公开(公告)号：US20140054787A1

公开(公告)日：2014-02-27

申请号：US13973627

申请日：2013-08-22

Applicant: Dongseog EUN ,  Young-Ho LEE ,  Joonhee LEE ,  Seok-won LEE ,  Yoocheol SHIN

Inventor： Dongseog EUN ,  Young-Ho LEE ,  Joonhee LEE ,  Seok-won LEE ,  Yoocheol SHIN

IPC: H01L23/498

CPC classification number: H01L23/498 ,  H01L21/31144 ,  H01L21/32139 ,  H01L21/441 ,  H01L21/76805 ,  H01L21/76877 ,  H01L23/49844 ,  H01L23/5226 ,  H01L27/11548 ,  H01L27/11551 ,  H01L27/1157 ,  H01L27/11575 ,  H01L27/11578 ,  H01L27/11582 ,  H01L27/2481 ,  H01L2924/0002 ,  H01L2924/0001 ,  H01L2924/00

Abstract: Provided are methods of forming a stack of electrodes and three-dimensional semiconductor devices fabricated thereby. The device may include electrodes sequentially stacked on a substrate to constitute an electrode structure. each of the electrodes may include a connection portion protruding horizontally and outward from a sidewall of one of the electrodes located thereon and an aligned portion having a sidewall coplanar with that of one of the electrodes located thereon or thereunder. Here, at least two of the electrodes provided vertically adjacent to each other may be provided in such a way that the aligned portions thereof have sidewalls that are substantially aligned to be coplanar with each other.

Abstract translation: 提供了形成由此制造的电极堆叠和三维半导体器件的方法。 该装置可以包括依次层叠在基板上以构成电极结构的电极。 每个电极可以包括从位于其上的一个电极的侧壁水平和向外突出的连接部分和具有与位于其上的电极之一的侧壁共面的对准部分。 这里，彼此垂直相邻设置的电极中的至少两个可以以这样的方式设置，使得其对准的部分具有基本上对准以彼此共面的侧壁。

公开(公告)号：US20130173059A1

公开(公告)日：2013-07-04

申请号：US13527160

申请日：2012-06-19

Applicant: Seok Won Lee ,  Woo Sung Yang

Inventor： Seok Won Lee ,  Woo Sung Yang

IPC: G05B15/00

CPC classification number: B25J9/1633 ,  G05B2219/40305

Abstract: A system for controlling driving of a wearable robot may include a drive unit for operating a drive joint of the robot, a measurement unit for measuring an actual angle and an actual angular velocity of the drive joint in the robot, a sensing unit for determining a human torque applied by a wearing user to the drive joint, and a control unit for determining a target angular velocity of the robot by applying the determined human torque to an admittance model and for determining a required torque that may be input to the drive unit of the robot by applying an optimal control gain to a difference between the target angular velocity and the actual angular velocity of the robot.

Abstract translation: 用于控制可穿戴机器人的驱动的系统可以包括用于操作机器人的驱动接头的驱动单元，用于测量机器人中的驱动接头的实际角度和实际角速度的测量单元，用于确定 佩戴用户对驱动关节施加的人力矩;以及控制单元，用于通过将确定的人力矩施加到导纳模型来确定机器人的目标角速度，并且用于确定可以输入到驱动单元的驱动单元的所需扭矩 机器人通过对目标角速度和机器人的实际角速度之间的差施加最佳控制增益。

公开(公告)号：US20120007165A1

公开(公告)日：2012-01-12

申请号：US13181281

申请日：2011-07-12

Applicant: Myoung-Bum LEE ,  Jae-Hwang SIM ,  In-Sun PARK ,  Jin-Gi HONG ,  Ju-Seon GOO ,  Seung-Bae PARK ,  Seung-Yup LEE ,  Du-Heon SONG ,  Jeong-Dong CHOE ,  Seok-Won LEE

Inventor： Myoung-Bum LEE ,  Jae-Hwang SIM ,  In-Sun PARK ,  Jin-Gi HONG ,  Ju-Seon GOO ,  Seung-Bae PARK ,  Seung-Yup LEE ,  Du-Heon SONG ,  Jeong-Dong CHOE ,  Seok-Won LEE

