箱模式以及拍摄照片的自动模式时，它是摄影参数， 它们是在给定光源下的各种相机实验获得的，但不是摄影参数，这些参数由相机的光传感器自动产生，用于控制相机。 通过内部灯箱模式与自动模式一起，获取质量好的图像。

公开(公告)号：US07002436B2

公开(公告)日：2006-02-21

申请号：US10921383

申请日：2004-08-19

Applicant: Qing Ma ,  Peng Cheng ,  Valluri Rao

Inventor： Qing Ma ,  Peng Cheng ,  Valluri Rao

IPC: H03H9/10 ,  H03H9/24 ,  H03H9/46

CPC classification number: B81B7/0077 ,  H03H3/0072 ,  H03H9/1057 ,  H03H9/2405 ,  H03H9/2431 ,  H03H9/2457 ,  H03H9/2463 ,  H03H2009/02503 ,  H03H2009/02511

Abstract: A microelectromechanical (MEMS) resonator with a vacuum-cavity is fabricated using polysilicon-enabled release methods. A vacuum-cavity surrounding the MEMS beam is formed by removing release material that surrounds the beam and sealing the resulting cavity under vacuum by depositing a layer of nitride over the structure. The vacuum-cavity MEMS resonators have cantilever beams, bridge beams or breathing-bar beams.

公开(公告)号：US06890829B2

公开(公告)日：2005-05-10

申请号：US10246360

申请日：2002-09-17

Applicant: Peng Cheng ,  Qing Ma

Inventor： Peng Cheng ,  Qing Ma

IPC: H01L23/522 ,  H01L27/08 ,  H01L21/20

CPC classification number: H01L23/5227 ,  H01L24/19 ,  H01L27/08 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/00

Abstract: The invention relates to a process of forming an on-chip package inductor. The process includes providing a substrate with at least one microelectronic device packaged therewith. As part of the inventive process, electrical communication is formed for the microelectronic device. The electrical communication includes at least two electrically conductive layers. As part of the inventive technology, the inductor is patterned on the substrate before, during, or after formation of the electrical communication. The inductor is connected to the at least one microelectronic device.

Abstract translation: 本发明涉及一种形成片上封装电感器的工艺。 该方法包括提供具有与其一起封装的至少一个微电子器件的衬底。 作为本发明方法的一部分，为微电子器件形成电通信。 电通信包括至少两个导电层。 作为本发明技术的一部分，电感器在形成电通信之前，期间或之后在衬底上图案化。 电感器连接到至少一个微电子器件。

公开(公告)号：US20050087820A1

公开(公告)日：2005-04-28

申请号：US10646034

申请日：2003-08-22

Applicant: Gang Bai ,  David Fraser ,  Brian Doyle ,  Peng Cheng ,  Chunlin Liang

Inventor： Gang Bai ,  David Fraser ,  Brian Doyle ,  Peng Cheng ,  Chunlin Liang

IPC: H01L21/28 ,  H01L29/51 ,  H01L21/8238 ,  H01L29/76

CPC classification number: H01L29/513 ,  H01L21/28185 ,  H01L21/28194 ,  H01L21/28211 ,  H01L21/28229 ,  H01L29/517

Abstract: A method of forming a dielectric layer suitable for use as the gate dielectric layer of a metal-oxide-semiconductor field effect transistor (MOSFET) includes oxidizing the surface of a silicon substrate, forming a metal layer over the oxidized surface, and reacting the metal with the oxidized surface to form a substantially intrinsic layer of silicon superjacent the substrate, wherein at least a portion of the silicon layer may be an epitaxial silicon layer, and a metal oxide layer superjacent the silicon layer. In a further aspect of the present invention, an integrated circuit includes a plurality of MOSFETs, wherein various ones of the plurality of transistors have metal oxide gate dielectric layers and substantially intrinsic silicon layers subjacent the metal oxide dielectric layers.

Abstract translation: 形成适合用作金属氧化物半导体场效应晶体管（MOSFET）的栅极电介质层的电介质层的方法包括氧化硅衬底的表面，在氧化表面上形成金属层，并使金属 与氧化表面形成超过衬底的基本上本征的硅层，其中硅层的至少一部分可以是外延硅层，以及位于硅层之上的金属氧化物层。 在本发明的另一方面，集成电路包括多个MOSFET，其中多个晶体管中的各个晶体管具有金属氧化物栅极电介质层和位于金属氧化物电介质层之下的基本上本征的硅层。