IPC: H01L29/788 ,  H01L27/088

CPC classification number: H01L29/7881 ,  H01L21/764 ,  H01L27/11519 ,  H01L27/11526 ,  H01L27/11529 ,  H01L27/11565 ,  H01L27/11573 ,  H01L29/40114 ,  H01L29/40117 ,  H01L29/42324 ,  H01L29/4234 ,  H01L29/66825 ,  H01L29/66833 ,  H01L29/792

Abstract: A semiconductor device includes a substrate, a plurality of gate structures, a first insulating interlayer pattern, and a second insulation layer pattern. The substrate has an active region and a field region, each of the active region and the field region extends in a first direction, and the active region and the field region are alternately and repeatedly arranged in a second direction substantially perpendicular to the first direction. The gate structures are spaced apart from each other in the first direction, each of the gate structures extends in the second direction. The first insulation layer pattern is formed on a portion of a sidewall of each gate structure. The second insulation layer pattern covers the gate structures and the first insulation layer pattern, and has an air tunnel between the gate structures, the air tunnel extending in the second direction.

Abstract translation: 半导体器件包括衬底，多个栅极结构，第一绝缘层间图案和第二绝缘层图案。 基板具有有源区域和场区域，有源区域和场区域中的每一个沿着第一方向延伸，并且有源区域和场区域在基本上垂直于第一方向的第二方向上交替地和重复地布置。 栅极结构在第一方向上彼此间隔开，每个栅极结构沿第二方向延伸。 第一绝缘层图案形成在每个栅极结构的侧壁的一部分上。 第二绝缘层图案覆盖栅极结构和第一绝缘层图案，并且在栅极结构之间具有沿第二方向延伸的空气通道的空气通道。

公开(公告)号：US20110270530A1

公开(公告)日：2011-11-03

申请号：US13124121

申请日：2009-12-08

Applicant: Seok-Won Lee

Inventor： Seok-Won Lee

IPC: G06F19/00

CPC classification number: G01N33/74 ,  G01N2333/575 ,  G01N2800/12 ,  G01N2800/347

Abstract: The present invention relates to methods for the diagnosis and evaluation of BNP-related diseases. In particular, patient test samples are analyzed for the presence and amount of a plurality of natriuretic peptides, and a combined natriuretic peptide result is used as a diagnostic marker.

Abstract translation: 本发明涉及用于诊断和评估BNP相关疾病的方法。 特别地，对多个利尿钠肽的存在和量的患者测试样品进行分析，并且使用组合的利钠肽结果作为诊断标记。

公开(公告)号：US20110057297A1

公开(公告)日：2011-03-10

申请号：US12875382

申请日：2010-09-03

Applicant: Jung-Do Lee ,  Jongkook Kim ,  Seok Won Lee ,  Jaesik Lee ,  Hohyeuk Im ,  Su-min Park

Inventor： Jung-Do Lee ,  Jongkook Kim ,  Seok Won Lee ,  Jaesik Lee ,  Hohyeuk Im ,  Su-min Park

IPC: H01L23/544

CPC classification number: H01L21/78 ,  H01L23/562 ,  H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided is a semiconductor chip. The semiconductor chip includes a semiconductor substrate including a main chip region and a scribe lane region surrounding the main chip region. An insulating layer is disposed over the semiconductor substrate. A guard ring is disposed in the insulating layer in the scribe lane region. The guard ring surrounds at least a portion of the main chip region. The guard ring has a brittleness greater than a brittleness of the insulating layer.

Abstract translation: 提供了一种半导体芯片。 半导体芯片包括包括主芯片区域和围绕主芯片区域的划线通道区域的半导体衬底。 绝缘层设置在半导体衬底上。 保护环设置在划线区域的绝缘层中。 防护环围绕主芯片区域的至少一部分。 保护环的脆性大于绝缘层的脆性。

公开(公告)号：US20090228253A1

公开(公告)日：2009-09-10

申请号：US12351808

申请日：2009-01-09

Applicant: William J. Tolone ,  Elwood Wray Johnson ,  Kyle Joseph Thieman ,  David Wilson ,  Marc Thomas Calello ,  Wei-ning Xiang ,  Andrew Marcellus Stogner ,  Seok-Won Lee ,  Michael Russel

Inventor： William J. Tolone ,  Elwood Wray Johnson ,  Kyle Joseph Thieman ,  David Wilson ,  Marc Thomas Calello ,  Wei-ning Xiang ,  Andrew Marcellus Stogner ,  Seok-Won Lee ,  Michael Russel

IPC: G06G7/48

CPC classification number: G06Q10/10 ,  G06Q10/06

Abstract: A system for simulating interdependencies between multiple critical physical infrastructure models includes a first infrastructure data model that models a first physical infrastructure; a second infrastructure data model that models a second physical infrastructure, wherein the second physical infrastructure is a different physical infrastructure from the first physical infrastructure; a simulation engine adapted to automatically produce a change in the second infrastructure data model in response to a change in the first infrastructure data model; a user interface permitting a user to interact with the simulation engine; wherein the user interface and the simulation engine are configured such that the user can disable an element of the first physical infrastructure, and subsequently re-enable the element of the first physical infrastructure; wherein the first infrastructure data model comprises a transport network; and wherein the second infrastructure data model comprises a channel network.

Abstract translation: 用于模拟多个关键物理基础设施模型之间的相互依赖性的系统包括对第一物理基础设施建模的第一基础设施数据模型; 第二基础设施数据模型，其建模第二物理基础设施，其中所述第二物理基础设施是与所述第一物理基础设施不同的物理基础设施; 适于响应于第一基础设施数据模型的变化而自动产生第二基础设施数据模型的变化的模拟引擎; 允许用户与模拟引擎交互的用户界面; 其中所述用户界面和所述模拟引擎被配置为使得所述用户可以禁用所述第一物理基础设施的元素，并且随后重新启用所述第一物理基础设施的元素; 其中所述第一基础设施数据模型包括传输网络; 并且其中所述第二基础设施数据模型包括信道网络。

公开(公告)号：US20070164402A1

公开(公告)日：2007-07-19

申请号：US11332891

申请日：2006-01-17

Applicant: Dae-Hoon Jung ,  Seok-Won Lee ,  Sang-Bae Park

Inventor： Dae-Hoon Jung ,  Seok-Won Lee ,  Sang-Bae Park

IPC: H01L23/495

CPC classification number: H01L23/3107 ,  G01L19/141 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package mainly includes a leadframe and a first semiconductor chip such as an application specific integrated circuit (ASIC) encapsulated in a first package body having a cavity for receiving a second semiconductor chip such as a pressure sensor chip, and a cover disposed over the cavity of the first package body. At least a portion of the first package body is formed between the second semiconductor chip and the die pad such that the second semiconductor chip is directly disposed on the portion of the first package body instead of the die pad.

公开(公告)号：US20060232996A1

公开(公告)日：2006-10-19

申请号：US11452006

申请日：2006-06-13

Applicant: Dong-Hoon Kim ,  Jong-Dae Park ,  Kyu-Seok Kim ,  Jeong-Hwan Lee ,  Jae-Ho Jung ,  Byung-Woong Han ,  Min-Gyu Kim ,  Hyoung-Joo Kim ,  Tae-Jin Lee ,  Seok-Won Lee ,  Sang-Hoon Lee

Inventor： Dong-Hoon Kim ,  Jong-Dae Park ,  Kyu-Seok Kim ,  Jeong-Hwan Lee ,  Jae-Ho Jung ,  Byung-Woong Han ,  Min-Gyu Kim ,  Hyoung-Joo Kim ,  Tae-Jin Lee ,  Seok-Won Lee ,  Sang-Hoon Lee

IPC: F21V7/04

CPC classification number: G02B6/0021 ,  G02B6/0031 ,  G02B6/0068

Abstract: A light guide plate includes a first surface having a light incident surface and a light reflect surface, a second surface facing the first surface, through which the reflected light exits, a first edge surface connected between edges of the light reflect surface and the second surface, and a second edge surface connected between edges of the light incident surface and the second surface, being opposite to the first edge surface. A light source is disposed on the light incident surface. A light guide plate may also include a stepped edge portion formed at a marginal area of the light guide plate on which a light source is combined. The stepped edge portion includes a light incident surface, a light reflect surface, an upper surface through which the reflected light exits the light guide plate, and a first edge surface connected between edges of the light reflect surface and the upper surface, being opposite to the stepped edge portion. A backlight assembly includes the light guide plate, a lamp unit including lamps and a lamp reflector that are disposed on the light incident surface, and a mold frame for receiving the stepped edge portion and the lamp unit.

Abstract translation: 导光板包括具有光入射表面和光反射表面的第一表面，面对第一表面的第二表面，反射光通过该第一表面，连接在光反射表面的边缘和第二表面之间的第一边缘表面 以及连接在所述光入射表面和所述第二表面的边缘之间的与所述第一边缘表面相对的第二边缘表面。 光源设置在光入射面上。 导光板还可以包括形成在其上组合有光源的导光板的边缘区域处的阶梯状边缘部分。 台阶边缘部分包括光入射表面，光反射表面，反射光离开导光板的上表面，以及连接在光反射表面和上表面的边缘之间的第一边缘表面，与第 台阶边缘部分。 背光组件包括导光板，包括灯的灯单元和设置在光入射表面上的灯反射器，以及用于接收台阶边缘部分和灯单元的模架。

公开(公告)号：US07086761B2

公开(公告)日：2006-08-08

申请号：US10512112

申请日：2003-02-10

Applicant: Yong-Gwang Won ,  Jong-Dae Park ,  Seok-Won Lee

Inventor： Yong-Gwang Won ,  Jong-Dae Park ,  Seok-Won Lee

IPC: F21V29/00

CPC classification number: G02B6/0031 ,  F21V7/22 ,  F21V29/89 ,  G02B6/0068 ,  G02B6/0071 ,  G02B6/0085 ,  G02B6/009 ,  G02F1/133385 ,  G02F1/133615

Abstract: There are provided a backlight assembly (200) and an LCD apparatus (110) having the same. A lamp unit (210, 220) is received in a first receiving container (300) having a first bottom surface (350) and a first sidewall (310) so that the lamp unit (210) faces the first sidewall. The lamp unit (210, 220) and the first receiving container (300) are received in a second receiving container (500) having a second bottom surface (550) and a second sidewall (510). A heat transfer member (261, 263) comprised of metal material having superior heat conductivity makes contact with the second receiving container (500) through the lamp unit (210, 220). The heat emitted from the lamp unit (210, 263) and discharged to exterior. Accordingly, the backlight assembly and the LCD apparatus may improve display characteristics thereof.

Abstract translation: 提供了具有该组件的背光组件（200）和LCD装置（110）。 灯单元（210,220）被容纳在具有第一底表面（350）和第一侧壁（310）的第一接收容器（300）中，使得灯单元（210）面向第一侧壁。 灯单元（210,220）和第一接收容器（300）被容纳在具有第二底面（550）和第二侧壁（510）的第二容纳容器（500）中。 由具有优异导热性的金属材料构成的传热构件（261,263）通过灯单元（210,220）与第二接收容器（500）接触。 从灯单元（210,263）发射的热量并排放到外部。 因此，背光组件和LCD装置可以改善其显示特性。

公开(公告)号：US20050259191A1

公开(公告)日：2005-11-24

申请号：US10850602

申请日：2004-05-20

Applicant: Jong-Dae Park ,  Seok-Won Lee ,  Tae-Jin Lee

Inventor： Jong-Dae Park ,  Seok-Won Lee ,  Tae-Jin Lee

IPC: G02F1/13 ,  G02F1/1333 ,  G09G3/36

CPC classification number: G02F1/133308 ,  G02F2001/133311 ,  G02F2001/133317 ,  G02F2201/465

Abstract: A supporting unit includes a first support frame, a second support frame and an impurity barrier. The first support frame supports an LCD panel, and includes an opening through which a light is supplied to the LCD panel. The second support frame is protruded from sides of the first support frame to surround sides of the LCD panel. The impurity barrier is disposed on a surface of the first support frame corresponding to the liquid crystal display panel to prevent an inflow of impurities into a space between the first support frame and the liquid crystal display panel. Therefore, the supporting unit for the LCD panel includes the impurity barrier to prevent the inflow of the impurities that is externally provided into the space between the supporting unit and the LCD panel, thereby improving image display quality.

Abstract translation: 支撑单元包括第一支撑框架，第二支撑框架和杂质屏障。 第一支撑框架支撑LCD面板，并且包括一个开口，通过该开口将光提供给LCD面板。 第二支撑框架从第一支撑框架的侧面突出以围绕LCD面板的侧面。 杂质阻挡层设置在与液晶显示面板对应的第一支撑框架的表面上，以防止杂质流入第一支撑框架和液晶显示面板之间的空间。 因此，用于LCD面板的支撑单元包括杂质阻挡层，以防止外部设置在支撑单元和LCD面板之间的空间中的杂质的流入，从而提高图像显示质量。